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IT-180 10-Layer HDI PCB High Temperature PCB with Immersion Gold and 100 ohm Impedance

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

 

General Description

This is a 10-layer printed circuit board (PCB) constructed on ITEQs IT-180 FR-4 substrate (with a glass transition temperature, Tg, of 170), specifically designed for PLC control applications. IT-180 10-Layer HDI PCB has a finished thickness of 2.0 mm, featuring a green solder mask with white silkscreen and immersion gold plating on its pads. The PCB is supplied as a single-board unit.

 

Its high-density interconnection configuration includes blind vias (L1-L3, L7-L10) and buried vias (L3-L7). Impedance control of 100 ohms is implemented on the top layer, with a trace/space specification of 4 mils/5 mils.

All PCBs are fabricated in compliance with the IPC 6012 Class 2 standard, using the provided Gerber data for production. For shipment, each batch of 20 boards is vacuum-packed.

 

 

 

PCB Specifications

PCB Electrical Properties Tables
Click to expand/collapse the table
Item Description Value
Layer count 10 layer PCB 10 layer board
Board type Multilayer pcb Multilayer pcb board
Board size 168.38 x 273.34mm=1up 168.38 x 273.34mm=1up
Laminate Laminate Type FR4 IT-180A
Supplier ITEQ
Tg TG ≧170
Finished thickness 2.0+/-10% MM
Plating Thickness PTH Cu thickness >20 um
Inner layer Cu Thickness 1/1 OZ
Surface Cu thickness 35 um
Solder Mask Material type LP-4G G-05
Supplier Nan Ya
Color Green
Single / both sides Both Sides
S/M thickness >=10.0 um
3M tape test NO Peel Off
Legend Material type S-380W
Supplier Tai yo
Color White
Location Both Sides
3M tape test No peel off
Circuit Trace Width (mm) 0.203+/-20%mm
Spacing (mm) 0.203+/- 20%mm
Identification UL mark 94V-0
Date code 1025
Mark location CS
Surface Treatment ENIG Nickel 100u''
Gold ≧2u''
Reliabilty Tests Thermal shock test 288±5℃, 10sec ,3 cycles
solder abllity test 245±5℃
Function Electrioal Test 233+/-5℃
Standard IPC_6012C CLASS 2 100%
Appearance Visual inspection 100%
warp and twist <= 0.75%
Vias Through holes L1-L10
Blind vias & Buried vias L1-L3, L7-L10, L3-L7
Drill table (mm) No PTH/NPTH Size
1 Y 0.500*1.00+/-0.075
2 Y 0.508+/-0.075
3 Y 0.610+/-0.075
4 N 0.700+/-0.075
5 Y 0.711+/-0.075
6 Y 0.914+/-0.075
7 N 1.118+/-0.075
8 N 1.219+/-0.075
9 N 1.524+/-0.075
10 N 1.600+/-0.075
11 Y 2.540+/-0.075
12 Y 2.997+/-0.075
13 N 3.500+/-0.075

 

Typical Applications

CCTV Security

Wireless G Router

Programmable Controllers

Automotive (Engine room ECU)

Multilayer and HDI PCB

Backplanes

Data Storage

Server and Networking

Telecommunications

 

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Any Layer HDI PCBs;

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