TU-883 8-Layer 1.45mm Prototype PCB for RF and Server Backplane Application

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

Overview of this type of PCB

This product is an 8-layer impedance-controlled HDI PCB designed for demanding high-frequency applications. Manufactured using TU-883 (ThunderClad 2) low-loss material, this board features a 1.45mm thick construction with sophisticated via technology including blind vias (L1-L2, L7-L8), buried vias (L2-L7), and back-drilled vias (L1-L6).

TU-883 PCB implements precise impedance control for multiple differential pairs - 100 ohm on top layer, 90 ohm on bottom layer, and 50 ohm on layer 6 - ensuring signal integrity in high-speed transmission environments. With ENEPIG surface finish and matte black solder mask, TU-883 PCB delivers reliable performance for advanced electronic systems requiring stable signal transmission characteristics.

PCB Construction Details

 Additional Components & Features

This compact board (97.3mm x 67.7mm) accommodates 49 components distributed across 98 total pads, including 46 thru-hole pads, 38 top SMT pads, and 14 bottom SMT pads. The design utilizes 63 vias to connect 6 nets, featuring counterholes on the top layer (0.5mm deep, 90°) and edge plating in designated areas. Supplied in Gerber RS-274-X format and manufactured to IPC-Class-2 standards, this PCB is available worldwide with each shipment containing 20 boards per package.

Material Advantages

TU-883 material delivers exceptional high-frequency performance with a dielectric constant of 3.39 and dissipation factor of 0.0045 at 10GHz. This halogen-free material offers high Tg (170°C by TMA), stable Dk/Df performance across frequency and temperature ranges, excellent moisture resistance, and superior CAF resistance. Compatible with lead-free processes and FR-4 manufacturing methods, it provides reliable thermal stability and improved z-axis CTE for demanding applications.

Typical Applications

TU-883 PCB is ideally suited for radio frequency systems, server backplanes, high-performance computing, telecommunications base stations, office routers, line cards, and storage applications where signal integrity at high frequencies is critical.

Why Choose This PCB?

This 8-layer HDI PCB combines the superior electrical properties of TU-883 material with advanced impedance control and back-drilling technology, delivering optimal performance for high-speed digital and RF applications. The comprehensive via structure and precise manufacturing controls ensure reliable operation in demanding environments.

Order Now for High-Frequency Applications!

Incorporate this high-performance PCB into your next RF or server backplane design to ensure superior signal integrity and reliability. Contact us today to discuss your specific requirements and receive a competitive quotation for your project needs.