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Hybrid PCB
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Rogers RT/duroid 5880 and RO4003C 4-Layer 1.3mm Hybrid PCB for Millimeter Wave Radar Systems
Rogers RT/duroid 5880 and RO4003C 4-Layer 1.3mm Hybrid PCB for Millimeter Wave Radar Systems
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
Overview of 4-Layer hybrid PCB
This 4-Layer hybrid PCB is a high-performance 4-layer rigid printed circuit board designed for advanced RF and millimeter-wave applications. This hybrid PCB features a hybrid construction using Rogers RT/duroid 5880 and RO4003C high-frequency laminates, combining excellent electrical properties with enhanced manufacturability. With compact dimensions of 110mm x 51mm and a slim 1.3mm profile, this PCB supports complex circuit designs requiring high density and precision. The board incorporates blind vias from top to inner layer 1 and from inner layer 2 to bottom layer, finished with immersion gold for superior surface protection. Supplied with Gerber RS-274-X artwork and 100% electrically tested, it meets IPC-Class-2 standards and is available worldwide.
PCB Construction Details
Parameter |
Specification |
Base Material |
RT/duroid 5880 and RO4003C mixed |
Layer Count |
4 layers |
Board Dimensions |
110mm x 51mm (+/- 0.15mm) |
Minimum Trace/Space |
4/6 mils |
Minimum Hole Size |
0.3mm |
Via Type |
Blind vias (Top to Inner 1, Inner 2 to Bottom) |
Finished Board Thickness |
1.3mm |
Finished Cu Weight |
1 oz (1.4 mils / 35 μm) all layers |
Via Plating Thickness |
20 μm |
Surface Finish |
Immersion Gold |
Top Silkscreen |
White |
Bottom Silkscreen |
No |
Top Solder Mask |
Green |
Bottom Solder Mask |
No |
Electrical Test |
100% tested prior to shipment |
Additional Components & Features
This PCB supports medium-density designs with 41 components and 85 total pads, including 54 thru-hole pads and 31 surface-mount pads on the top layer. The board utilizes 52 vias to interconnect 5 nets. The stackup is precisely engineered: 35μm Copper Layer 1 on 0.787mm RT duroid 5880 core, bonded to 35μm Copper Layer 2 with 0.101mm RO4450F prepreg, then to 35μm Copper Layer 3 on 0.203mm RO4003C core, and finally to 35μm Copper Layer 4.
Material Advantages
The hybrid material system offers distinct benefits. RT duroid 5880 PCB provides an ultra-low dielectric constant of 2.20 and exceptionally low dissipation factor of 0.0009, making it ideal for broadband and high-frequency applications. RO4003C PCB offers a stable dielectric constant of 3.38 with better thermal conductivity (0.71 W/m/°K) and CTE matched to copper, enabling reliable performance while using standard epoxy/glass processing methods without special treatments. Both materials feature low moisture absorption and high temperature stability.
Typical Applications
Rogers RT/duroid 5880 and RO4003C Hybrid PCB is engineered for demanding applications including commercial airline broadband antennas, microstrip and stripline circuits, millimeter wave systems, radar systems, guidance systems, and point-to-point digital radio antennas.
Why Choose This PCB?
This hybrid PCB board delivers reliable high-frequency performance through optimized material selection and precise manufacturing control. Its combination of Rogers laminates provides electrical excellence with manufacturing efficiency, supported by comprehensive electrical testing and global availability.
Order Now for Millimeter Wave and Radar Systems!
Implement this high-frequency hybrid PCB to enhance your critical communications and radar applications. Contact us today to discuss your specific requirements and access this reliable, performance-optimized circuit solution.