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A hybrid PCB (mixed PCB) combines dissimilar substrates within the stackup, such as RO4003C and high-Tg FR-4. This approach enhances signal integrity compared to an all-FR-4 design while reducing costs versus an all-low-loss-material stackup.
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Rogers RO3003 and RO3210 3-Layer 3.0mm Hybrid PCB High-Frequency laminate for Automotive Radar and 5G Infrastructure

Rogers RO3003 and RO3210 Hybrid PCB utilizes a hybrid construction of RO3003 and RO3210 high-frequency laminates, combining superior electrical performance with enhanced mechanical stability.

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Rogers RT/duroid 5880 and RO4003C 4-Layer 1.3mm Hybrid PCB for Millimeter Wave Radar Systems

This hybrid PCB features a hybrid construction using Rogers RT/duroid 5880 and RO4003C high-frequency laminates, combining excellent electrical properties with enhanced manufacturability.

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Hybrid PCB on RO4003C and S1000-2M 6-layer 1.1mm PCB for Millimeter Wave Radar Systems

Rogers RO4003C Hybrid 6-Layer PCB is a high-performance 6-layer rigid printed circuit board designed for advanced RF and millimeter-wave applications.

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Rogers RO4350B Hybrid PCB 4-Layer 1.6mm RF Circuit Board for Millimeter Wave and Radar Systems

This 4-layer hybrid printed circuit board combines Rogers RO4350B high-frequency PCB material with S1000-2M FR-4 substrate, designed for demanding RF applications.