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Rogers DiClad 880 PCB 20mil 30mil 60mil Low Loss PCB with Immersion Gold, Tin and Silver
Rogers DiClad 880 PCB 20mil 30mil 60mil Low Loss PCB with Immersion Gold, Tin and Silver
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
Introduction
Rogers DiClad 880 PCBs are constructed from woven fiberglass-reinforced PTFE-based composites that exclude ceramic fillers. By reducing the number of woven fiberglass plies and increasing the proportion of PTFE, DiClad 880 PCBs achieve lower dielectric constant and dissipation factor values. In fact, their DK (dielectric constant) and DF (dissipation factor) metrics are comparable to those of RT/duroid 5880.
The dielectric constant of Rogers DiClad 880 circuit boards can be finely tuned through meticulous control of the mixing ratio between woven fiberglass and PTFE. An increased amount of fiberglass leads to a higher dielectric constant, while simultaneously enhancing dimensional stability. To ensure uniform performance in the XY plane, the woven fiberglass layers within the boards are aligned in the same direction. Thanks to the reinforcement provided by woven fiberglass, Rogers DiClad 880 laminate demonstrates superior dimensional stability in the XY direction compared to RT/duroid 5880 and RT/duroid 5870. However, this comes at the cost of a higher coefficient of thermal expansion in the Z-axis direction.
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Features:
- Extremely Low Loss Tangent at 0.0009
- Excellent Dimensional Stability
- Product Performance Uniformity
Benefits:
- Electrical Properties are Highly Uniform Across Frequency
- Consistent Mechanical Performance
- Excellent Chemical Resistance
Typical Applications:
- Commercial Phased Array Networks
- Digital Radio Antennas
- Filters, Couplers, LNAs
- Low Loss Base Station Antennas
- Radar Feed Networks
- Missile Guidance Systems
Our PCB Capability (DiClad 880 PCB)
PCB Capability (DiClad 880) |
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PCB Material: |
Woven Fiberglass Reinforced, PTFE-based Composites |
Designation: |
DiClad 880 |
Dielectric constant: |
2.20 (10 GHz) |
Dissipation factor |
0.0009 (10 GHz) |
Layer count: |
Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
Dielectric thickness |
20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Immersion gold (ENIG), HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare Copper, Pure gold plated etc.. |
Our Advantages
- Engineering design prevents problems from occurring in pre-production;
- ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;
- AOI inspection;
- Powerful PCB capabilities support your research and development, sales and marketing;
- Delivery on time higher than 98% on-time-delivery rate;
- Any Layer HDI PCBs;
- 16000㎡ workshop; 30000㎡ output capability per month; 8000 types of PCB's per month;
- Quick CADCAM checking and free PCB quotation;
- Diversified shipping method: FedEx, DHL, TNT, EMS;
- No MOQ, low cost for prototypes and small runs quantity;
Appendix: Typical Properties of DiClad 880
Property | Test Method | Condition | DiClad 880 |
Dielectric Constant @ 10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 2.17, 2.20 |
Dielectric Constant @ 1 MHz | IPC TM-650 2.5.5.3 | C23/50 | 2.17, 2.20 |
Dissipation Factor @ 10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 0.0009 |
Dissipation Factor @ 1 MHz | IPC TM-650 2.5.5.3 | C23/50 | 0.0008 |
Thermal Coefficient of Er (ppm/°C) | IPC TM-650 2.5.5.5 Adapted |
-10°C to +140°C | -160 |
Peel Strength (lbs.per inch) | IPC TM-650 2.4.8 | After Thermal Stress | 14 |
Volume Resistivity (MΩ-cm) | IPC TM-650 2.5.17.1 | C96/35/90 | 1.4 x 10 9 |
Surface Resistivity (MΩ) | IPC TM-650 2.5.17.1 | C96/35/90 | 2.9 x 10 6 |
Arc Resistance | ASTM D-495 | D48/50 | >180 |
Tensile Modulus (kpsi) | ASTM D-638 | A, 23°C | 267, 202 |
Tensile Strength (kpsi) | ASTM D-882 | A, 23°C | 8.1, 7.5 |
Compressive Modulus (kpsi) | ASTM D-695 | A, 23°C | 237 |
Flexural Modulus (kpsi) | ASTM D-790 | A, 23°C | 357 |
Dielectric Breakdown (kV) | ASTM D-149 | D48/50 | >45 |
Density (g/cm3) | ASTM D-792 Method A | A, 23°C | 2.23 |
Water Absorption (%) | MIL-S-13949H 3.7.7 IPC TM-650 2.6.2.2 |
E1/105 + D24/23 | 0.02 |
Coefficient of Thermal | IPC TM-650 2.4.24 | 0°C to 100°C | |
Expansion (ppm/°C) | Mettler 3000 | ||
X Axis | Thermomechanical | 25 | |
Y Axis | Analyzer | 34 | |
Z Axis | 252 | ||
Thermal Conductivity (W/mK) | ASTM E-1225 | 100°C | 0.261 |
Outgassing | NASA SP-R-0022A | 125°C, ≤ 10-6 torr | |
Total Mass Loss (%) | Maximum 1.00% | 0.01 | |
Collected Volatile | Maximum 0.10% | 0.01 | |
Condensable Material (%) | |||
Water Vapor Regain (%) | 0.01 | ||
Visible Condensate (±) | NO | ||
Flammability UL File E 80166 | UL 94 Vertical Burn IPC TM-650 2.3.10 | C48/23/50, E24/125 | Meets requirements of UL94-V0 |