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An HDI PCB achieves ultra-high wiring density through microvias (<150µm/100µm), fine-line traces, and advanced via structures (e.g., 32L S1000-2M any-layer interconnect; 16L TU883 buried vias L4-L7/L4-L13/L13-L10 in 3+N+3 stackup; 14L hybrid RO4003C+high-Tg FR-4 blind vias L1-L10/L11-L14), enabling miniaturized high-frequency designs for 5G handsets, medical implants, and aerospace systems.
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Rogers RO4350B 8-Layer 1.6mm HDI RF PCB with ENEPIG for RF Communications

This 8-layer rigid PCB utilizes Rogers RO4350B core material and RO4450F bondply, designed for high-frequency applications requiring precise impedance control

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8-Layer HDI PCB Built On Tg175°C FR-4 Immersion Gold PCB for Satellite Radio Applications

This 8-layer HDI printed circuit board is engineered for high-frequency applications such as satellite radio systems, constructed on high-performance FR-4 Tg175℃ substrate

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Isola 370HR 6-Layer 1.6mm HDI PCB for High Density Industrial Electronics

This product is a high-reliability 6-layer HDI (High-Density Interconnect) printed circuit board engineered for demanding industrial and electronic applications.

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IT-180A and FR-4 4-Layer 1.6mm PCB for Automotive Engine Room ECU and Telecommunications

This 4-layer rigid PCB is made of FR-4 (IT-180) base material, complying with IPC-Class-2 quality standards. This IT-180 and FR-4 PCB has a finished thickness of 1.6mm