DFM
Design For Manufacture （1）
1-JAN-2023
Serial NO.
Procedure
Item
Large volume （S<100 m²）
Middle volume （S<10 m²）
Prototype（S<1m²）
1
Inner layer (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )
Min.dielectric layer
0.1mm
0.1mm
0.05mm
2
Min.track and spacing
5/5mil(18um)
4/4mil(18um)
3/3.5mil(18um)
3
5/5mil(35um)
4/4mil(35um)
3/4mil(35um)
4
7/9mil(70um)
6/8mil(70um)
6/7mil(70um)
5
9/11mil(105um)
8/10mil(105um)
8/9mil(105um)
6
13/13mil(140um)
12/12mil(140um)
12/11mil(140um)
7
Min.distance from drill to conductor
4 Layer 10mil，6 layer 10mil，8-12 layer 12mil
4 layer 8mil，6 layer 8mil，8-12 layer 10mil，14-20 layer 14mil，22-32 layer 18mil
4 layer 6mil，6 layer 6mil，8-14 layer 8mil，16-22 layer 12mil，24-32 layer 14mil
8
Min.width of annular ring on inner layer
4 Layer 10mil（35um），≥6 Layer 14mil（35um）
4 Layer 8mil(35um)，≥6 layer 12mil（35um）
4 Layer 6mil（35um），≥6 Layer 10mil（35um）
9
Inner layer isolation ring width(Min)
10mil （35um）
8mil （35um）
6mil （35um）
10
Min.via pad diameter
20mil （35um）
16mil （35um）
16mil （35um）
11
Min. distance from board edge to conductor(no copper exposured)
14 mil（35um）
12 mil（35um）
8 mil（35um）
12
Maximum copper weight (Inner layer)
12 OZ( 420 um )
12 OZ ( 420 um )
12 OZ ( 420 um )
13
Different copper foil between layers
17.5 / 210 um
17.5 / 210 um
17.5 / 210 um
14
Inner layer BGA channel
Above 5 mil (18 um, 35 um coppper), above 6.5 mil (70um copper)
15
AOI
Copper weight
105um
16
Test capability
2mil /2mil
Serial NO.
Procedure
Item
Manufacturing capability
Large volume （S<100 m²）
Middle volume （S<10 m²）
Prototype（S<1m²）
17
Laminating
Tolerance of laminating thickness
±10% PCB thick
±10% PCB thick
±8% PCB thick
18
Maximum laminating thickness
10.0mm
10.0mm
10.0mm
19
Laminating alignment accuracy
≤±4 mil
≤±3 mil
≤±3 mil
20
Drill (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )
Min.diameter of drill bit
0.1mm
0.1mm
0.1mm
21
Min.diameter of slot router
0.50mm
0.50mm
0.50mm
22
Min.tolerance of PTH slots
±0.102mm
±0.102mm
±0.102mm
23
Max.aspect ratio
1:16
1:16
1:16
24
Hole tolerance
±3mil
±3mil
±3mil
25
Space of via to via
6mil(same net)，12mil(different net)
6mil(same net)，12mil(different net)
6mil(same net)，12mil(different net)
26
Space of component hole to component hole
10mil(same net)，10mil(different net)
10mil(same net)，10mil(different net)
10mil(same net)，10mil(different net)
27
Controlled drill
Tolerance of depth
+/- 2mil
28
Concentric Accuracy of Back drill hole
+/- 2mil
29
Dielectric thickness of Back drill
≥4mil
30
Diameter of back drill
0.3mm ~ 6.5mm
31
Back drill STUB
2~6 mil
32
Laser drill
Surface copper
9-12um
33
Diameter
4mil, 5mil
34
Material
Epoxy(106, 1080, 2113), Hydracarbon, PPO/PPE
35
Etching
Min.width of etching logo
8mil(12um,18um base copper)，10 mil (35um base copper)，12 mil(70um）
36
Etch factor
1.6-2.2
1.6-2.2
1.6-2.2
37
Outer layer(18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )
Min.via pad diameter
20mil
16mil
16mil
38
Min.BGA pad diameter
8mil
8mil
8mil
39
Min.track and spacing
base copper 12um, finished 30um
2.5mil / 2.5mil
base copper 17um, finished 35um
2.8mil / 2.8mil
base copper 35um, finished 53um
3.5mil / 3.5mil
base copper 53um, finihsed 70um
5.0mil / 5.0mil
base copper 70um, finished 87.5um
5.0mil / 6.0mil
40
base copper 87.5um
7.0mil / 7.0mil
41
base copper 105um
8.0mil / 8.0mil
42
base copper 140um
10.0mil / 10.0mil
43
base copper 175um
11mil / 11mil
44
base copper 210um
12mil / 12mil
45
6oz ~ ≤12oz: For each additional 1 oz, the capacity increases by 1.5/1.5 mil.
