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A Wangling F4B PCB utilizes PTFE substrates reinforced with fiberglass cloth and ceramic-film reinforcement, delivering ultra-low Df, stable Dk , and exceptional thermal/chemical resistance. These properties minimize signal degradation in high-frequency transmission while enabling complex, space-efficient circuit designs for critical RF/microwave applications across telecommunications, aerospace, and automotive sectors.
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F4BM High-Frequency PCB Superior Low-Loss Substitute for Demanding RF Applications

The F4BM series of high-frequency circuit board laminates are engineered by scientifically formulating and laminating a composite of fiberglass cloth

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F4BME Low-Loss PTFE PCB Laminates with Controlled DK and PIM Performance

F4BME PCB is paired with reverse-treated foil (RTF) copper foil, offering excellent PIM performance, more precise line control, and lower conductor loss.

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F4BTM High Frequency PCB Advanced Low Thermal Expansion Coefficient Materials for High-Performance Circuitry

Discover F4BTM series PCB, meticulously crafted by combining fiberglass cloth, nano-ceramic particles, and polytetrafluoroethylene (PTFE) resin

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F4BTMS High-Frequency PCB: Enhanced Ceramic Composite Laminates for High-Performance Applications

The F4BTMS High-Frequency PCB is an upgraded version of the F4BTM series. Based on the foundation of the F4BTM series, it has achieved significant technological breakthroughs in material formulation and manufacturing processes.

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F4BTMS1000 4-Layer 12.9mm HDI PCB with Blind Via Buried Vias for Microwave and Radar Applications

This 4-layer rigid PCB is built on Wangling F4BTMS1000 base material, meeting IPC-Class 2 quality standards.F4BTMS1000 PCB supports blind vias (Top to inner layer 1) and buried vias (inner layer 2 to inner layer 3)

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Double-Layer F4BTMS450 HASL Lead-Free Rigid PCB 20mil Ceramic-Filled PTFE Laminate for Aerospace & Radar Applications

F4BTMS450 2-layer rigid high frequency PCB is an upgraded aerospace-grade circuit board built on advanced F4BTMS series ceramic-filled PTFE substrate technology.

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F4BME275 2-Layer 1.6mm Pure Gold PCB High Frequency RF Laminate PCB for Radar & Satellite Communication

F4BME275 2-layer high-frequency RF PCB is a next-generation high-performance rigid circuit board optimized for professional microwave and radio frequency electronic systems.

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5mil F4BTMS300 laminate 2-layer Immersion Gold PCB for Aerospace Radar Satellite Communication Use

F4BTMS300 2-layer 5mil core high frequency PCB is an aerospace-grade high-reliability microwave circuit board belonging to the upgraded F4BTMS substrate series, optimized and iterated on the basis of traditional F4BTM dielectric materials.

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F4BM245 2-Layer 20mil Core Rigid High Frequency PCB with Immersion Gold for RF Radar Satellite & Base Station Antenna

F4BM245 2-layer 20mil core high frequency PCB is a cost-effective commercial and industrial-grade microwave circuit board belonging to the upgraded F4BM/F4BME PTFE fiberglass laminate series.

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F4BME220 2-Layer 0.1mm Ultra-Thin Rigid PCB PTFE Laminate with Green Solder Mask for Low PIM RF Radar and Antenna

F4BME220 2-Layer ultra-thin 0.1mm high frequency PCB is a premium low-PIM microwave circuit board belonging to the upgraded F4BME series PTFE fiberglass laminate family.