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DFM

 

 

Design For Manufacture （1） 1-JAN-2023
Serial NO. Procedure Item Large volume （S<100 m²） Middle volume （S<10 m²） Prototype（S<1m²）
1 Inner layer (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.dielectric layer 0.1mm 0.1mm 0.05mm
2 Min.track and spacing 5/5mil(18um) 4/4mil(18um) 3/3.5mil(18um)
3 5/5mil(35um) 4/4mil(35um) 3/4mil(35um)
4 7/9mil(70um) 6/8mil(70um) 6/7mil(70um)
5 9/11mil(105um) 8/10mil(105um) 8/9mil(105um)
6 13/13mil(140um) 12/12mil(140um) 12/11mil(140um)
7 Min.distance from drill to conductor 4 Layer 10mil，6 layer 10mil，8-12 layer 12mil 4 layer 8mil，6 layer 8mil，8-12 layer 10mil，14-20 layer 14mil，22-32 layer 18mil 4 layer 6mil，6 layer 6mil，8-14 layer 8mil，16-22 layer 12mil，24-32 layer 14mil
8 Min.width of annular ring on inner layer 4 Layer 10mil（35um），≥6 Layer 14mil（35um） 4 Layer 8mil(35um)，≥6 layer 12mil（35um） 4 Layer 6mil（35um），≥6 Layer 10mil（35um）
9 Inner layer isolation ring width(Min) 10mil （35um） 8mil （35um） 6mil （35um）
10 Min.via pad diameter 20mil （35um） 16mil （35um） 16mil （35um）
11 Min. distance from board edge to conductor(no copper exposured) 14 mil（35um） 12 mil（35um） 8 mil（35um）
12 Maximum copper weight (Inner layer) 12 OZ( 420 um ) 12 OZ ( 420 um ) 12 OZ ( 420 um )
13 Different copper foil between layers 17.5 / 210 um 17.5 / 210 um 17.5 / 210 um
14 Inner layer BGA channel Above 5 mil (18 um, 35 um coppper), above 6.5 mil (70um copper)
15 AOI Copper weight 105um
16 Test capability 2mil /2mil

 

Design For Manufacture （2）
Serial NO. Procedure Item Manufacturing capability
Large volume （S<100 m²） Middle volume （S<10 m²） Prototype（S<1m²）
17 Laminating Tolerance of laminating thickness ±10% PCB thick ±10% PCB thick ±8% PCB thick
18 Maximum laminating thickness 10.0mm 10.0mm 10.0mm
19 Laminating alignment accuracy ≤±4 mil ≤±3 mil ≤±3 mil
20 Drill (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.diameter of drill bit 0.1mm 0.1mm 0.1mm
21 Min.diameter of slot router 0.50mm 0.50mm 0.50mm
22 Min.tolerance of PTH slots ±0.102mm ±0.102mm ±0.102mm
23 Max.aspect ratio 1:16 1:16 1:16
24 Hole tolerance ±3mil ±3mil ±3mil
25 Space of via to via 6mil(same net)，12mil(different net) 6mil(same net)，12mil(different net) 6mil(same net)，12mil(different net)
26 Space of component hole to component hole 10mil(same net)，10mil(different net) 10mil(same net)，10mil(different net) 10mil(same net)，10mil(different net)
27 Controlled drill Tolerance of depth +/- 2mil
28 Concentric Accuracy of Back drill hole +/- 2mil
29 Dielectric thickness of Back drill ≥4mil
30 Diameter of back drill 0.3mm ~ 6.5mm
31 Back drill STUB 2~6 mil
32 Laser drill Surface copper 9-12um
33 Diameter 4mil, 5mil
34 Material Epoxy(106, 1080, 2113), Hydracarbon, PPO/PPE
35 Etching Min.width of etching logo 8mil(12um,18um base copper)，10 mil (35um base copper)，12 mil(70um）
36 Etch factor 1.6-2.2 1.6-2.2 1.6-2.2
37 Outer layer(18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.via pad diameter 20mil 16mil 16mil
38 Min.BGA pad diameter 8mil 8mil 8mil
39 Min.track and spacing base copper 12um, finished 30um 2.5mil / 2.5mil
base copper 17um, finished 35um 2.8mil / 2.8mil
base copper 35um, finished 53um 3.5mil / 3.5mil
base copper 53um, finihsed 70um 5.0mil / 5.0mil
base copper 70um, finished 87.5um 5.0mil / 6.0mil
40 base copper 87.5um 7.0mil / 7.0mil
41 base copper 105um 8.0mil / 8.0mil
42 base copper 140um 10.0mil / 10.0mil
43 base copper 175um 11mil / 11mil
44 base copper 210um 12mil / 12mil
45 6oz ~ ≤12oz: For each additional 1 oz, the capacity increases by 1.5/1.5 mil.
46 Minimum grid 10/10mil(35um) 8/8mil(35um) 4/8mil(35um)
47 Min.space (conductor to pad, pad to pad) 6mil(18um) 5mil(18um) 4mil(18um)
6mil(35um) 5mil(35um) 4mil(35um)
9mil(70um) 8mil(70um) 7mil(70um)
11mil(105um) 10mil(105um) 9mil(105um)
13mil(140um) 12mil(140um) 11mil(140um)
48 Different copper foil between layers 17.5 / 210 um

