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A hybrid PCB (mixed PCB) combines dissimilar substrates within the stackup, such as RO4003C and high-Tg FR-4. This approach enhances signal integrity compared to an all-FR-4 design while reducing costs versus an all-low-loss-material stackup.
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The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

产品

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

产品

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

产品

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

产品

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

产品

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

产品

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

产品

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

产品

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

产品

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.