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Rogers RO4003C and FR-4 Hybrid PCB 6-Layer 1.1mm High Tg PCB for RF and Millimeter Wave Applications
Rogers RO4003C and FR-4 Hybrid PCB 6-Layer 1.1mm High Tg PCB for RF and Millimeter Wave Applications
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
General Description
This 6-layer hybrid PCB combines Rogers RO4003C laminate with High Tg>280 °C FR-4 substrates to deliver optimal performance for RF and millimeter wave applications. 1.1mm Rogers RO4003C PCB board features a compact 83.50mm × 66mm dimension with ±0.15mm tolerance, supporting complex circuit designs with 4/4 mil trace/space capability. The construction includes blind vias (top to L2) and buried vias (L3-L4), complemented by 0.2mm filled and capped vias for enhanced reliability. With impedance control on 4mil traces for 50 ohm matching and immersion gold surface finish, RO4003C PCB ensures consistent signal integrity in demanding high-frequency environments.
PCB Construction Specifications
Parameter |
Specification |
Layer Count |
6 Layers |
Base Material |
RO4003C + FR-4 Mixed |
Board Thickness |
1.1mm |
Board Dimensions |
83.50mm × 66mm |
Tolerance |
±0.15mm |
Min Trace/Space |
4/4 mils |
Min Hole Size |
0.2mm |
Copper Weight |
1oz (Inner/Outer) |
Via Plating Thickness |
20μm |
Surface Finish |
Immersion Gold |
Solder Mask |
Matt Green (Both Sides) |
Silkscreen |
White (Top Side Only) |
Via Treatment |
0.2mm Filled and Capped |
Impedance Control |
50Ω on 4mil Traces |
Testing |
100% Electrical Test |
Additional Components & Features
6-Layer RO4003C PCB design incorporates 51 components with 82 total pads, comprising 53 through-hole pads and 29 top-side SMT pads. The layout utilizes 49 vias across 6 nets, supporting efficient signal routing. Special features include series number printing and comprehensive impedance control. The board is supplied in Gerber RS-274-X format and manufactured to IPC-Class-2 standards, with worldwide availability ensuring broad accessibility.
Material Advantages
Rogers RO4003C PCB delivers stable dielectric constant (3.38±0.05) and low dissipation factor (0.0027) at 10GHz, with excellent thermal properties including Tg >280°C and CTE matched to copper. The material's low moisture absorption (0.06%) and thermal conductivity (0.71 W/m/°K) ensure reliability in varying environmental conditions. FR-4 S1000-2M substrate provides enhanced mechanical processability, UV blocking for AOI compatibility, and superior anti-CAF performance, creating a robust foundation for high-frequency applications.
Typical Applications
Commercial airline broadband antennas
Microstrip and stripline circuits
Millimeter wave systems
Radar and guidance systems
Point-to-point digital radio antennas
Why Choose This PCB?
The hybrid construction leverages RO4003C PCB's superior high-frequency characteristics while maintaining the cost-effectiveness and processability of FR-4 materials. This combination delivers optimal performance for RF applications without requiring specialized processing equipment or procedures.
Order Now for RF and Millimeter Wave Applications!
This 6-layer hybrid PCB solution offers reliable performance for your high-frequency design requirements. Contact us today to discuss how this technology can enhance your RF and millimeter wave systems with consistent signal integrity and robust construction.