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Home - Prototype PCB

We provide rapid-turn prototype PCB manufacturing with no MOQ requirements, delivering boards in 2-7 days. Our capabilities include high-frequency substrates, polyimide flexible circuits, HDI boards, impedance-controlled PCBs, and complex multilayer solutions to accelerate product development cycles.
Rogers RO4003C PCB产品图片
Taconic TLY-5Z High Frequency PCB 60mil 30mil 20mil and 10mil RF PCB with Immersion Gold

Taconic TLY-5Z high-frequency PCBs are advanced composite materials engineered for demanding applications, particularly in aerospace where lightweight performance is critical.

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Rogers TC600 Microwave PCB with 15mil 20mil 30mil 50mil 60mil TC600 Immersion Silver PCB for Power Amplifiers

Rogers' (Arlon) TC600 is a woven fiberglass reinforced, enhanced thermal conductivity ceramic filled, PTFE-based composite. It is designed to provide enhanced heat-transfer

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产品4

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

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产品5

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

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产品6

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

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产品7

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

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产品8

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

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产品9

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

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产品10

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

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产品11

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

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产品12

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

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产品13

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

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产品14

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

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产品15

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

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产品16

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

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产品17

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

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产品18

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

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产品19

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品20

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.