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0.5mm-1.6mm TU-883 PCB Very Low Loss and High Thermal Reliability PCB with ENIG ENEPIG Pure gold
0.5mm-1.6mm TU-883 PCB Very Low Loss and High Thermal Reliability PCB with ENIG ENEPIG Pure gold
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
Brief Introduction
ThunderClad 2 (TU-883 PCB) is a ultra-low-loss material formulated with a high-performance resin system. Reinforced with standard woven E-glass, TU-883 material features an engineered resin composition that delivers an extremely low dielectric constant (Dk) and dissipation factor (Df)—key properties that make it ideal for high-speed, low-loss, radio frequency (RF), and wireless circuit applications.
ThunderClad 2 is fully compatible with environmentally friendly lead-free manufacturing processes, while also aligning with standard FR-4 production workflows to ensure ease of integration. TU-883 laminates offer a suite of enhanced performance attributes, including excellent moisture resistance, optimized coefficient of thermal expansion (CTE), superior chemical resistance, reliable thermal stability, and strong resistance to conductive anodic filament (CAF) formation.
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Features &Benefits
Excellent electrical properties
Dielectric constant less than 4.0
Dissipation factor less than 0.005
Stable and flat Dk/Df performance over frequency and temperature
Compatible with modified FR-4 processes
Excellent moisture resistance and Lead Free reflow process compatible
Improved z-axis thermal expansion
Anti-CAF capability
Excellent through-hole and soldering reliability
Halogen Free
Typical Properties of TU-883
| Typical Values | Test Condition | SPEC | |
| Thermal | |||
| Tg (DMA) | 220 °C | ||
| Tg (TMA) | 170 °C | E-2/105+des | N/A |
| Td (TGA) | 420 °C | ||
| CTE z-axis α1 | 35 ppm/°C | Pre-Tg | < 60 ppm/°C |
| CTE z-axis α2 | 240 ppm/°C | Post-Tg | < 300 ppm/°C |
| CTE z-axis | 2.50% | 50 to 260°C | < 3.0% |
| Thermal Stress, Solder Float, 288°C | > 60 sec | A | > 10 sec |
| T-260 | > 60 min | > 30 min | |
| T-288 | > 60 min | E-2/105+des | > 15 min |
| T-300 | > 60 min | ||
| Flammability | 94V-0 | E-24/125+des | 94V-0 |
| Electrical | |||
| Permittivity (RC63%) | |||
| 1GHz (SPC method) | 3.60 | ||
| 5GHz (SPC method) | 3.58 | C-24/23/50 | N/A |
| 10GHz (SPC method) | 3.57 | ||
| Loss Tangent (RC63%) | |||
| 1GHz (SPC method) | 0.0030 | ||
| 5GHz (SPC method) | 0.0037 | C-24/23/50 | N/A |
| 10GHz (SPC method) | 0.0046 | ||
| Volume Resistivity | > 1010 MΩ•cm | C-96/35/90 | > 106 MΩ•cm |
| Surface Resistivity | > 108 MΩ | C-96/35/90 | > 104 MΩ |
| Electric Strength | > 40 KV/mm | - | > 30 KV/mm |
| Dielectric Breakdown Voltage | > 50 KV | - | > 40 KV |
| Mechanical | |||
| Young’s Modulus | |||
| Warp Direction | 28 GPa | A | N/A |
| Fill Direction | 26 GPa | ||
| Flexural Strength | |||
| Lengthwise | > 60,000 psi | A | > 60,000 psi |
| Crosswise | > 50,000 psi | A | > 50,000 psi |
| Peel Strength, 1.0 oz. Cu foil | 4~6 lb/in | A | > 4 lb/in |
| Water Absorption | 0.08% | E-1/105+des+D-24/23 | < 0.8 % |
Our PCB Capability (TU-883) |
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PCB Material: |
High Temperature Resin |
Designation: |
TU-883 |
Dielectric constant: |
3.60 at 1GHz |
Layer count: |
Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm) |
PCB thickness: |
0.5mm,0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver, ENEPIG, Pure gold etc.. |
Technology: |
HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc. |