RT/duroid 6010.2LM High Frequency PCB Material Introduction Greetings, everyone, In today's discussion, we will explore a specific type of high DK microwave PCB known as Rogers RT/duroid 6010.2LM PCB. Rogers RT/duroid 6010.2LM laminates are ceramic-PTFE composites designed to meet the requirements of electronic and microwave circuit applications that demand a high dielectric constant. By offering high dielectric constants (Dk), the RT/duroid 6010.2LM laminates facilitate the reduction of circuit size. These materials have low loss properties, making them particularly suitable for operating at X-band frequencies or below. Furthermore, their precise Dk and thickness control ensure consistent circuit performance. Utilizing high dielectric constant materials can effectively shrink the size of microwave circuits as it necessitates narrower conductors to maintain controlled impedance. This reduction in size leads to shorter resonators and overall smaller filters. Data Sheet Rogers RT/duroid 6010.2LM is a high-performance microwave PCB material with the following typical values: The dielectric constant (εProcess) is 10.2±0.25 at 10 GHz and 23℃. The measurement is done using the IPC-TM-650 2.5.5.5 Clamped stripline method. The dielectric constant (εDesign) is 10.7 in the Z direction, measured from 8 GHz to 40 GHz using the Differential Phase Length Method. The dissipation factor is 0.0023 at 10 GHz, measured in the Z direction. The thermal coefficient of the dielectric constant is -425 ppm/℃ in the Z direction, measured between -50℃ and 170℃. The volume resistivity is 5 x 10^5 Mohm.cm, measured in the A direction using IPC 2.5.17.1. The surface resistivity is 5 x 10^6 Mohm, measured in the A direction using IPC 2.5.17.1. The surface resistivity is 5 x 10^6 Mohm, measured in the A direction using IPC 2.5.17.1. Rogers RT/duroid 6010.2LM PCB material's compressive properties, including Young's Modulus, Ultimate Stress, and Ultimate Strain, are measured in the Z direction using ASTM D695 with a strain rate of 0.05/min. The flexural modulus is measured in the X direction using ASTM D790. The material's Ultimate Stress and Deformation under load are also provided. The moisture absorption of the material is 0.01% when exposed to 50℃ and 48 hours, with a thickness of 0.050" (1.27mm), measured using IPC-TM-650 2.6.2.1. The thermal conductivity is 0.86 W/m/k at 80℃, measured using ASTM C518. The coefficient of thermal expansion is provided in ppm/℃ for the X, Y, and Z directions at 23℃ and 50% RH, measured using IPC-TM-650 2.4.41. The Td (decomposition temperature) of the material is 500℃, measured using TGA (Thermogravimetric Analysis) according to ASTM D3850. The Td (decomposition temperature) of the material is 500℃, measured using TGA (Thermogravimetric Analysis) according to ASTM D3850. The specific heat is provided in j/g/k (BTU/ib/OF) as a calculated value. The copper peel strength is 12.3 pli (pounds per linear inch) or N/mm (Newtons per millimeter), measured after solder float using IPC-TM-650 2.4.8. The material has a V-0 rating for flammability, indicating it meets the UL 94 standard. Finally, the material is compatible with lead-free processes. RT/duroid 6010.2LM Typical Value Property RT/duroid 6010.2LM Direction Units Condition Test Method Dielectric Constant,εProcess 10.2±0.25 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped stripline Dielectric Constant,εDesign 10.7 Z 8GHz to 40 GHz Differential Phase Length Method Dissipation Factor,tanδ 0.0023 Z 10 GHz/A IPC-TM-650 2.5.5.5 Thermal Coefficient of ε -425 Z ppm/℃ -50℃-170℃ IPC-TM-650 2.5.5.5 Volume Resistivity 5 x 10^5 Mohm.cm A IPC 2.5.17.1 Surface Resistivity 5 x 10^6 Mohm A IPC 2.5.17.1 Tensile Properties ASTM D638 (0.1/min. strain rate) Young's Modulus 931(135) , 559(81) X , Y MPa(kpsi) A Ultimate Stress 17(2.4) , 13(1.9) X , Y MPa(kpsi) A Ultimate Strain 9 to 15 , 7 to 14 X , Y % A Compressive Properties ASTM D695 (0.05/min. strain rate) Young's Modulus 2144 (311) Z MPa(kpsi) A Ultimate Stress 47(6.9) Z MPa(kpsi) A Ultimate Strain 25 Z % Flexural Modulus 4364 (633) , 3751 (544) X MPa(kpsi) A ASTM D790 Ultimate Stress 36 (5.2), 32 (4.4) X Y MPa(kpsi) A Deformation under load 0.26 , 1.3 Z , Z % 24hr/50℃/7MPa 24hr/150℃/7MPa ASTM D261 Moisture Absorption 0.01 % D48/50℃ 0.050"(1.27mm) thick IPC-TM-650 2.6.2.1 Thermal Conductivity 0.86 W/m/k 80℃ ASTM C518 Coefficient of Thermal Expansion 24 X ppm/℃ 23℃/50% RH IPC-TM-650 2.4.41 Td 500 ℃?TGA ASTM D3850 Density 3.1 g/cm3 ASTM D792 Specific Heat 1.00(0.239) j/g/k Calculated Copper Peel 12.3 (2.1) pli (N/mm) after solder float IPC-TM-650 2.4.8 Flammability V-0 UL 94 Lead-free Process Compatible Yes Our PCB Capability (RT/duroid 6010.2LM) We offer manufacturing capabilities for RT/duroid 6010.2LM PCB that cater to various design requirements: We can produce RT/duroid 6010.2LM PCBs with single-sided, double-sided, multilayer, or hybrid configurations. This allows us to accommodate different layer requirements based on your specific needs. Our manufacturing process supports copper weight options of 1oz (35μm) and 2oz (70μm) for RT/duroid 6010.2LM. You can select the appropriate copper weight to determine the thickness of the copper layer on your PCB We provide flexibility in dielectric thickness options for RT/duroid 6010.2LM, including 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm), and 75mil (1.90mm). This allows you to design PCBs with different layer thicknesses as per your requirements. Rogers RT/duroid 6010.2LM PCBs can be manufactured with a maximum size of ≤400mm X 500mm. This specification defines the maximum dimensions for the PCBs produced using this high-frequency material. Rogers RT/duroid 6010.2LM PCBs are available with a range of solder mask colors at our facility, including green, black, blue, yellow, red, and more. The solder mask serves to insulate and protect the copper traces on the PCB, ensuring reliable electrical performance. We provide multiple surface finish options for PCBs made with RT/duroid 6010.2LM. These include bare copper, HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), immersion tin, immersion silver, OSP (Organic Solderability Preservative), ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), pure gold, and others. The surface finish enhances solderability, protects against oxidation, and facilitates component attachment. PCB Capability (RT/duroid 6010.2LM) PCB Material: Ceramic-PTFE composite Designator: RT/duroid 6010.2LM Dielectric constant: 10.2 ±0.25 (process); 10.7 (design) Layer count: Single Sided, Double Sided, Multilayer, Hybrid configuration Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) Dielectric thickness: 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.90mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, OSP, ENEPIG, Pure gold etc. One PCB and Applications Now displayed on the screen is a type of 6010.2LM PCB built on 50mil substrate with immersion gold for GPS antennas. We can also find its applications in aircraft collision avoidance systems, ground radar warning systems, patch antennas, satellite communications systems etc.
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