F4BME Low-Loss PTFE PCB Laminates with Controlled DK and PIM Performance

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

The F4BM series PCB represents a technologically advanced category of high-frequency PCB laminates, manufactured through a precisely controlled process that combines fiberglass cloth with polytetrafluoroethylene (PTFE) resin and film. This sophisticated formulation delivers significantly enhanced electrical performance over standard F4B materials, featuring a wider selection of dielectric constants (Dk), reduced dielectric loss (Df), superior insulation resistance, and exceptional operational stability. These materials provide a dependable domestic alternative to comparable international products.

The product line offers specialized copper foil configurations to address different application requirements. The standard F4BM variant utilizes Electro-Deposited (ED) copper foil, delivering cost-efficient performance for systems without stringent Passive Intermodulation (PIM) specifications. For demanding RF applications, the F4BME version incorporates Reverse-Treated Foil (RTF) copper, delivering superior low-PIM characteristics, enhanced precision in circuit patterning, and reduced conductor loss.

Through precise manipulation of the PTFE-to-fiberglass ratio, both F4BM and F4BME laminates achieve exacting control over dielectric properties while preserving low-loss characteristics and mechanical stability. Increasing the fiberglass content elevates the dielectric constant while simultaneously improving dimensional stability, reducing the coefficient of thermal expansion (CTE), and enhancing thermal drift performance, though with a minimal trade-off in dielectric loss parameters.

Features & Benefits

-DK options available: 2.17 to 3.0, customizable DK

-Low loss

-F4BME paired with RTF copper foil, excellent PIM performance

-Diverse sizes, cost-effective

-Radiation resistance, low outgassing

-Commercialized, large-scale production, high cost-effectiveness

Laminate Models and Data Sheet

PCB Electrical Properties Tables

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Product Technical Parameters

Product Model & Data Sheet

Product Features

Test Conditions

Unit

F4BME217

F4BME220

F4BME233

F4BME245

F4BME255

F4BME265

F4BME275

F4BME294

F4BME300

Dielectric Constant (Typical)

10GHz

2.17

2.2

2.33

2.45

2.55

2.65

2.75

2.94

3.0

Dielectric Constant Tolerance

±0.04

±0.05

±0.06

Loss Tangent (Typical)

10GHz

0.001

0.0011

0.0012

0.0013

0.0015

0.0016

0.0017

20GHz

0.0014

0.0015

0.0017

0.0018

0.0019

0.0021

0.0023

0.0025

Dielectric Constant Temperature Coefficient

-55ºC～150ºC

PPM/℃

-150

-142

-130

-120

-110

-100

-92

-85

-80

Peel Strength

1 OZ F4BM

N/mm

>1.8

1 OZ F4BME

N/mm

>1.6

Volume Resistivity

Standard Condition

MΩ.cm

≥6×10^6

Surface Resistivity

Standard Condition

MΩ

≥1×10^6

Electrical Strength (Z direction)

5KW，500V/s

KV/mm

>23

>25

>28

>30

Breakdown Voltage (XY direction)

5KW，500V/s

>30

>32

>34

>35

>36

Coefficientof Thermal Expansion

XY direction

-55 º~288ºC

ppm/ºC

25, 34

22, 30

20, 25

16, 21

14, 17

14, 16

12, 15

Z direction

-55 º~288ºC

ppm/ºC

240

205

187

173

142

112

Thermal Stress

260℃, 10s，3 times

No delamination

Water Absorption

20±2℃, 24 hours

≤0.08

Density

Room Temperature

g/cm3

2.17

2.18

2.20

2.22

2.25

2.28

2.29

Long-Term Operating Temperature

High-Low Temperature Chamber

℃

-55～+260

Thermal Conductivity

Z direction

W/(M.K)

0.24

0.28

0.30

0.33

0.36

0.38

0.41

0.42

PIM

Only applicable to F4BME

dBc

≤-159

Flammability

UL-94

V-0

Material Composition

PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.

Our PCB Capability (F4BME )

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PCB Capability (F4BME)
PCB Material:	PTFE glass fiber cloth copper clad laminates
Designation (F4BME )	F4BME	DK (10GHz)	DF (10 GHz)
	F4BME217	2.17±0.04	0.0010
	F4BME220	2.20±0.04	0.0010
	F4BME233	2.33±0.04	0.0011
	F4BME245	2.45±0.05	0.0012
	F4BME255	2.55±0.05	0.0013
	F4BME265	2.65±0.05	0.0013
	F4BME275	2.75±0.05	0.0015
	F4BME294	2.94±0.06	0.0016
	F4BME300	3.00±0.06	0.0017
Layer count:	Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (or overall thickness)	0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

A PCB and Typical Applications

Displayed on the screen is a 2-layer copper high-frequency PCB with a low DK of 2.2, utilizing F4BME material and HASL surface finish on a 3.0mm substrate.

F4BME high-frequency PCB finds applications in microwave, RF, and radar systems, as well as in phase shifters, passive components, power dividers, couplers, combiners, feed networks, phased array antennas, satellite communications, and base station antennas.

Final - F4BME series aluminum-based/copper-based boards

These F4BME series of laminates can provide aluminum-based or copper-based materials, where one side of the dielectric layer is covered with copper foil, and the other side is covered with either aluminum-based material or copper-based , serving as shielding or heat dissipation purposes.

Model examples

F4BME225-CU represents F4BME225 with an aluminum-based substrate.

Tags:

RTF copper foil PCB low conductor loss PCB F4BME High-Frequency PCB F4BME Controlled DK PCB F4BME series PCB F4BME PCB Datasheet

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F4BME Low-Loss PTFE PCB Laminates with Controlled DK and PIM Performance