Transparent Flexible Printed Circuit FPC On PET Substrate for Power Battery Market PCB and Microwave Amplifier

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

 

General Description

This type of flexible printed circuit is constructed on PET material for microwave amplifier applications. It is a single-layer FPC with a thickness of 0.15mm. The base laminate is sourced from Shengyi, and it is fabricated in accordance with IPC 6012 Class 2 using the provided Gerber data. A polyimide stiffener is applied to the insertion part.

 

 

 

Parameter and data sheet

 

Features and benefits

Excellent flexibility

Reducing the volume

Weight reduction

Consistency of assembly

Increased reliability

The end can be whole soldered

Low cost

Continuity of processing

No minimum order quantity and low cost sample.

Meeting your printed circuit board needs from PCB prototyping to mass volume production.

 

Applications

Laser head FPC, Tablet PC camera soft board, Automobile sensor flex board

 

Clarifications of FPC

Based on the combination of base material and copper foil, flexible printed circuits (FPCs) can be categorized into two types: adhesive-based flexible boards and adhesive-free flexible boards.

 

Adhesive-free flexible PCBs are significantly more expensive than adhesive-based ones, but they also outperform the latter in three key aspects: flexibility, bonding strength between copper foil and substrate, and solder flatness. For this reason, they are only used in high-demand scenarios, such as COF (Chip on Flex) applications—where bare chips are mounted on flexible boards and high pad flatness is required. Due to their high cost, most flexible PCBs available on the market remain adhesive-based.

 

Since FPCs are primarily used in applications requiring bending, unreasonable design or processing can easily lead to defects like microcracks and poor soldering.

 

Economy of Using FPC

If a circuit design is relatively simple, has a small overall size, and fits the available space, traditional internal connections are far more cost-effective.

Flexible circuits become a favorable design choice under the following conditions:

The circuit is complex and handles multiple signals.

The application has special electrical or mechanical requirements.

The application’s size and performance needs exceed the capabilities of rigid circuits—at this point, flexible assembly becomes the most economical solution.

 

Flexible circuits can be fabricated on thin films with precise specifications, such as 12mil pads, 5mil through-holes, and 3mil line widths and spacings. This precision makes direct chip mounting on the film more reliable. Additionally, these films contain no flame retardants that could act as ion sources. Some films also offer protective properties and can be cured at higher temperatures to achieve a higher glass transition temperature (Tg).Compared to rigid materials, flexible materials are more cost-efficient because they eliminate the need for connectors.

 

More Displays of PET Flex