46
Minimum grid
10/10mil(35um)
8/8mil(35um)
4/8mil(35um)
47
Min.space (conductor to pad, pad to pad)
6mil(18um)
5mil(18um)
4mil(18um)
6mil(35um)
5mil(35um)
4mil(35um)
9mil(70um)
8mil(70um)
7mil(70um)
11mil(105um)
10mil(105um)
9mil(105um)
13mil(140um)
12mil(140um)
11mil(140um)
48
Different copper foil between layers
17.5 / 210 um
Serial NO.
Procedure
Item
Manufacturing capability
Large volume （S<100 m²）
Middle volume （S<10 m²）
Prototype（S<1m²）
49
Solder mask (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )
Maximum via-plug diameter
0.65mm
0.65mm
0.65mm
50
Maximum PCB finished thickness of via-plug
3.2mm
3.2mm
3.2mm
51
Min.width of solder mask bridge
base copper ≦35um
Green
4mil
52
Others
5mil
53
copper 70-140um
All of colours
6mil
54
base copper >140um
All of colours
8 mil
55
Min. solder mask opening
single side 1mil (full gold plated PCB, partial area 2mil is allowed; Other PCB, parital area 1.5mil is allowed.
56
Min.solder mask covering traces.
1.5mil (partial area 1.0mil is allowed
57
Min. width of opening characters
8mil
58
Min.width of solder mask characters
9mil(35um)
9mil(35um)
8mil(35um)
59
Min.thickness of Solder mask
9um(35um)
9um(35um)
9um(35um)
60
Max.thickness of solder mask
30um(35um)
30um(35um)
30um(35um)
61
Colour
Green, Yellow, Orange, Black, Blue, Red, White, Matt green, Matt black, Matt blue, Purple, Gray
62
Tolerance of Thickness
±5um
63
Min.height of opening character
8mil
64
Notation / Characters (Silkscreen)
Min.width and height
12um, 18um base copper
Width: 4mil
Height: 25mil
65
35um base copper
Width: 4mil
Height: 30mil
66
≥70um base copper
Width: 6mil
Height: 45mil
67
Min.gap from Characters to pads
6mil
6mil
5mil
68
Colour
White, Black, Yellow
69
Notation / Characters (Inkjet)
Min.Width
2mil
2mil
2mil
70
Min.Height
base copper ≦70um: 20mil
71
base copper >70um: 30mil
72
base copper >140um: 40mil
73
Colour
White
Serial NO.
Procedure
Item
Manufacturing capability
Large volume （S<100 m²）
Middle volume （S<10 m²）
Prototype（S<1m²
74
Carbon ink
Carbon ink covers conductor or pads
14mil
13mil
12mil
75
Mid distance from carbon ink to pads
12mil
11mil
10mil
76
Peelable mask
Peelable mask covers conductor or pads
8mil
7mil
6mli
77
Min.distance from peelable mask to pads
14mil
13mil
12mil
78
Max.via-plug of Silk-screen method
2.0mm
2.0mm
2.0mm
79
Max. via-plug of aluminum foil method
4.5mm
4.5mm
4.5mm
80
HASL
PCB thickness of HASL
0.6-4.0mm (Hole less 0.5mm should be use via-plug or mask-tent )
81
HASL PCB Size
22" x 24.5" (558.8mm x 622.3mm)
82
Min.BGA size of HASL
10mil
83
Min. spacing for HASL dense board without solder mask
6mil
84
Thickness of Surface finish
ENIG
Nickle
0.5~8um
85
Gold
0.025~0.127um
86
Edge connector / Gold finger
Nickle
2.5~12.7um
87
Gold
0.125~2.0um
88
HASL
2.54-6.35um
89
OSP
0.2-0.4um
90
Immersion tin (Horizontal)
0.8-1.5um
91
Immersion silver (Horizontal)
0.1-0.3um
92
ENEPIG
Nickle
3~10um
93
Palladium
0.05~0.4um
94
Gold
0.025~0.127um
Serial NO.
