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Rogers RO4350B 18-Layer 3.2mm RF Microwave PCB for Base Station Antennas
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
Overview of Rogers RO4350B
This 18-layer rigid PCB is built on Rogers RO4350B core and RO4450F bondply materials, designed for high-frequency RF and microwave applications. With a finished thickness of 3.2 mm and dimensions of 218 mm x 497 mm (±0.15 mm), it supports complex, high-density designs requiring precision impedance control and thermal stability. The board incorporates advanced features like blind vias (L11-L18), resin-filled vias, via-in-pad, and press-fit holes, making it suitable for demanding environments such as cellular base stations and automotive radar systems.
PCB Construction Details
Parameter |
Specification |
Base Material |
Rogers RO4350B Core + RO4450F Bondply |
Layer Count |
18 Layers |
Board Dimensions |
218 mm x 497 mm (±0.15 mm) |
Finished Thickness |
3.2 mm |
Minimum Trace/Space |
4/4 mils |
Minimum Hole Size |
0.4 mm |
Blind Vias |
L11-L18 (Mechanical Drill) |
Copper Weight |
1 oz (Inner/Outer Layers) |
Via Plating Thickness |
20 μm |
Surface Finish |
Immersion Gold + Selective Hard Gold (50 μin) |
Solder Mask (Top/Bottom) |
Blue |
Silkscreen (Top/Bottom) |
White |
Special Features |
Via-in-Pad, Press-Fit Holes, All Vias Resin-Filled |
Electrical Test |
100% Tested Pre-Shipment |
Quality Standard |
IPC-Class 2 |
Additional Components & Features
Material Advantages:
Rogers RO4350B offers a stable dielectric constant (Dk 3.48 ±0.05) and low dissipation factor (0.0037) at 10 GHz, ensuring minimal signal loss. Its CTE closely matches copper, providing excellent dimensional stability for multilayer designs. The RO4450F bondply enables reliable sequential lamination cycles, supporting complex stackups. Both materials are UL 94 V-0 rated and compatible with lead-free assembly processes.
Design Complexity:
The board accommodates 651 components, 779 total pads (338 thru-hole, 262 top SMT, 179 bottom SMT), and 632 vias across 12 nets. Gerber RS-274-X artwork ensures precise manufacturing alignment.
Typical Applications:
Cellular base station antennas, RF identification tags, automotive radar systems, LNBs for direct broadcast satellites, and high-power RF amplifiers.
Why Choose This PCB?
This PCB combines Rogers high-frequency materials with precision engineering to deliver reliable performance in extreme thermal and RF environments. Its robust construction, validated by IPC-Class 2 standards, ensures longevity and signal integrity for mission-critical applications.
Order Now for High-Frequency Applications!
Ideal for 5G infrastructure and automotive radar systems, this PCB guarantees low-loss signal transmission and thermal resilience. Submit your Gerber files for a customized quote to meet your project’s RF requirements.