Home - High Temperature PCB - 12-Layer IT-180 PCB with Impedance Control – 1.6mm Through Holes PCB with Matt Red Solder Mask

12-Layer IT-180 PCB with Impedance Control – 1.6mm Through Holes PCB with Matt Red Solder Mask

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

 

Overview of This Type of PCB

This 12-layer printed circuit board (PCB) is built on IT-180A FR-4 base material with a glass transition temperature (Tg) of 170°C, designed to meet IPC-Class 2 quality standards. It has a total thickness of 1.6mm (±10%) and dimensions of 80.15mm x 76.6mm (1 piece per panel). Key features include matt red solder mask on both sides, white silkscreen on the top layer, and Electroless Nickel Immersion Gold (ENIG) surface finish.

 

12-Layer 1.6mm IT-180A and FR-4 PCB supports plated through holes (L1-L12), blind vias (L1-L5, L7-L10, L7-L12), and buried vias (L1-L5, L7-L10, L7-L12), with all 0.2mm and 0.3mm vias filled and capped per IPC 4761 Type VII. The PCB includes impedance control for differential pairs (50Ω, 90Ω, 100Ω) across the top layer, layer 3, layer 5, and layer 8, with trace/gap sizes ranging from 4mil/4mil to 7mil/6mil. It also requires printing of a series number and is available for worldwide shipping, with artwork supplied in Gerber RS-274-X format.

 

 

 

 

PCB Construction Details

Layer Type

Layer No.

Thickness (μm)

Specification

Copper

1

45

18μm base copper + 25μm plating

FR-4

PP

150

IPC-4101/24

Copper

2

17

FR-4 IT-180

Core

135

IPC-4101/24

Copper

3

17

FR-4

PP

153

IPC-4101/24

Copper

4

17

FR-4 IT-180

Core

115

IPC-4101/24

Copper

5

17

FR-4

PP

94

IPC-4101/24

Copper

6

17

FR-4 IT-180

Core

115

IPC-4101/24

Copper

7

17

FR-4

PP

94

IPC-4101/24

Copper

8

17

FR-4 IT-180

Core

115

IPC-4101/24

Copper

9

17

FR-4

PP

150

IPC-4101/24

Copper

10

17

FR-4 IT-180

Core

135

IPC-4101/24

Copper

11

17

FR-4

PP

150

IPC-4101/24

Copper

12

45

18μm base copper + 25μm plating

Key Parameters

Minimum hole size: 0.2mm; Solder mask thickness: 10μm; Minimum dielectric thickness: 100μm; Minimum trace width: 120μm; Minimum spacing: 125μm

 

 

Additional Components & Features

This PCB supports 240 components, with 482 total pads (234 thru-hole pads, 138 top SMT pads, 110 bottom SMT pads) and 256 vias across 10 nets. It is engineered for lead-free assembly (260℃) and includes strict impedance control to ensure signal integrity for high-frequency applications.

 

Material Advantages (IT-180ATC)

IT-180ATC, the base material of this PCB, is a high-Tg (175℃ by DSC) filled epoxy with excellent performance:

Dielectric constant (DK): 4.1 at 10GHz; Dissipation factor: 0.017 at 10GHz

Thermal resistance: T260 60 minutes, T288 20 minutes

Minimum peel strength: 8 lbs/inch (standard ED copper)

CTE matched to copper (X: 11-13ppm/℃, Y: 13-15ppm/℃; Z-axis: 45ppm/℃)

Low moisture absorption (0.1%) and UL 94-V0 flammability rating

High thermal reliability and CAF resistance

 

Typical Applications

Ideal for demanding industries, including automotive (engine room ECU), backplanes, data storage, servers & networking, and telecommunications.

 

Why Choose This PCB?

This 12-layer PCB combines IT-180A FR-4’s thermal stability and CAF resistance with precise impedance control, reliable via filling, and lead-free compatibility—making it a durable choice for high-performance electronic systems. Its compliance with IPC-Class 2 standards and worldwide availability further ensure consistent quality and accessibility for global projects.

 

Order Now for Automotive, Server & Telecommunications Applications!

IT-180A FR-4 12-layer PCB delivers the stability and performance needed for automotive engine room ECUs, servers, and telecom equipment—order now to meet your high-reliability electronic project requirements.