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FR408HR 4-Layer 1.6mm Via in Pad HDI PCB with Tg190 for Networking and Communications
FR408HR 4-Layer 1.6mm Via in Pad HDI PCB with Tg190 for Networking and Communications
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
General Description
This FR408HR-based 4-layer rigid PCB is engineered for high-performance applications requiring enhanced thermal reliability and signal integrity.
FR408HR PCB board features a 1.6mm total thickness and is constructed with Isola’s advanced FR408HR laminate system, which combines a multifunctional resin formulation with E-glass reinforcement. Designed for demanding environments, this 4-Layer FR408HR PCB supports complex circuitry with high-density interconnects (HDI), fine trace widths, and advanced via structures, including blind and buried vias. Its compatibility with lead-free assembly and resistance to conductive anodic filament (CAF) make it suitable for industrial, networking, and medical applications.

PCB Construction Details
Layer/Material |
Copper Thickness (μm) |
Dielectric Thickness (μm) |
Specification |
Top Layer Copper |
45 |
- |
35μm base + 17μm plating |
Prepreg (FR408HR) |
- |
100 |
IPC-4101/24 |
Inner Layer 2 Copper |
35 |
- |
- |
Core (FR408HR) |
- |
1230 |
IPC-4101/24 |
Inner Layer 3 Copper |
35 |
- |
- |
Prepreg (FR408HR) |
- |
100 |
IPC-4101/24 |
Bottom Layer Copper |
45 |
- |
35μm base + 17μm plating |
Additional Components & Features
Board Specifications: 140mm × 160mm dimensions, 0.3mm minimum hole size, 102μm trace/space, blue solder mask (10μm) with white silkscreen on both sides.
Via Structure: Blind vias (top to inner layer 1), buried vias (inner layer 2 to 3), and filled/capped vias for enhanced reliability.
Statistics: 92 components, 201 pads (75 thru-hole, 126 SMT), 72 vias, and 8 nets.
Artwork & Quality: Gerber RS-274-X format, IPC-Class-3 compliance, and worldwide availability.
Material Advantages
FR408HR PCBs deliver 30% lower Z-axis expansion and 25% greater electrical bandwidth than conventional materials. Key attributes include:
Thermal Performance: Tg of 190°C, T260 >60 minutes, and 6× reflow (260°C) capability.
Electrical Properties: Dielectric constant of 3.65 and dissipation factor of 0.0095 at 10GHz.
Reliability: UV blocking for AOI compatibility, CAF resistance, and UL-94 V0 flammability rating.
Typical Applications
High-speed digital systems
Networking/communication infrastructure
Medical and industrial instrumentation
Storage peripherals and high-reliability HDI designs
Why Choose This PCB?
The combination of FR408HR laminate’s low-loss characteristics, robust thermal endurance, and support for dense interconnects ensures optimal performance in critical applications. Its compliance with IPC-Class-3 standards further guarantees exceptional workmanship and longevity.
Order Now for High-Reliability Applications!
Ideal for networking, medical, and industrial systems, this HDI PCB balances precision engineering with scalable production. Contact us to integrate this solution into your next project!

