Rogers RO4835 High Frequency PCB 10mil 20mil 30mil ED Copper 10.7mil 20.7mil 30.7mil LoPro Copper PCB
Rogers RO4835 PCBs, crafted as hydrocarbon ceramic laminates, stand out as antioxidative high-frequency materials engineered for peak stability in elevated-temperature environments.
Shengyi SCGA-500 GF265 High Frequency PCB -- Made with Glass-Reinforced PTFE RF Circuit Materials for RF Applications
SCGA-500 GF265 from Shengyi Technology Co., Ltd (SYTECH) is low loss PTFE woven glass UL 94 V-0 high frequency circuit material.
Rogers RO4725JXR Antenna RF PCB Double-Layer 0.78mm Substrates with Copper and Immersion Gold
This 2-layer Rogers RO4725JXR PCB adopts a specific stackup configuration, consisting of a 35 μm copper_layer_1, a Rogers RO4725JXR Core with a thickness of 30.7 mils
0.5mm-1.6mm TU-883 PCB Very Low Loss and High Thermal Reliability PCB with ENIG ENEPIG Pure gold
ThunderClad 2 (TU-883 PCB) is a ultra-low-loss material formulated with a high-performance resin system. Reinforced with standard woven E-glass, TU-883 material features an engineered resin composition
Rogers RO4003C 4-Layer 0.85mm RF PCB for Automotive Radar and Cellular Antennas
This product is a 4-layer high-frequency PCB constructed with Rogers RO4003C laminate and RO4450F bondply.
Rogers RO4830 RF PCB Built on 2-layer 0.239mm High-Frequency Board with Immersion Gold
This specialized Rogers RO4830 PCB is a 2-layer rigid high-frequency circuit board with an optimized stackup for demanding RF applications.
Rogers DiClad 527 PCB with 20mil Double-Sided Copper Construction and ENIG Surface Treatment for RF Microwave Applications
This Rogers DiClad 527 PCB is engineered as a 2-layer rigid board featuring a robust stackup of 1oz (35μm) copper on both top and bottom layers, integrated with a 20mil DiClad 527 core material.
Rogers RO3003G2 Radio Frequency Circuit 10mil 2-layer PCB with Immersion Gold for High Frequency Applications
2-layer Rogers RO3003G2 PCB features a precision rigid construction with a 10mil (0.254mm) Rogers RO3003G2 dielectric core and 35μm copper cladding on both surfaces.


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