F4BTM High Frequency PCB Advanced Low Thermal Expansion Coefficient Materials for High-Performance Circuitry

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

Introduction

Discover F4BTM series PCB, meticulously crafted by combining fiberglass cloth, nano-ceramic particles, and polytetrafluoroethylene (PTFE) resin under strict manufacturing controls. The core F4BM dielectric is innovatively modified with nano-ceramics, resulting in a material that offers a higher dielectric constant, superior thermal performance, excellent dimensional stability, and high insulation resistance, plus improved thermal conductivity—without compromising on low signal loss.

Choose the perfect laminate for your design needs: F4BTM with standard ED copper foil is ideal for general applications without strict PIM requirements. For superior performance in critical applications like 5G infrastructure, the F4BTME version features reverse-treated copper foil (RTF). This ensures outstanding Passive Intermodulation (PIM) characteristics, enables more precise control over circuit lines, and minimizes conductor loss for enhanced signal integrity.

Features & Benefits

- DK range from 2.98 to 3.5 is available

- Addition of ceramics enhances the performance.

- F4BTME exhibits excellent PIM performance,

- Comes in various thicknesses and sizes, offers cost savings

- Commercialization, large-scale production, and high cost-effectiveness.

- Radiation-resistant and low out-gassing properties

Models & Data Sheet

PCB Electrical Properties Tables

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Product Technical Parameters				Product Models & Data Sheet
Product Features		Test Conditions	Unit	F4BTM298	F4BTM300	F4BTM320	F4BTM350
Dielectric Constant (Typical)		10GHz	/	2.98	3.0	3.2	3.5
Dielectric Constant Tolerance		/	/	±0.06	±0.06	±0.06	±0.07
Loss Tangent (Typical)		10GHz	/	0.0018	0.0018	0.0020	0.0025
		20GHz	/	0.0023	0.0023	0.0026	0.0035
Dielectric Constant Temperature Coefficient		-55 º~150ºC	PPM/℃	-78	-75	-75	-60
Peel Strength		1 OZ F4BTM	N/mm	>1.6	>1.6	>1.6	>1.6
		1 OZ F4BTME	N/mm	>1.4	>1.4	>1.4	>1.4
Volume Resistivity		Standard Condition	MΩ.cm	≥1×10^7	≥1×10^7	≥1×10^7	≥1×10^7
Surface Resistivity		Standard Condition	MΩ	≥1×10^6	≥1×10^6	≥1×10^6	≥1×10^6
Electrical Strength (Z direction)		5KW，500V/s	KV/mm	>26	>30	>32	>32
Breakdown Voltage (XY direction)		5KW，500V/s	KV	>34	>35	>40	>40
Coefficientof Thermal Expansion	XY direction	-55 º~288ºC	ppm/ºC	15，16	15，16	13，15	10，12
	Z direction	-55 º~288ºC	ppm/ºC	78	72	58	51
Thermal Stress		260℃, 10s，3 times		No delamination	No delamination	No delamination	No delamination
Water Absorption		20±2℃, 24 hours	%	≤0.05	≤0.05	≤0.05	≤0.05
Density		Room Temperature	g/cm3	2.25	2.25	2.20	2.20
Long-Term Operating Temperature		High-Low Temperature Chamber	℃	-55～+260	-55～+260	-55～+260	-55～+260
Thermal Conductivity		Z direction	W/(M.K)	0.42	0.42	0.50	0.54
PIM		Only applicable to F4BTME	dBc	≤-160	≤-160	≤-160	≤-160
Flammability		/	UL-94	V-0	V-0	V-0	V-0
Material Composition		/	/	PTFE, Fiberglass Cloth, nano-ceramics F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil.

Our PCB Capability (F4BTM)

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PCB Capability (F4BTM)
PCB Material:	PTFE / glass fiber cloth / Nano-ceramic filler
Designation (F4BTM )	F4BTM	DK (10GHz)	DF (10 GHz)
	F4BTM298	2.98±0.06	0.0018
	F4BTM300	3.0±0.06	0.0018
	F4BTM320	3.2±0.06	0.0020
	F4BTM350	3.5±0.07	0.0025
Layer count:	Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (or overall thickness)	0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

F4BTM PCB and Applications

This image showcases a DK 3.0 F4BTM PCB, built on a 1.524mm substrate and finished with HASL surface treatment. This high-performance circuit board is engineered for demanding applications across Antenna systems, Mobile Internet, Sensor Networks, Radar, Millimeter-Wave Radar, Aerospace, Satellite Navigation (including Beidou), Missile-borne systems, Power Amplifiers, and Radio Frequency (RF) components.

A key feature of the F4BTM series is its availability in both aluminum-based and copper-based substrate configurations. In these constructions, one side of the dielectric layer is bonded to a copper foil for circuit formation, while the other side is bonded to either an aluminum or copper metal core. This design is optimal for effective electromagnetic shielding and superior heat dissipation. For example, the model F4BTM300-AL specifically denotes an F4BTM300 laminate with an aluminum base.

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F4BTM High Frequency PCB F4BTM series PCB Low CTE PCB Loss Tangent PCB F4BTM series laminates PTFE based PCB

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F4BTM High Frequency PCB Advanced Low Thermal Expansion Coefficient Materials for High-Performance Circuitry