Home - Premium Low DK 2.17-2.9 Substrates

Premium Low DK 2.17-2.9 Substrates

 

 

The selection of materials with different Dk values plays a crucial role in high-frequency applications. Insertion loss, a key factor in these applications, encompasses four components: conductor loss, dielectric loss, leakage loss, and radiation loss. Conductor loss is influenced by surface roughness, while dielectric loss is determined by the dissipation factor of the circuit material. Leakage loss is typically not a concern for high-frequency circuit materials due to their high volume resistivity. On the other hand, radiation loss, the amount of energy radiated off the circuit, is generally undesirable as it increases signal loss and can interfere with neighboring circuitry. Factors such as circuit design, substrate thickness, PCB fabrication anomalies, substrate Dk, and frequency impact radiation loss. High-frequency circuits using materials with lower Dk values tend to exhibit increased radiation loss, whereas those with higher Dk values experience reduced radiation loss. Additionally, Dk influences circuit size, with lower Dk materials corresponding to longer wavelengths. Coupled features in RF engineering, connected by electric fringing fields, are critical for various RF applications, and the strength and intensity of these coupled fields vary with Dk dependency. Considering these aspects, the choice of materials with different Dk values becomes essential to optimize performance and meet specific requirements in high-frequency applications.

 

 

Item Designator DK
  1. 1
箭头 F4BM217 Copper Clad Laminates 2.17
  1. 2
箭头 F4BME217 Copper Clad Laminates 2.17
3 箭头 F4BM220 Copper Clad Laminates 2.2
4 箭头 F4BME220 Copper Clad Laminates 2.2
5 箭头 F4BM233 Copper Clad Laminates 2.33
6 箭头 F4BME233 Copper Clad Laminates 2.33
7 箭头 F4BTMS233 Copper Clad Laminates 2.33
  1. 8
箭头 RT/duroid 5870 Copper Clad Laminates 2.33
  1. 9
箭头 RT/duroid 5880 Copper Clad Laminates 2.2
10 箭头 F4BM245 Copper Clad Laminates 2.45
11 箭头 F4BME245 Copper Clad Laminates 2.45
12 箭头 F4BM255 Copper Clad Laminates 2.55
13 箭头 F4BME255 Copper Clad Laminates 2.55
14 箭头 F4BTMS265 Copper Clad Laminates 2.65
15 箭头 F4BM265 Copper Clad Laminates 2.65
16 箭头 F4BME265 Copper Clad Laminates 2.65
17 箭头 F4BM275 Copper Clad Laminates 2.75
18 箭头 F4BME275 Copper Clad Laminates 2.75
  1. 19
箭头 TLX-0 Copper Clad Laminates 2.45
  1. 20
箭头 TLX-9 Copper Clad Laminates 2.5
  1. 21
箭头 TLX-8 Copper Clad Laminates 2.55
  1. 22
箭头 TLX-7 Copper Clad Laminates 2.6
  1. 23
箭头 TLX-6 Copper Clad Laminates 2.6
  1. 24
箭头 TLY-5 Copper Clad Laminates 2.2
  1. 25
箭头 TLY-3 Copper Clad Laminates 2.33
  1. 26
箭头 RT/duroid 6002 Copper Clad Laminates 2.94
  1. 27
箭头 RT/duroid 5880LZ Copper Clad Laminates 2
  1. 28
箭头 TLY-5Z Copper Clad Laminates 2.2
  1. 29
箭头 AD255C Copper Clad Laminates 2.55
  1. 30
箭头 IsoClad 933 Copper Clad Laminates 2.33
  1. 31
箭头 DiClad 880 Copper Clad Laminates 2.2
  1. 32
箭头 IsoClad 917 Copper Clad Laminates 2.2
33 箭头 F4BTMS220 Copper Clad Laminates 2.2
  1. 34
箭头 AD250C Copper Clad Laminates 2.52
  1. 35
箭头 CLTE-XT Copper Clad Laminates 2.94
  1. 36
箭头 AD300D Copper Clad Laminates 2.97
  1. 37
箭头 DiClad 870 Copper Clad Laminates 2.33
  1. 38
箭头 RF-30A Copper Clad Laminates 2.97
  1. 39
箭头 CuClad 233 Copper Clad Laminates 2.33
40 箭头 F4BME294 Copper Clad Laminates 2.94
  1. 41
箭头 F4BTM298 Copper Clad Laminates 2.98
  1. 42
箭头 F4BTME298 Copper Clad Laminates 2.98
  1. 43
箭头 CuClad 217 Copper Clad Laminates 2.17, 2.20
  1. 44
箭头 CuClad 250 Copper Clad Laminates 2.4-2.55
  1. 45
箭头 DiClad 527 Copper Clad Laminates 2.4-2.6
  1. 46
箭头 RO4725JXR Copper Clad Laminates 2.55
  1. 47
箭头 F4BTMS Copper Clad Laminates 2.2-2.94
48 箭头 F4BTMS294 Copper Clad Laminates 2.94
  1. 49
箭头 TFA294 Copper Clad Laminates 2.94
50 箭头 RT/duroid 6202PR Copper Clad Laminates 2.94, 2.98
51 箭头 CLTE-MW Copper Clad Laminates 2.98
52 箭头 CLTE Copper Clad Laminates 2.98
53 箭头 RT/duroid 6202 Copper Clad Laminates 2.94-3.06