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Hybrid PCB
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4-layer SCGA-500 GF265 and High Tg FR-4 High Frequency Hybrid PCB With Immersion Gold
4-layer SCGA-500 GF265 and High Tg FR-4 High Frequency Hybrid PCB With Immersion Gold
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
Introduction
General Description
This hybrid PCB is a 4 - layer hybrid model, integrating SCGA - 500 GF265 PCB and Tg170℃ FR - 4 materials. With 1oz of copper applied to each layer, the board attains a final thickness of 1.2mm. The pads feature an immersion gold surface finish, which not only enhances electrical conductivity but also provides excellent corrosion resistance. A green solder mask is meticulously applied to safeguard the track patterns, protecting them from environmental damage and short circuits.
The SCGA - 500 GF265 panel houses two distinct types of boards, both fabricated with strict adherence to the specified requirements and the IPC - Class - II standard. This ensures consistent quality and reliable performance. Before leaving the factory, every single board undergoes a comprehensive 100% inspection to guarantee that SCGA - 500 GF265 laminate meets all the necessary criteria. For secure transportation, groups of 25 boards are carefully vacuum - packed, preserving their integrity until they reach the end - user.
PCB Specifications
| PCB SIZE | 155mm x 100mm=2pcs=2types |
| BOARD TYPE | Hybrid PCB |
| Number of Layers | 4 layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 17um(0.5 oz)+plate top layer |
| SCGA-500 GF265 0.51mm | |
| copper ------- 35um | |
| Prepreg 0.100mm | |
| copper ------- 35um | |
| FR-4 Tg170℃ | |
| copper ------- 17um(0.5 oz)+plate bottom layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4 mil / 4 mil |
| Minimum / Maximum Holes: | 0.3 mm / 0.9 mm |
| Number of Different Holes: | 6 |
| Number of Drill Holes: | 39 |
| Number of Milled Slots: | 2 |
| Number of Internal Cutouts: | 2 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | SCGA-500 GF265 + Tg170℃ FR-4 |
| Final foil external: | 1.0 oz |
| Final foil internal: | 1.0 oz |
| Final height of PCB: | 1.2 mm ±0.12 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold, 78.2% |
| Solder Mask Apply To: | Both sides |
| Solder Mask Color: | Green |
| Solder Mask Type: | Glossy |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | Top side |
| Colour of Component Legend | White |
| Manufacturer Name or Logo: | Kuangshung |
| VIA | Plated through hole(PTH), minimum size 0.3mm. |
| FLAMIBILITY RATING | 94V-0 |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059"" |
| Board plating: | 0.0029"" |
| Drill tolerance: | 0.002"" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Our Advantages
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, servicing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 19 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We also actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.
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Our PCB Capabilities(2022)
| Parameter | Value |
| Layer Counts | 1-32 |
| Substrate Material | RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; RT/duroid 5880LZ; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350; TC600; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc. |
| Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
| Board Outline Tolerance | ±0.0059"" (0.15mm) |
| PCB Thickness | 0.0157"" - 0.3937"" (0.40mm--10.00mm) |
| Thickness Tolerance(T≥0.8mm) | ±8% |
| Thickness Tolerance(t＜0.8mm) | ±10% |
| Insulation Layer Thickness | 0.00295"" - 0.1969"" (0.075mm--5.00mm) |
| Minimum Track | 0.003"" (0.075mm) |
| Minimum Space | 0.003"" (0.075mm) |
| Outer Copper Thickness | 35µm--350µm (1oz-10oz) |
| Inner Copper Thickness | 17µm--350µm (0.5oz - 10oz) |
| Drill Hole(Mechanical) | 0.0079"" - 0.25"" (0.2mm--6.35mm) |
| Finished Hole(Mechanical) | 0.0039""-0.248"" (0.10mm--6.30mm) |
| DiameterTolerance(Mechanical) | 0.00295"" (0.075mm) |
| Registration (Mechanical) | 0.00197"" (0.05mm) |
| Aspect Ratio | 12:1 |
| Solder Mask Type | LPI |
| Min Soldermask Bridge | 0.00315"" (0.08mm) |
| Min Soldermask Clearance | 0.00197"" (0.05mm) |
| Plug via Diameter | 0.0098"" - 0.0236"" (0.25mm--0.60mm) |
| Impedance Control Tolerance | ±10% |
| Surface Finish | HASL,HASL LF,ENIG,Immersion Tin,Immersion Silver, OSP, Gold Finger, Pure gold plated etc. |