Shenzhen Bicheng Electronics Technology Co., Ltd

 

 

Overview

Shenzhen Bicheng Electronics Technology Co., Ltd, established in 2003 and based in Shenzhen, China, has evolved over 20 years into a respected international supplier and exporter in high-frequency PCB. Specializing in mission-critical applications across wireless communications, satellite systems, millimeter-wave technology, radar systems, and defense infrastructure, our company combines advanced material science with precision engineering to deliver PCB solutions that operate reliably from -55°C to +288°C..

 

 

Manufacturing Capabilities & Material Solutions

We specialize in diversified PCB products, covering RF circuit boards, flexible circuits, and metal core PCBs, with capabilities spanning from prototyping and small-batch production to mass manufacturing. Actively engaged in high-value-added PCB projects, we excel in HDI (high-density interconnect) boards, quick-turn production, impedance-controlled circuits, heavy copper designs, and backplane boards, forming a comprehensive product line that integrates low-to-high-end solutions and ensures effective extension and complementarity of our PCB offerings.

 

Material Expertise

As a strategic partner of leading material innovators such as Rogers, Taconic, and Wangling, we maintain full compatibility with over 200 specialized substrates, covering a wide range of dielectric constants (2.2–25). Our material portfolio includes:

 

Rogers: 3000 series, 4000 series, 5000 series, 6000 series, TMM series, DiClad series, CuClad series

 

Taconic: TLX series, TLY series, RF series

 

Wangling: DK series (2.2–25), F4BM, F4BME, F4BTM, F4BTME, F4BTMS, TF, TP, WL-CT, TFA series

 

Technical Solutions

High-density interconnect (HDI) boards (up to 50 layers), hybrid material stacks, metal-clad edge boards, and ultra-thin substrates (0.1mm–12mm thickness); Advanced manufacturing: ±10% impedance control, 30 oz heavy copper designs, and ceramic substrates optimized for 5G/mmWave thermal management. This integrated approach combines material diversity, technical precision, and scalable production to deliver end-to-end PCB solutions across wireless communications, aerospace, and intelligent industrial applications.

 

 

Global Applications & Engineering Excellence

With 24-hour rapid prototyping and scalable manufacturing, we enable clients to accelerate from concept to mass production while maintaining signal loss below 0.2dB/mm at 110GHz, powering critical infrastructure worldwide including:

 

Telecommunications: 5G/mmWave networks, satellite communication modules.

 

Automotive: ADAS systems, 77GHz automotive radar arrays, EV fast-charging controllers.

 

Aeospace & Defense: BeiDou navigation RF modules, phased array antennas, radar systems.

 

Medical Diagnostics: High-reliability interconnect solutions.

 

 

Innovation & Future Focus

We strive to advance high-frequency PCB technology, enabling global deployment of 5G infrastructure, intelligent industrial automation, and next-gen satellite networks—while fostering a culture of continuous innovation and customer-centric excellence.