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Rogers RO4350B 8-Layer 1.6mm HDI RF PCB with ENEPIG for RF Communications
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
Overview of Rogers RO4350B PCB
This 8-layer rigid PCB utilizes Rogers RO4350B core material and RO4450F bondply, designed for high-frequency applications requiring precise impedance control and signal integrity. With a finished thickness of 1.8mm and board dimensions of 96.4mm x 163.9mm (±0.15mm), the PCB accommodates three different design types. RO4350B PCB features complex blind via structures and is manufactured to IPC-Class-2 standards, making it suitable for RF communication systems and high-frequency electronic applications where consistent electrical performance is critical.
PCB Construction Details
Parameter |
Specification |
Base Material |
Rogers RO4350B |
Layer Count |
8-layer |
Board Dimensions |
96.4mm x 163.9mm (±0.15mm) |
Design Types |
3 Types = 3PCs |
Minimum Trace/Space |
4/6 mils |
Minimum Hole Size |
0.4mm |
Blind Vias |
GTL-L7, L3-GBL, GTL-L2, L7-GBL, GTL-L3, GTL-L4, GTL-L5, L5-GBL, L4-GBL, GTL-L6, L6-GBL, L2-GBL |
Finished Board Thickness |
1.8mm |
Finished Cu Weight |
1oz outer layers; 1oz/0.5oz inner layers |
Via Plating Thickness |
20μm |
Surface Finish |
Electroless Nickel Immersion Gold |
Silkscreen |
White (Top & Bottom) |
Solder Mask |
Green (Top & Bottom) |
Via Treatment |
All vias resin filled and capped |
Quality Control |
100% electrical test prior to shipment |
Impedance Control |
50 ohm on multiple layers with specified references |
Additional Components & Features
Rogers RO4350B PCB supports 76 components with 303 total pads, including 117 thru-hole pads, 121 top SMT pads, and 65 bottom SMT pads. The design incorporates 335 vias across 6 nets, utilizing Gerber RS-274-X artwork format. The impedance-controlled design maintains 50-ohm characteristic impedance on critical layers: 9.4mil on GTL referencing layer 2, 7mil on L2 referencing GTL and L3/GND, 7mil on L7 referencing L6/PWR and L8/GBL, and 9.4mil on GBL referencing L7/GND.
Material Advantages:
Rogers RO4350B provides stable dielectric constant (Dk 3.48±0.05) and low dissipation factor (0.0037) at 10GHz, with thermal conductivity of 0.69 W/m/°K. The material features high Tg >280°C, low CTE matching copper, and minimal water absorption (0.06%). RO4450F bondply offers compatible thermal and electrical properties with Dk 3.52±0.05 and dissipation factor of 0.004, enabling reliable multilayer construction.
Typical Applications: This PCB design is suitable for cellular base station antennas, RF identification tags, automotive radar systems, sensors, and LNB's for direct broadcast satellites.
Why Choose This PCB?
The combination of Rogers high-frequency materials with precision manufacturing processes ensures consistent electrical performance and reliability. The comprehensive blind via architecture and impedance control make it ideal for complex RF applications requiring stable signal transmission characteristics.
Order Now for RF Communication Systems!
This 8-layer Rogers RO4350B PCB delivers reliable performance for high-frequency applications with precise impedance control. Contact us for manufacturing quotes based on your Gerber RS-274-X files to meet your specific RF design requirements.