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An HDI PCB achieves ultra-high wiring density through microvias (<150µm/100µm), fine-line traces, and advanced via structures (e.g., 32L S1000-2M any-layer interconnect; 16L TU883 buried vias L4-L7/L4-L13/L13-L10 in 3+N+3 stackup; 14L hybrid RO4003C+high-Tg FR-4 blind vias L1-L10/L11-L14), enabling miniaturized high-frequency designs for 5G handsets, medical implants, and aerospace systems.
Rogers RO4003C PCB产品图片
产品1

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品2

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品3

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品4

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品5

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品6

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品7

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品8

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品9

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品10

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品11

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品12

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品13

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品14

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品15

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品16

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品17

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品18

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品19

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品20

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.