Premium High DK >9.0 Substrates

 

 

 

The selection of materials with different Dk values plays a crucial role in high-frequency applications. Insertion loss, a key factor in these applications, encompasses four components: conductor loss, dielectric loss, leakage loss, and radiation loss. Conductor loss is influenced by surface roughness, while dielectric loss is determined by the dissipation factor of the circuit material. Leakage loss is typically not a concern for high-frequency circuit materials due to their high volume resistivity. On the other hand, radiation loss, the amount of energy radiated off the circuit, is generally undesirable as it increases signal loss and can interfere with neighboring circuitry. Factors such as circuit design, substrate thickness, PCB fabrication anomalies, substrate Dk, and frequency impact radiation loss. High-frequency circuits using materials with lower Dk values tend to exhibit increased radiation loss, whereas those with higher Dk values experience reduced radiation loss. Additionally, Dk influences circuit size, with lower Dk materials corresponding to longer wavelengths. Coupled features in RF engineering, connected by electric fringing fields, are critical for various RF applications, and the strength and intensity of these coupled fields vary with Dk dependency. Considering these aspects, the choice of materials with different Dk values becomes essential to optimize performance and meet specific requirements in high-frequency applications.

 

 

Item Designator DK
1 箭头 RO3010 PCB 10.2
2 箭头 RO3210 PCB 10.2
3 箭头 RT/duroid 6010 2LM PCB 10.2
4 箭头 CER-10 PCB 10.0
5 箭头 TMM10 PCB 9.2
6 箭头 TMM10i PCB 9.8
7 箭头 TMM13i PCB 12.85
8 箭头 AD1000 PCB 10.2
9 箭头 RF-10 PCB 10.2
10 箭头 F4BTMS1000 PCB 10.0
11 箭头 TP920 PCB 9.2
12 箭头 TP1020 PCB 10.2
13 箭头 TP2500 PCB 25.0
14 箭头 TF920 PCB 9.2
15 箭头 TF1020 PCB 10.2
16 箭头 TF1600 PCB 16.0
17 箭头 TFA 1020 10.2