Products
High Temperature PCB - Hard Gold Contact Fingers PCB - HDI Gold Finger PCB - Gold-plated Edge Connector Circuit Board
This is a type of 8-layer printed circuit board built on FR-4 substrate with Tg 170°C for the application of Mobile Broadband.
12-Layer IT-180 PCB with Impedance Control – 1.6mm Through Holes PCB with Matt Red Solder Mask
This 12-layer printed circuit board is built on IT-180A FR-4 base material with a glass transition temperature (Tg) of 170°C, designed to meet IPC-Class 2 quality standards.
WL-CT Series High-Frequency PCB: Advanced Organic Polymer Ceramic-Based Circuit Board Solution with High TG above 280
The WL-CT series represents a cutting-edge line of organic polymer ceramic fiberglass cloth-covered copper boards, engineered as thermosetting resin-based high-frequency materials.
FR408HR 4-Layer 1.6mm Via in Pad HDI PCB with Tg190 for Networking and Communications
This FR408HR-based 4-layer rigid PCB is engineered for high-performance applications requiring enhanced thermal reliability and signal integrity.
Rogers RO4003C and S10002M Hybrid PCB 8-Layer 1.5mm HDI PCB for Microwave and Automotive Applications
This 8-layer hybrid PCB utilizes Rogers RO4003C high-frequency material combined with FR-4 Tg170°C substrates, designed for demanding RF/microwave applications.
Rogers RO4003C and FR-4 Hybrid PCB 6-Layer 1.1mm High Tg PCB for RF and Millimeter Wave Applications
This 6-layer hybrid PCB combines Rogers RO4003C laminate with High Tg>280 °C FR-4 substrates to deliver optimal performance for RF and millimeter wave applications.
4-layer TU-872 SLK Sp HDI PCB High Tg Material Featuring Blind Vias and Buried Vias with Immersion Gold
This 4-layer TU-872 SLK Sp PCB utilizes low Dk/Df FR-4 material with 1oz copper on each layer, finished with immersion gold surface treatment and green solder mask.
IT-180ATC High Tg PCB 0.6mm-3.2mm High Reliability Lead Free PCB with ENIG,ENEPIP and Pure gold
IT-180ATC PCB is an advanced high-Tg (175℃ via DSC) multifunctional filled epoxy circuit board, featuring high thermal reliability and CAF resistance.


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