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A multilayer PCB integrates bonded conductive and insulating layers to achieve high-density interconnections within compact form factors, supporting layer counts up to 32 and aspect ratios up to 15:1. This architecture enhances signal integrity, reduces electromagnetic interference (EMI), and improves thermal management for demanding applications in telecommunications, aerospace, automotive, and medical electronics.
Rogers RO4003C PCB产品图片
产品1

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品2

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品3

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品4

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品5

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品6

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品7

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品8

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品9

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品10

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品11

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品12

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品13

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品14

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品15

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品16

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品17

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品18

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品19

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.

PCB产品图片
产品20

The PCB has a 4-layer hybrid stackup with a 0.5oz+plating ground layer, two 1oz ground layers, and a 0.5oz+plating signal layer.