Shenzhen Bicheng Electronics Technology Co., Ltd

+86-755-27374946 info@bicheng-enterprise.com

PCB Capability

Factory Process Capability (2025)

Substrate Types Standard FR-4, High Tg FR-4, High Frequency Materials, Rigid Polyimide, Flexible Polyimide, Transparent PET Materials, AL2O3 Ceramic, ZrO2 Ceramic etc.

Substrate Brands Shengyi, ITEQ, KB, Isola, Taiwan Union, Rogers Corp. Taconic, Wangling, Panasonic etc

Board Types Rigid PCB, Flexible Circuits, Rigid-Flex PCB, Hybrid PCB, HDI PCB, Heavy Copper, High Speed, High frequency etc.

Copper Clad Laminates(CCL)
High Tg FR-4: S1000-2M, TU-872 SLK, TU-768, TU-883, IT-180A, FR408HR, 370HR,

High CTI FR-4: S1600L, ST115

High speed: M6 (R5775G Core / R-5670 Prepreg)

Rogers Corp: RO4350B, RO4003C, RO4725JXR, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4830, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/duroid 6006, RT/Duroid 6010.2LM, RT/duroid 6035HTC; RT/duroid 5880LZ, RT/duroid 6202; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350; TC600; DiClad 880, DiClad 870, DiClad 527; IsoClad 917, IsoClad 933; CLTE-XT, CLTE-AT, CLTE-MW; CuClad 217, CuClad 233, CuClad 250.

Taconic: TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2,RF-30, RF-35, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z; CER-10; TSM-DS3

Wangling: F4BM217, F4BM220, F4BM233, F4BM245, F4BM255, F4BM265, F4BM275, F4BM294, F4BM300;
F4BME217, F4BME220, F4BME233, F4BME245, F4BME255, F4BME265, F4BME275, F4BME294, F4BME300;
F4BTM298, F4BTM300, F4BTM320, F4BTM350;
F4BTME298, F4BTME300, F4BTME320, F4BTME350;
TP300, TP440, TP600, TP615, TP960, TP1020, TP1100, TP1600, TP2000, TP2200, TP2500;
TF300, TF440, TF600, TF960, TF1020, TF1600;
F4BTMS220, F4BTMS233, F4BTMS255, F4BTMS265, F4BTMS294, F4BTMS300, F4BTMS350, F4BTMS430, F4BTMS450, F4BTMS615, F4BTMS1000;
TFA294, TFA300, TFA615, TFA1020;
WL-CT300, WL-CT330, WL-CT330Z, WL-CT338, WL-CT350, WL-CT440, WL-CT615.

Maximum Delivery Size 1200mm x 572 mm

Minimum Finished Board Thickness L≤2L: 0.15mm; 4L: 0.4mm

Maximum Finished Board Thickness 10.0 mm

Blind Buried Holes (Non-crossing) 0.1mm

Maximum Hole Aspect Ratio 15:01:00

Minimum Mechanical Drill Hole Diameter 0.1 mm

Through-hole Tolerance +/- 0.0762 mm

Press-fit Hole Tolerance +/- 0.05mm

Non-plated Copper Hole Tolerance +/- 0.05mm

Maximum Number of Layers 32

Internal and External Layer Maximum Copper Thickness 12Oz

Minimum Drill Hole Tolerance +/- 2mil

Minimum Layer-to-Layer Tolerance +/- 3mil

Minimum Line Width/Spacing 3mil/3mil

Minimum BGA Diameter 8mil

Impedance Tolerance < 50Ω ±5Ω; ≥50Ω±10%

Surface Treatment Processes
Leaded/Lead-free HASL, Immersion Gold, Immersion Silver, Immersion Tin, OSP, ENIG, ENEPIG, Pure gold, Carbon Ink, Peelable Mask, Gold Finger, etc.

Factory Process Capability (2025)
Substrate Types	Standard FR-4, High Tg FR-4, High Frequency Materials, Rigid Polyimide, Flexible Polyimide, Transparent PET Materials, AL2O3 Ceramic, ZrO2 Ceramic etc.
Substrate Brands	Shengyi, ITEQ, KB, Isola, Taiwan Union, Rogers Corp. Taconic, Wangling, Panasonic etc
Board Types	Rigid PCB, Flexible Circuits, Rigid-Flex PCB, Hybrid PCB, HDI PCB, Heavy Copper, High Speed, High frequency etc.
Copper Clad Laminates(CCL)	High Tg FR-4: S1000-2M, TU-872 SLK, TU-768, TU-883, IT-180A, FR408HR, 370HR, High CTI FR-4: S1600L, ST115 High speed: M6 (R5775G Core / R-5670 Prepreg)
	Rogers Corp: RO4350B, RO4003C, RO4725JXR, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4830, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/duroid 6006, RT/Duroid 6010.2LM, RT/duroid 6035HTC; RT/duroid 5880LZ, RT/duroid 6202; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350; TC600; DiClad 880, DiClad 870, DiClad 527; IsoClad 917, IsoClad 933; CLTE-XT, CLTE-AT, CLTE-MW; CuClad 217, CuClad 233, CuClad 250.
	Taconic: TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2,RF-30, RF-35, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z; CER-10; TSM-DS3
	Wangling: F4BM217, F4BM220, F4BM233, F4BM245, F4BM255, F4BM265, F4BM275, F4BM294, F4BM300; F4BME217, F4BME220, F4BME233, F4BME245, F4BME255, F4BME265, F4BME275, F4BME294, F4BME300; F4BTM298, F4BTM300, F4BTM320, F4BTM350; F4BTME298, F4BTME300, F4BTME320, F4BTME350; TP300, TP440, TP600, TP615, TP960, TP1020, TP1100, TP1600, TP2000, TP2200, TP2500; TF300, TF440, TF600, TF960, TF1020, TF1600; F4BTMS220, F4BTMS233, F4BTMS255, F4BTMS265, F4BTMS294, F4BTMS300, F4BTMS350, F4BTMS430, F4BTMS450, F4BTMS615, F4BTMS1000; TFA294, TFA300, TFA615, TFA1020; WL-CT300, WL-CT330, WL-CT330Z, WL-CT338, WL-CT350, WL-CT440, WL-CT615.
Maximum Delivery Size	1200mm x 572 mm
Minimum Finished Board Thickness	L≤2L: 0.15mm; 4L: 0.4mm
Maximum Finished Board Thickness	10.0 mm
Blind Buried Holes (Non-crossing)	0.1mm
Maximum Hole Aspect Ratio	15:01:00
Minimum Mechanical Drill Hole Diameter	0.1 mm
Through-hole Tolerance	+/- 0.0762 mm
Press-fit Hole Tolerance	+/- 0.05mm
Non-plated Copper Hole Tolerance	+/- 0.05mm
Maximum Number of Layers	32
Internal and External Layer Maximum Copper Thickness	12Oz
Minimum Drill Hole Tolerance	+/- 2mil
Minimum Layer-to-Layer Tolerance	+/- 3mil
Minimum Line Width/Spacing	3mil/3mil
Minimum BGA Diameter	8mil
Impedance Tolerance	< 50Ω ±5Ω; ≥50Ω±10%
Surface Treatment Processes	Leaded/Lead-free HASL, Immersion Gold, Immersion Silver, Immersion Tin, OSP, ENIG, ENEPIG, Pure gold, Carbon Ink, Peelable Mask, Gold Finger, etc.