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WL-CT Series High-Frequency PCB: Advanced Organic Polymer Ceramic-Based Circuit Board Solution with High TG above 280

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

 

Brief Introduction

The WL-CT series represents a cutting-edge line of organic polymer ceramic fiberglass cloth-covered copper boards, engineered as thermosetting resin-based high-frequency materials. These innovative circuit materials combine hydrocarbon resin, ceramic composites, and fiberglass cloth in their dielectric layer composition, delivering exceptional low-loss performance that meets the demanding requirements of advanced high-frequency designs.

 

A significant advantage of WL-CT PCB materials lies in their processing compatibility with standard FR4 manufacturing techniques, offering substantially simpler fabrication processes compared to conventional PTFE materials while ensuring superior circuit stability and consistency. This domestic solution serves as an excellent substitute for imported high-frequency materials in various applications.

 

The unique combination of hydrocarbon resin and composite ceramics provides outstanding electrical and thermal properties, including:

 

Excellent low-loss characteristics

 

High-temperature resistance capabilities

 

Remarkable temperature stability

 

Stable temperature coefficient of dielectric constant

 

 

Low thermal expansion coefficient

 

High Tg value exceeding 280°C

 

The series offers multiple dielectric constant options including 3.00, 3.30, 3.38, 3.48, 4.10, and 6.15, providing design flexibility for various application requirements. These materials are compatible with both standard ED copper foil and reverse-treated RTF copper foil, with RTF copper foil delivering exceptional Passive Intermodulation (PIM) performance while reducing conductor loss and insertion loss. The back-treated RTF copper foil features an increased material thickness of 0.018mm (0.7mil), ensuring superior adhesion properties.

 

Additionally, the WL-CT series PCB can be combined with aluminum substrates to create high-performance aluminum-based high-frequency materials. The excellent mechanical and physical properties enable multiple lamination cycles, making these materials ideally suited for multilayer constructions, high-layer-count boards, and backplane processing applications. The series demonstrates exceptional processability for dense via patterns and fine line routing, supporting the most demanding high-frequency circuit designs.

 

Product Features

  • Low dielectric constant tolerance and low loss.
  • Thermosetting resin-based system with improved PCB processability and heat resistance.
  • Excellent temperature coefficient of dielectric constant with minimal temperature variation.
  • Thermal expansion coefficients in the X/Y directions equivalent to copper foil; low thermal expansion coefficient in the Z direction ensures dimensional stability and reliable copper connections in the holes.
  • High TG value above 280°C, maintaining dimensional stability and copper quality even at high temperatures.
  • High thermal conductivity, superior to thermoplastic materials of the same grade, suitable for high-power applications.
  • Commercialized, mass-produced, cost-effective products.
  • Excellent resistance to radiation, maintaining stable dielectric and physical properties even after exposure to radiation.
  • Low outgassing performance, meeting the vacuum outgassing requirements for aerospace applications.

 