 

Design For Manufacture （3）
Serial NO. Procedure Item Manufacturing capability
Large volume （S<100 m²） Middle volume （S<10 m²） Prototype（S<1m²）
49 Solder mask (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Maximum via-plug diameter 0.65mm 0.65mm 0.65mm
50 Maximum PCB finished thickness of via-plug 3.2mm 3.2mm 3.2mm
51 Min.width of solder mask bridge base copper ≦35um Green 4mil
52 Others 5mil
53 copper 70-140um All of colours 6mil
54 base copper >140um All of colours 8 mil
55 Min. solder mask opening single side 1mil (full gold plated PCB, partial area 2mil is allowed; Other PCB, parital area 1.5mil is allowed.
56 Min.solder mask covering traces. 1.5mil (partial area 1.0mil is allowed
57 Min. width of opening characters 8mil
58 Min.width of solder mask characters 9mil(35um) 9mil(35um) 8mil(35um)
59 Min.thickness of Solder mask 9um(35um) 9um(35um) 9um(35um)
60 Max.thickness of solder mask 30um(35um) 30um(35um) 30um(35um)
61 Colour Green, Yellow, Orange, Black, Blue, Red, White, Matt green, Matt black, Matt blue, Purple, Gray
62 Tolerance of Thickness ±5um
63   Min.height of opening character 8mil
64 Notation / Characters (Silkscreen) Min.width and height 12um, 18um base copper Width: 4mil Height: 25mil
65 35um base copper Width: 4mil Height: 30mil
66 ≥70um base copper Width: 6mil Height: 45mil
67 Min.gap from Characters to pads 6mil 6mil 5mil
68 Colour White, Black, Yellow
69 Notation / Characters (Inkjet) Min.Width 2mil 2mil 2mil
70 Min.Height base copper ≦70um: 20mil
71 base copper >70um: 30mil
72 base copper >140um: 40mil
73 Colour White

 

Design For Manufacture （4）
Serial NO. Procedure Item Manufacturing capability
Large volume （S<100 m²） Middle volume （S<10 m²） Prototype（S<1m²
74 Carbon ink Carbon ink covers conductor or pads 14mil 13mil 12mil
75 Mid distance from carbon ink to pads 12mil 11mil 10mil
76 Peelable mask Peelable mask covers conductor or pads 8mil 7mil 6mli
77 Min.distance from peelable mask to pads 14mil 13mil 12mil
78 Max.via-plug of Silk-screen method 2.0mm 2.0mm 2.0mm
79 Max. via-plug of aluminum foil method 4.5mm 4.5mm 4.5mm
80 HASL PCB thickness of HASL 0.6-4.0mm (Hole less 0.5mm should be use via-plug or mask-tent )
81 HASL PCB Size 22" x 24.5" (558.8mm x 622.3mm)
82 Min.BGA size of HASL 10mil
83 Min. spacing for HASL dense board without solder mask 6mil
84 Thickness of Surface finish ENIG Nickle 0.5~8um
85 Gold 0.025~0.127um
86 Edge connector / Gold finger Nickle 2.5~12.7um
87 Gold 0.125~2.0um
88 HASL 2.54-6.35um
89 OSP 0.2-0.4um
90 Immersion tin (Horizontal) 0.8-1.5um
91 Immersion silver (Horizontal) 0.1-0.3um
92 ENEPIG Nickle 3~10um
93 Palladium 0.05~0.4um
94 Gold 0.025~0.127um

