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DFM

 

 

Design For Manufacture （1） 1-JAN-2023
Serial NO. Procedure Item Large volume （S<100 m²） Middle volume （S<10 m²） Prototype（S<1m²）
1 Inner layer (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.dielectric layer 0.1mm 0.1mm 0.05mm
2 Min.track and spacing 5/5mil(18um) 4/4mil(18um) 3/3.5mil(18um)
3 5/5mil(35um) 4/4mil(35um) 3/4mil(35um)
4 7/9mil(70um) 6/8mil(70um) 6/7mil(70um)
5 9/11mil(105um) 8/10mil(105um) 8/9mil(105um)
6 13/13mil(140um) 12/12mil(140um) 12/11mil(140um)
7 Min.distance from drill to conductor 4 Layer 10mil，6 layer 10mil，8-12 layer 12mil 4 layer 8mil，6 layer 8mil，8-12 layer 10mil，14-20 layer 14mil，22-32 layer 18mil 4 layer 6mil，6 layer 6mil，8-14 layer 8mil，16-22 layer 12mil，24-32 layer 14mil
8 Min.width of annular ring on inner layer 4 Layer 10mil（35um），≥6 Layer 14mil（35um） 4 Layer 8mil(35um)，≥6 layer 12mil（35um） 4 Layer 6mil（35um），≥6 Layer 10mil（35um）
9 Inner layer isolation ring width(Min) 10mil （35um） 8mil （35um） 6mil （35um）
10 Min.via pad diameter 20mil （35um） 16mil （35um） 16mil （35um）
11 Min. distance from board edge to conductor(no copper exposured) 14 mil（35um） 12 mil（35um） 8 mil（35um）
12 Maximum copper weight (Inner layer) 12 OZ( 420 um ) 12 OZ ( 420 um ) 12 OZ ( 420 um )
13 Different copper foil between layers 17.5 / 210 um 17.5 / 210 um 17.5 / 210 um
14 Inner layer BGA channel Above 5 mil (18 um, 35 um coppper), above 6.5 mil (70um copper)
15 AOI Copper weight 105um
16 Test capability 2mil /2mil

 

Design For Manufacture （2）
Serial NO. Procedure Item Manufacturing capability
Large volume （S<100 m²） Middle volume （S<10 m²） Prototype（S<1m²）
17 Laminating Tolerance of laminating thickness ±10% PCB thick ±10% PCB thick ±8% PCB thick
18 Maximum laminating thickness 10.0mm 10.0mm 10.0mm
19 Laminating alignment accuracy ≤±4 mil ≤±3 mil ≤±3 mil
20 Drill (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.diameter of drill bit 0.1mm 0.1mm 0.1mm
21 Min.diameter of slot router 0.50mm 0.50mm 0.50mm
22 Min.tolerance of PTH slots ±0.102mm ±0.102mm ±0.102mm
23 Max.aspect ratio 1:16 1:16 1:16
24 Hole tolerance ±3mil ±3mil ±3mil
25 Space of via to via 6mil(same net)，12mil(different net) 6mil(same net)，12mil(different net) 6mil(same net)，12mil(different net)
26 Space of component hole to component hole 10mil(same net)，10mil(different net) 10mil(same net)，10mil(different net) 10mil(same net)，10mil(different net)

 

Design For Manufacture （3）
Serial NO. Procedure Item Manufacturing capability
Large volume （S<100 m²） Middle volume （S<10 m²） Prototype（S<1m²）
49 Solder mask (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Maximum via-plug diameter 0.65mm 0.65mm 0.65mm
50 Maximum PCB finished thickness of via-plug 3.2mm 3.2mm 3.2mm
51 Min.width of solder mask bridge base copper ≦35um Green 4mil
52 Others 5mil
53 copper 70-140um All of colours 6mil
54 base copper >140um All of colours 8 mil
55 Min. solder mask opening single side 1mil (full gold plated PCB, partial area 2mil is allowed; Other PCB, parital area 1.5mil is allowed.】--
56 Min.solder mask covering traces. 1.5mil (partial area 1.0mil is allowed】--
57 Min. width of opening characters 8mil
58 Min.width of solder mask characters 9mil(35um) 9mil(35um) 8mil(35um)
59 Min.thickness of Solder mask 9um(35um) 9um(35um) 9um(35um)
60 Max.thickness of solder mask 30um(35um) 30um(35um) 30um(35um)
61 Colour Green, Yellow, Orange, Black, Blue, Red, White, Matt green, Matt black, Matt blue, Purple, Gray】--
62 Tolerance of Thickness ±5um】--