Procedure
Item
Manufacturing capability
Large volume （S<100 m²）
Large volume （S<100 m²）
Prototype（S<1m²）
95
CNC Router Contour
Method of contour process
CNC milling, V-CUT, Break-out tap, break-out holes, Punching
96
Minimum router
0.6mm
97
Accuracy of contour
±0.15mm
±0.13mm
±0.1mm
98
Min.distance of milling contour(no copper exposure)
10mil
10mil
8mil
99
V-CUT
Angle of V-CUT
20°、30°、45°、60° ±5 °
100
Minimum distance for V-CUT without exposing copper
0.3mm (20° tool), 0.4mm (30° tool), 0.5mm (45° tool), 0.65mm (60°)
101
Small Board V-Cut Machine
Minimum board width:
40mm
102
Maximum board width:
470mm
103
Minimum board thickness:
0.4mm
104
Maximum board thickness:
2.0mm
105
Non-continuous V-CUT spacing:
≥ 8 mm
106
Big Board V-Cut Machine
Minimum board thickness:
0.4mm
107
Maximum board thickness:
3.5mm
108
Non-continuous V-CUT spacing:
≥ 15 mm
109
Minimum V-CUT residual thickness.
0.2mm
110
V-CUT residual thickness tolerance
±0.075 mm (only positive tolerance is allowed when residual thickness is 0.2)
111
Alignment tolerance for upper and lower V-CUT lines
±0.075 mm
112
Min. distance from edge to V-Cut (no copper exposure)
18mil (1.6mm Thick, 20 degree V-groove cutter)
14mil(1.6mm Thick, 20 degree V-groove cutter)
12mil (1.6mm Thick, 20 degree V-groove cutter)
113
20mil (1.6mm Thick, 30 degree V-groove cutter)
18mil (1.6mm Thick, 30 degree V-groove cutter)
16mil (1.6mm Thick, 30 degree V-groove cutter)
114
16mil (1.6mm Thick, 30 degree V-groove cutter)
22mil (1.6mm Thick, 45 degree V-groove cutter)
20mil (1.6mm Thick, 45 degree V-groove cutter)
115
30mil (1.6mm Thick, 60 degree V-groove cutter)
28mil (1.6mm Thick, 60 degree V-groove cutter)
26mil (1.6mm Thick, 60 degree V-groove cutter)
Serial NO.
Procedure
Item
Manufacturing capability
Large volume （S<100 m²）
Large volume （S<100 m²）
Prototype（S<1m²）
116
Flying Test
Board thickness of flying probe test
0.05-10.0mm
117
Standard flying probe size
22" x 26" (558.8mm x 660.4mm) (including four-wire low resistance)
118
Maximum test size
30" x 47.2" (762mm x 1198.88mm)
119
Minimum distance from test points to board edge.
0.5mm (Limited to one set of opposite edges.)
120
Minimum continuity resistance
10 Ω
121
Maximum insulation resistance
100 MΩ
122
123
Maximum voltage
500 V
124
Minimum pads
3 mil
125
Minimum pad spacing
3.9 mil
126
Special tolerance
Panel size of fixture test method
Size≤460X380mm, Small size can be compensated through manufacturing procedure
127
Board thickness of fixture test method
0.4-6.0mm
128
Tolerance of press-fit hole
±2mil
129
Tolerance of NPTH
±2mil
130
Tolerance of PCB thickness
1.0mm≥PCB thickness, Tolerance ±0.1mm；1.0mm≤PCB thickness, Tolerance ±10%
131
Tolerance of depth of countersunk hole
±0.2mm
132
Depth tolerance of blind slot
±0.2mm
133
Maximum shipment size
Size≤1200X600mm（Double side, no test required）
134
Size≤1000X600mm（ Multilayer, no test required）
135
Minimum shipment size
5mm x 5mm
136
PCB thickness
0.13-10.0mm
137
Max. drill diameter
Size≤6.5mm (Counterbore or router will be used for holes more than 6.5mm, Min.tolerance ±0.1mm ）
138
Max. countersink diameter
Size≤6.5mm Countersink can be used counterbore drill or router）
139
Distance of Bevel
Size≥11mm
Size≥5mm
Size≥5mm
140
Thickness of peelable mask
0.3-1.5mm ±0.15mm