Product Models & Data Sheet

PCB Electrical Properties Tables
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Product Technical Parameters Product Models & Data Sheet
Product Features Test Conditions Unit WL-CT300 WL-CT330 WL-CT330Z WL-CT338 WL-CT350 WL-CT440 WL-CT615
Dielectric Constant (Typical) 10GHz / 3.00 3.30 3.30 3.38 3.48 4.10 6.15
Dielectric Constant (Design) 10GHz / 2.98 3.45 3.45 3.55 3.66 4.38 6.4
Dielectric Constant Tolerance / / ±0.05 ±0.06 ±0.06 ±0.05 ±0.05 ±0.08 ±0.15
Loss Tangent (Typical) 2GHz / 0.0025 0.0021 0.0025 0.0023 0.0030 0.0040 0.0032
10GHz / 0.0030 0.0026 0.0030 0.0029 0.0039 0.0050 0.0040
20GHz / 0.0036 0.0033 0.0035 0.0038 0.0048 / /
Dielectric Constant Temperature Coefficient -55 º~150ºC PPM/℃ 27 43 43 45 52 -21 -122
Peel Strength 1 OZ RTF copper N/mm 0.85 1.0 0.85 1.0 0.85 1.0 0.9
1 OZ RTFcopper N/mm 0.72 0.72 0.72 0.72 0.72 Not compatible Not compatible
Volume Resistivity Standard Condition MΩ.cm 3×108 5×109 5×109 6×109 1×109 1×109 2×107
Surface Resistivity Standard Condition 2×108 5×109 5×109 7×108 4×109 5×107 5×106
Electrical Strength (Z direction) 5KW,500V/s KV/mm 28 22 22 31 31 27 30
Breakdown Voltage (XY direction) 5KW,500V/s KV 35 22 22 30 30 25 25
Coefficientof Thermal Expansion (X, Y direction) -55 º~288ºC ppm/ºC 15,14 15,13 15, 13 14, 16 11, 14 14, 18 15, 17
Coefficientof Thermal Expansion (Z direction) -55 º~288ºC ppm/ºC 31 39 39 50 34 35 33
Thermal Stress 288℃, 10s,3 times / No Delamination No Delamination No Delamination No Delamination No Delamination No Delamination No Delamination
Water Absorption 20±2℃, 24 hours % 0.15 0.02 0.05 0.04 0.05 0.12 0.08
Density Room Temperature g/cm3 1.57 1.82 1.78 1.78 1.90 2.00 2.18
Long-Term Operating Temperature High-Low Temperature Chamber -55~+260 -55~+260 -55~+260 -55~+260 -55~+260 -55~+260 -55~+260
Thermal Conductivity Z direction W/(M.K) 0.41 0.59 0.59 0.70 0.70 0.66 0.72
PIM Paired with RTF copper foil. dBc ≤-158 ≤-157 ≤-157 ≤-158 ≤-157 N/A N/A
Flammability UL-94 Grade V-0 Non-flame retardant V-0 Non-flame retardant V-0 V-0 V-0
TG Standard >280℃ >280℃ >280℃ >280℃ >280℃ >280℃ >280℃
TD Initial Value 412 421 386 421 386 402 398
Halogen Yes No Yes No Yes Yes No
Material Composition Hydrocarbon + Ceramic + Fiberglass cloth

 

 Our PCB Capability (WL-CT)

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PCB Capability (WL-CT Series)
PCB Material: Hydrocarbon resin, ceramic, and glass fiber cloth
Designation (WL-CT Series) Designation DK DF
WL-CT300 3.0±0.05 0.0030
WL-CT330 3.3±0.06 0.0026
WL-CT330Z 3.3±0.06 0.0030
WL-CT338 3.38±0.05 0.0029
WL-CT350 3.48±0.05 0.0039
WL-CT440 4.1±0.08 0.0050
WL-CT615 6.15±0.15 0.0040
Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness ED Copper TRF Copper
4mil /
8mil 8.7mil
12mil /
16mil /
20mil 20.7mil
28mil /
32mil 32.7mil
40mil 40.7mil
60mil 60.7mil
80mil 80.7mil
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

A WL-CT PCB and Applications

Displayed on the screen is a double-sided 1.6mm WL-CT338 PCB with immersion gold coating specifically designed for filters. WL-CT PCBs are versatile and widely used in various applications, including:

Base station antennas and satellite antennas.

Automotive radar, sensors, and navigation systems.

Power amplifiers.

Satellite high-frequency heads.

RF devices and filters.

WIMAX antennas and distributed antennas.

Small-sized patch antennas.

 

Final (WL-CT series aluminum-based boards)

This series of laminates provides aluminum-based substrates, where one side of the dielectric layer is covered with copper foil, and the other side is covered with an aluminum-based layer. It serves for shielding or heat dissipation purposes. The model numbers are WL-CT***-AL. For instance, WL-CT350-AL represents WL-CT350 with an aluminum-based substrate.