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Hybrid PCB on RO4003C and S1000-2M 6-layer 1.1mm PCB for Millimeter Wave Radar Systems
Hybrid PCB on RO4003C and S1000-2M 6-layer 1.1mm PCB for Millimeter Wave Radar Systems
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
Overview of Rogers RO4003C Hybrid PCB
Rogers RO4003C Hybrid 6-Layer PCB is a high-performance 6-layer rigid printed circuit board designed for advanced RF and millimeter-wave applications. It features a hybrid construction using Rogers RO4003C high-frequency laminate and Tg170 FR-4 material, combining excellent electrical properties with enhanced mechanical reliability. With compact dimensions of 62.5mm x 57.8mm and a slim 1.1mm profile, this PCB supports complex circuit designs requiring high density and precision. The board incorporates both blind vias (top layer to inner layer 2) and buried vias (inner layer 2 to inner layer 3), finished with immersion silver for superior surface protection. Featuring impedance control on 4mil/7mil traces with 90 ohm specification, series numbering, and 0.3mm filled/capped vias, it meets IPC-Class-2 standards and is available worldwide.
PCB Construction Details
Parameter |
Specification |
Base Material |
RO4003C and Tg170 FR-4 mixed |
Layer Count |
6 layers |
Board Dimensions |
62.5mm x 57.8mm (+/- 0.15mm) |
Minimum Trace/Space |
4/7 mils |
Minimum Hole Size |
0.3mm |
Via Type |
Blind & Buried vias (Top-L2, L2-L3) |
Finished Board Thickness |
1.1mm |
Finished Cu Weight |
1 oz (1.4 mils / 35 μm) all layers |
Via Plating Thickness |
20 μm |
Surface Finish |
Immersion Silver |
Top Silkscreen |
White |
Bottom Silkscreen |
No |
Top Solder Mask |
Matt Blue |
Bottom Solder Mask |
Matt Blue |
Special Features |
Impedance control, Series number, Via filling |
Electrical Test |
100% tested prior to shipment |
Additional Components & Features
This hybrid PCB supports medium-density designs with 22 components and 39 total pads, including 21 thru-hole pads and 18 surface-mount pads on the top layer. The board utilizes 21 vias to interconnect 5 nets. The stackup is precisely engineered with RO4003C layers (0.305mm) on both outer sections, S1000-2M core (0.203mm) in the center, and 1080 RC63% prepreg (0.0644mm) between layers, all with 35μm copper throughout.
Material Advantages
The hybrid material system offers distinct benefits. RO4003C provides a stable dielectric constant of 3.38 with low dissipation factor (0.0027), making it ideal for high-frequency applications while being processable using standard FR-4 methods. The S1000-2M material offers enhanced thermal resistance (Tg 180°C), lower Z-axis CTE for improved reliability, excellent anti-CAF performance, and lead-free compatibility. This combination delivers RF performance with manufacturing efficiency and reliability.
Typical Applications
This 6-layer PCB is engineered for demanding applications including commercial airline broadband antennas, microstrip and stripline circuits, millimeter wave systems, radar systems, guidance systems, and point-to-point digital radio antennas.
Why Choose This PCB?
This Rogers PCB board delivers reliable high-frequency performance through optimized material selection and advanced manufacturing techniques including impedance control, via filling, and comprehensive electrical testing, ensuring consistent performance in demanding environments.
Order Now for Millimeter Wave and Radar Systems!
Implement this advanced hybrid PCB to enhance your critical communications and radar applications. Contact us today to discuss your specific requirements and access this reliable, performance-optimized circuit solution.