 

Design For Manufacture （5）
Serial NO. Procedure Item Manufacturing capability
Large volume （S<100 m²） Large volume （S<100 m²） Prototype（S<1m²）
95 CNC Router Contour Method of contour process CNC milling, V-CUT, Break-out tap, break-out holes, Punching
96 Minimum router 0.6mm
97 Accuracy of contour ±0.15mm ±0.13mm ±0.1mm
98 Min.distance of milling contour(no copper exposure) 10mil 10mil 8mil
99 V-CUT Angle of V-CUT 20°、30°、45°、60° ±5 °
100 Minimum distance for V-CUT without exposing copper 0.3mm (20° tool), 0.4mm (30° tool), 0.5mm (45° tool), 0.65mm (60°)
101 Small Board V-Cut Machine Minimum board width: 40mm
102 Maximum board width: 470mm
103 Minimum board thickness: 0.4mm
104 Maximum board thickness: 2.0mm
105 Non-continuous V-CUT spacing: ≥ 8 mm
106 Big Board V-Cut Machine Minimum board thickness: 0.4mm
107 Maximum board thickness: 3.5mm
108 Non-continuous V-CUT spacing: ≥ 15 mm
109 Minimum V-CUT residual thickness. 0.2mm
110 V-CUT residual thickness tolerance ±0.075 mm (only positive tolerance is allowed when residual thickness is 0.2)
111 Alignment tolerance for upper and lower V-CUT lines ±0.075 mm
112 Min. distance from edge to V-Cut (no copper exposure) 18mil (1.6mm Thick, 20 degree V-groove cutter) 14mil(1.6mm Thick, 20 degree V-groove cutter) 12mil (1.6mm Thick, 20 degree V-groove cutter)
113 20mil (1.6mm Thick, 30 degree V-groove cutter) 18mil (1.6mm Thick, 30 degree V-groove cutter) 16mil (1.6mm Thick, 30 degree V-groove cutter)
114 16mil (1.6mm Thick, 30 degree V-groove cutter) 22mil (1.6mm Thick, 45 degree V-groove cutter) 20mil (1.6mm Thick, 45 degree V-groove cutter)
115 30mil (1.6mm Thick, 60 degree V-groove cutter) 28mil (1.6mm Thick, 60 degree V-groove cutter) 26mil (1.6mm Thick, 60 degree V-groove cutter)

 

Design For Manufacture （6）
Serial NO. Procedure Item Manufacturing capability
Large volume （S<100 m²） Large volume （S<100 m²） Prototype（S<1m²）
116 Flying Test Board thickness of flying probe test 0.05-10.0mm
117 Standard flying probe size 22" x 26" (558.8mm x 660.4mm) (including four-wire low resistance)
118 Maximum test size 30" x 47.2" (762mm x 1198.88mm)
119 Minimum distance from test points to board edge. 0.5mm (Limited to one set of opposite edges.)
120 Minimum continuity resistance 10 Ω
121 Maximum insulation resistance 100 MΩ
122
123 Maximum voltage 500 V
124 Minimum pads 3 mil
125 Minimum pad spacing 3.9 mil
126 Special tolerance Panel size of fixture test method Size≤460X380mm, Small size can be compensated through manufacturing procedure
127 Board thickness of fixture test method 0.4-6.0mm
128 Tolerance of press-fit hole ±2mil
129 Tolerance of NPTH ±2mil
130 Tolerance of PCB thickness 1.0mm≥PCB thickness, Tolerance ±0.1mm；1.0mm≤PCB thickness, Tolerance ±10%
131 Tolerance of depth of countersunk hole ±0.2mm
132 Depth tolerance of blind slot ±0.2mm
133 Maximum shipment size Size≤1200X600mm（Double side, no test required）
134 Size≤1000X600mm（ Multilayer, no test required）
135 Minimum shipment size 5mm x 5mm
136 PCB thickness 0.13-10.0mm
137 Max. drill diameter Size≤6.5mm (Counterbore or router will be used for holes more than 6.5mm, Min.tolerance ±0.1mm ）
138 Max. countersink diameter Size≤6.5mm Countersink can be used counterbore drill or router）
139 Distance of Bevel Size≥11mm Size≥5mm Size≥5mm
140 Thickness of peelable mask 0.3-1.5mm ±0.15mm