Rogers RO4835 High Frequency PCB 10mil 20mil 30mil ED Copper 10.7mil 20.7mil 30.7mil LoPro Copper PCB
Rogers RO4835 PCBs, crafted as hydrocarbon ceramic laminates, stand out as antioxidative high-frequency materials engineered for peak stability in elevated-temperature environments.
Shengyi SCGA-500 GF265 High Frequency PCB -- Made with Glass-Reinforced PTFE RF Circuit Materials for RF Applications
SCGA-500 GF265 from Shengyi Technology Co., Ltd (SYTECH) is low loss PTFE woven glass UL 94 V-0 high frequency circuit material.
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The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.
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The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.
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The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.
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The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.
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The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.
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The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.
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The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.
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The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.
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The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.
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The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.
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The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.
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The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.
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The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.
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The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.
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The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.
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The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.
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The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.
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The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.