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Panasonic Megtron 6 (M6) 16-Layer 2.0mm HDI PCB for 5G and High-Speed Server Applications
Panasonic Megtron 6 (M6) 16-Layer 2.0mm HDI PCB for 5G and High-Speed Server Applications
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
Product Overview
This product is a 16-layer High-Density Interconnect (HDI) printed circuit board engineered for high-frequency and high-reliability applications. It utilizes Panasonic's Megtron 6 (R5775G) low-loss laminate as its base material, making it particularly suited for demanding fields such as 5G infrastructure, advanced automotive radar, and high-performance computing. The board features a complex multilayer construction with blind and buried vias, controlled impedance, and a 2.0mm finished thickness, ensuring robust performance and signal integrity in sophisticated electronic systems.
PCB Construction Details
Specification Category |
Details |
Base Material |
M6 (R5775G) |
Layer Count |
16 layers |
Board Dimensions |
110 mm x 110 mm (±0.15mm) |
Finished Board Thickness |
2.0 mm |
Minimum Trace/Space |
3/4 mils |
Minimum Hole Size |
0.2 mm |
Blind & Buried Vias |
L1-L3, L6-L9, L14-L16 |
Copper Weight (Finished) |
Outer Layers: 1oz (35μm) / Inner Layers: 0.5oz (17μm) & 1oz (35μm) |
Via Plating Thickness |
25 μm |
Via Fill |
0.2mm vias filled and capped |
Surface Finish |
Electroless Nickel Immersion Gold (ENIG) |
Solder Mask |
Green (Top & Bottom) |
Silkscreen |
White (Top & Bottom) |
Electrical Test |
100% tested prior to shipment |
Quality Standard |
IPC-Class-2 |
Additional Components & Features
Megtron 6 (M6) PCB is designed to support complex assemblies, accommodating 154 components with a total of 406 pads, including 137 thru-hole pads and 269 SMT pads (121 top, 148 bottom). The design incorporates 532 vias to facilitate interconnection across its 16 layers. Artwork was supplied in Gerber RS-274-X format. A critical feature is the strict Impedance Control, with predefined values for single-ended (50Ω, 75Ω) and differential pairs (100Ω) on critical signal layers to ensure signal integrity.
Material Advantages
The Panasonic Megtron 6 (M6) laminate is the cornerstone of this PCB's performance. It offers a stable dielectric constant (Dk) of 3.34-3.4 and an extremely low dissipation factor (Df) of 0.002-0.0037, minimizing signal loss at high frequencies. The material exhibits high thermal reliability, with a Tg >185°C and a thermal decomposition temperature (Td) of 410°C. It is compatible with standard FR-4 processing, is halogen-free, and complies with UL 94V-0 flammability and RoHS standards.
Typical Applications
This PCB is engineered for use in:
5G Communication: Base stations, millimeter-wave antennas, and RF front-ends (AAU).
Automotive Electronics: 77GHz millimeter-wave radar and ADAS.
Data Centers: High-speed server motherboards and 400G/800G optical modules.
Aerospace & Defense: Satellite communication and radar systems.
Consumer Electronics: High-frequency Wi-Fi 6E/7 routers and AR/VR devices.
Why Choose This PCB?
This board combines the electrical benefits of advanced Megtron 6 material with a precise HDI fabrication process, resulting in a reliable solution for high-speed digital and high-frequency RF applications. Its controlled construction ensures consistent performance, making it a dependable choice for mission-critical systems.
Order Now for High-Frequency Applications!
This 16-layer Megtron 6 PCB is ready to meet the demands of your most challenging designs, from 5G infrastructure to next-generation computing. Contact us today to discuss your project requirements and initiate the ordering process.