Multilayer PCB

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Rogers TMM4 PCB 2-layer 50mil 1.27mm High Frequency

Taconic TC600 PCB for Microwave Applications

4-layer Hybrid PCB with RF-4 and Rogers Layers

Flexible PCB with Polyimide Substrate

Alumina Ceramic PCB for High Power Applications

Aluminum Metal Core PCB for LED

PCB7

PCB8

A multilayer PCB integrates bonded conductive and insulating layers to achieve high-density interconnections within compact form factors, supporting layer counts up to 32 and aspect ratios up to 15:1. This architecture enhances signal integrity, reduces electromagnetic interference (EMI), and improves thermal management for demanding applications in telecommunications, aerospace, automotive, and medical electronics.

4-Layer High Performance Multi-layer Polyimide PCB with Matte Black Mask and ENEPIG Surface Finish

The High Performance Multi-layer PCB is a four-layer board constructed with polyimide material, featuring a finished thickness of 1.3mm.

TAGS:

Multi-layer PCB ENEPIG Surface Finish PCB Polyimide Circuit Board Polyimide PCB Material 4-layers Polyimide PCB 100% electrical test PCB

12-Layer 2.5mm High-Speed Megtron M6 PCB with ENIG for 5G, Networking, and Wireless System

Our 12-Layer High-Speed Megtron® M6 PCB is engineered for peak performance in the most demanding high-frequency and high-density applications.

TAGS:

12-Layer Megtron M6 PCB 2.5mm Megtron® M6 PCB Megtron M6 High-Speed PCB M6 High-Frequency PCB Megtron M6 Multi-layer PCB Low Dielectric Loss PCB

4-Layer Blind Via PCB Built on Tg150℃ FR-4 Circuit Board With Immersion Gold

This multilayer PCB utilizes an FR-4 substrate with a Tg of 150°C and incorporates blind via technology, making it well-suited for mobile phone applications.

TAGS:

Blind Via PCB Tg 150°C FR-4 substrate 4-Layer FR-4 Circuit Board FR-4 Multilayer PCB low Z-CTE PCB Immersion gold PCB

Rogers RO4350B 18-Layer 3.2mm RF Microwave PCB for Base Station Antennas

This 18-layer rigid PCB is built on Rogers RO4350B core and RO4450F bondply materials, designed for high-frequency RF and microwave applications.

TAGS:

Rogers RO4350B PCB 18-layer circuit board RO4350B high-frequency PCB RF microwave board 3.2mm RO4350B PCB RO4350B Multilayer PCB

Panasonic Megtron 6 (M6) 16-Layer 2.0mm HDI PCB for 5G and High-Speed Server Applications

This product is a 16-layer High-Density Interconnect (HDI) printed circuit board engineered for high-frequency and high-reliability applications.

TAGS:

Megtron 6 HDI PCB Megtron 6 M6 laminate Panasonic M6 PCB impedance control PCB 5G circuit board Megtron 6 Multilayer PCB

14-Layer High Density Interconnect (HDI) PCB Built on FR-4 Tg170℃ Substrate With ENIG Surface Finish

This 14-layer HDI printed circuit board (PCB) is constructed using an FR-4 Tg170℃ substrate, specifically designed for codec equipment applications.

TAGS:

14-Layer High Density Interconnect PCB FR-4 Tg170℃ Multilayer PCB FR-4 HDI PCB 5G WiFi board ENIG Surface Finish PCB FR-4 Tg170℃ substrate

IT-180 10-Layer HDI PCB High Temperature PCB with Immersion Gold and 100 ohm Impedance

This is a 10-layer printed circuit board (PCB) constructed on ITEQ’s IT-180 FR-4 substrate (with a glass transition temperature, Tg, of 170℃)

TAGS:

IT-180 10-Layer PCB 10-layer circuit board IT-180 high-frequency PCB IT-180 FR-4 substrate High Temperature PCB IT-180 Multilayer PCB

20-Layer 3.0mm Thick TU-883 HDI Immersion gold PCB With 50 Ohm Impedance

This is a low-loss, high-performance multi-layer printed circuit board (PCB) constructed using TUC’s TU-883 core, featuring 20 copper layers

TAGS:

TU-883 Low loss PCB 20-layer circuit board TUC TU-883 PCB 3.0mm thick TU-883 PCB Impedance controlled PCB TU-883 Multilayer PCB

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