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12-Layer 2.5mm High-Speed Megtron M6 PCB with ENIG for 5G, Networking, and Wireless System
12-Layer 2.5mm High-Speed Megtron M6 PCB with ENIG for 5G, Networking, and Wireless System
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
Product Overview
Our 12-Layer High-Speed Megtron® M6 PCB is engineered for peak performance in the most demanding high-frequency and high-density applications. Leveraging Panasonic's ultra-low-loss Megtron® M6 material, this board delivers exceptional signal integrity, thermal resilience, and reliability. With a robust 2.5mm thickness, ENIG (Immersion Gold) surface finish, and resin-filled microvias, it is the ideal solution for 5G infrastructure, high-speed networking, and wireless systems requiring ultra-low transmission loss and precision impedance control.
Key Features & Benefits
1. Ultra-Low Loss & Superior High-Frequency Performance
Achieve maximum signal speed and integrity in applications exceeding 10GHz.
Advanced Megtron® M6 Material: Features an ultra-low Dielectric Constant (Dk) of 3.61 and Dissipation Factor (Df) of 0.004 @ 10GHz for minimal signal attenuation.
Precision Impedance Control: Maintains consistent 50Ω single-ended impedance on critical signal layers (L3 & L10) for clean data transmission.
High-Density Interconnect (HDI) Via Technology: Incorporates blind/buried vias (GTL-L2, L3-L8, L3-GBL) and robust, resin-filled microvias (0.4mm and below) for enhanced structural integrity and routing density.
2. Precision Engineering for Maximum Durability
Built to withstand rigorous operating conditions and complex design requirements.
Fine-Line Circuitry: Supports 4/4 mil trace/space and a 0.3mm minimum hole size, accommodating highly complex layouts with 451 total vias.
Optimized 12-Layer Stack-up: Constructed with 5 cores and 6 prepreg layers, utilizing 17μm inner and 35μm outer copper weights for optimal performance and thermal management.
Enhanced Thermal Reliability: With a high decomposition temperature (Td 410°C), it is ROHS-compliant for lead-free assembly and offers 5x better through-hole reliability than standard high-Tg FR4.
3. Uncompromising Quality & Reliability
Guaranteed to meet the highest industry standards for the most critical applications.
100% Electrical Testing: Every board is fully tested pre-shipment to ensure zero defects and perfect functionality.
IPC-Class-3 Certified: Manufactured to the strictest IPC standards, making it suitable for high-reliability sectors like aerospace, medical electronics, and industrial automation.
Technical Specifications
Parameter Specification
Base Material Megtron® M6 (R-5775G core + R-5670G prepreg)
Layer Count 12 layers
Dimensions 214mm x 65mm (±0.15mm)
Board Thickness 2.5mm
Copper Weight Inner: 0.5oz (17μm) / Outer: 1oz (35μm)
Surface Finish ENIG (Immersion Gold)
Solder Mask Green (top & bottom)
Silkscreen White (top & bottom)
Via Plating Thickness 25μm
PCB Parameters
| PCB SIZE | 214 x 65mm=1PCS |
| BOARD TYPE | |
| Number of Layers | 12-layer Rigid PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 35um(1oz) |
| Prepreg R-5670(G) 3313(57%) X 1 | |
| copper ------- 35um(1oz) | |
| Core R5775G (HVLP) 0.1mm | |
| Copper ------- 17um(0.5oz) | |
| Prepreg R-5670(G) 1035(70%) X 2 | |
| ............. | |
| Prepreg R-5670(G) 3313(57%) X 1 | |
| copper ------- 35um(1oz) | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4mil/4mil |
| Minimum / Maximum Holes: | 0.3mm / 0.8mm |
| Number of Different Holes: | 17 |
| Number of Drill Holes: | 351 |
| Number of Milled Slots: | 4 |
| Number of Internal Cutouts: | 4 |
| Impedance Control | Yes |
| BOARD MATERIAL | |
| Glass Epoxy: | Core R5775G (HVLP) 0.1mm |
| Final foil external: | 1.0 oz |
| Final foil internal: | 0.5 oz / 1 oz |
| Final height of PCB: | 2.5 mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold |
| Solder Mask Apply To: | Green |
| Solder Mask Color: | Green |
| Solder Mask Type: | LPI |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | White |
| Colour of Component Legend | White |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated Through Hole(PTH), Blind via, Buried via |
| FLAMIBILITY RATING | 94 V-0 |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059"" (0.15mm) |
| Board plating: | 0.0030"" (0.076mm) |
| Drill tolerance: | 0.002"" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |