F4BTMS294 Copper Clad Laminates

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F4BTMS294 Copper Clad Laminates

Introduction

The F4BTMS series laminates, including F4BTMS 294, is an upgraded iteration of the F4BTM series. Based on the original F4BTM platform, it features substantial technological upgrades in material formulation and manufacturing processes. F4BTMS 294 high frequency laminate adopts a material composition integrated with a large proportion of ceramics and reinforced by ultra-thin, ultra-fine fiberglass cloth. These improvements significantly enhance the material’s overall performance, achieving a broader range of dielectric constants. As a high-reliability material tailored for aerospace applications, F4BTMS 294 is capable of replacing equivalent foreign products.

F4BTMS 294 PCB substrate incorporates a small amount of ultra-thin and ultra-fine fiberglass cloth for reinforcement, combined with a significant, uniform blend of special nanoceramics and polytetrafluoroethylene (PTFE) resin. This formulation minimizes the fiberglass interference effect during electromagnetic wave propagation, lowers dielectric loss, and boosts dimensional stability. The material demonstrates reduced anisotropy across the X/Y/Z axes, enabling higher frequency operation, enhanced electrical strength, and improved thermal conductivity. Additionally, F4BTMS 294 boasts an excellent low coefficient of thermal expansion and stable dielectric temperature characteristics.

The F4BTMS 294 laminate comes standard with RTF low-roughness copper foil. This configuration not only reduces conductor loss but also ensures outstanding peel strength. F4BTMS 294 material can be paired with copper-based or aluminum-based substrates as needed. Specifically, F4BTMS 294 is compatible with buried 50Ω resistor copper foil, enabling the fabrication of resistor film substrates.

F4BTMS 294 high-frequency material can be processed using standard PTFE board manufacturing techniques, leveraging its excellent mechanical and physical properties. It is well-suited for multi-layer, high-layer-count, and backplane processing. Furthermore, F4BTMS 294 exhibits superior processability in dense hole drilling and fine line routing applications.

Product Features

- Minimal dielectric constant tolerance and excellent batch-to-batch consistency.

- Extremely low dielectric loss.

- Stable dielectric constant and low loss within frequencies up to 40GHz, meeting the requirements of phase-sensitive applications.

- Excellent temperature coefficient of dielectric constant and dielectric loss, maintaining frequency and phase stability between -55°C and 150°C.

- Excellent resistance to radiation, retaining stable dielectric and physical properties even after exposure to irradiation.

- Low outgassing performance, meeting the vacuum outgassing requirements for aerospace applications.

- Minimal thermal expansion coefficients in the X/Y/Z directions, ensuring dimensional stability and reliable hole copper connections.

- Improved thermal conductivity, suitable for high-power applications.

- Excellent dimensional stability.

- Low water absorption.

Models & Data Sheet

Here are the technical parameters of the different product models:

Product Models: F4BTMS220 F4BTMS233 F4BTMS255 F4BTMS265 F4BTMS294 F4BTMS300 F4BTMS350 F4BTMS430 F4BTMS450 F4BTMS615 F4BTMS1000

Dielectric Constant (Typical): Test Conditions: 10 GHz Values: F4BTMS220: 2.2 F4BTMS233: 2.33 F4BTMS255: 2.55 F4BTMS265: 2.65 F4BTMS294: 2.94 F4BTMS300: 3.00 F4BTMS350: 3.50 F4BTMS430: 4.30 F4BTMS450: 4.50 F4BTMS615: 6.15 F4BTMS1000: 10.20

Dielectric Constant Tolerance: Values: F4BTMS220: +/-0.02; F4BTMS233: +/-0.03; F4BTMS255: +/-0.04; F4BTMS265: +/-0.04; F4BTMS294: +/-0.04; F4BTMS300: +/-0.04; F4BTMS350: +/-0.04; F4BTMS430: +/-0.05; F4BTMS450: +/-0.09; F4BTMS615: +/-0.09; F4BTMS1000: +/-0.12

Dielectric Constant (Design): Test Conditions: 10 GHz Values are the same as the "Dielectric Constant (Typical)" section.

Loss Tangent (Typical): Test Conditions: 10 GHz 20 GHz 40 GHz

Values: F4BTMS220: 10 GHz: 0.0009 20 GHz: 0.0010 40 GHz: 0.0013

F4BTMS233: 10 GHz: 0.0010 20 GHz: 0.0011 40 GHz: 0.0015

F4BTMS255: 10 GHz: 0.0012 20 GHz: 0.0013 40 GHz: 0.0016

F4BTMS265: 10 GHz: 0.0012 20 GHz: 0.0014 40 GHz: 0.0018

F4BTMS294: 10 GHz: 0.0012 20 GHz: 0.0014 40 GHz: 0.0018

F4BTMS300: 10 GHz: 0.0013 20 GHz: 0.0015 40 GHz: 0.0019

F4BTMS350: 10 GHz: 0.0016 20 GHz: 0.0019 40 GHz: 0.0024

F4BTMS450: 10 GHz: 0.0015 20 GHz: 0.0019 40 GHz: 0.0024

F4BTMS615: 10 GHz: 0.0020 20 GHz: 0.0023 40 GHz: /

F4BTMS1000: 10 GHz: 0.0020 20 GHz: 0.0023 40 GHz: /

Product Technical Parameters			Product Models & Data Sheet
Product Features	Test Conditions	Unit	F4BTMS220	F4BTMS233	F4BTMS255	F4BTMS265	F4BTMS294	F4BTMS300	F4BTMS350	F4BTMS430	F4BTMS450	F4BTMS615	F4BTMS1000
Dielectric Constant (Typical)	10GHz	/	2.2	2.33	2.55	2.65	2.94	3.00	3.50	4.30	4.50	6.15	10.20
Dielectric Constant Tolerance	/	/	±0.02	±0.03	±0.04	±0.04	±0.04	±0.04	±0.05	±0.09	±0.09	±0.12	±0.2
Dielectric Constant (Design)	10GHz	/	2.2	2.33	2.55	2.65	2.94	3.0	3.50	4.3	4.5	6.15	10.2
Loss Tangent (Typical)	10GHz	/	0.0009	0.0010	0.0012	0.0012	0.0012	0.0013	0.0016	0.0015	0.0015	0.0020	0.0020
	20GHz	/	0.0010	0.0011	0.0013	0.0014	0.0014	0.0015	0.0019	0.0019	0.0019	0.0023	0.0023
	40GHz	/	0.0013	0.0015	0.0016	0.0018	0.0018	0.0019	0.0024	0.0024	0.0024	/	/
Dielectric Constant Temperature Coefficient	-55 º~150ºC	PPM/℃	-130	-122	-92	-88	-20	-20	-39	-60	-58	-96	-320
Peel Strength	1 OZ RTF copper	N/mm	>2.4	>2.4	>1.8	>1.8	>1.2	>1.2	>1.2	>1.2	>1.2	>1.2	>1.2
Volume Resistivity	Standard Condition	MΩ.cm	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8

Surface Resistivity

Standard Condition

MΩ

≥1×10^8

Electrical Strength (Z direction)

5KW, 500V/s

KV/mm

>26

>30

>32

>34

>40

>42

>44

>45

>48

>23

Breakdown Voltage (XY direction)

5KW, 500V/s

>35

>38

>40

>42

>48

>52

>55

>52

>54

>55

>42

Coefficientof Thermal Expansion (X, Y direction)

-55 º~288ºC

ppm/ºC

40, 50

35, 40

15, 20

10, 12

10, 11

10, 12

13, 12

12, 12

10, 12

16, 18

Coefficientof Thermal Expansion (Z direction)

-55 º~288ºC

ppm/ºC

290

220

Thermal Stress

260℃, 10s, 3 times

No delamination

Water Absorption

20±2℃, 24 hours

0.02

0.025

0.02

0.025

0.03

0.08

0.1

0.03

Density

Room Temperature

g/cm3

2.18

2.22

2.26

2.25

2.28

2.3

2.51

2.53

2.75

3.2

Long-Term Operating Temperature

High-Low Temperature Chamber

℃

-55～+260

Thermal Conductivity

Z direction

W/(M.K)

0.26

0.28

0.31

0.36

0.58

0.6

0.63

0.64

0.67

0.81

Flammability

UL-94

V-0

Material Composition

PTFE, Ultra-thin and ultra-fine (quartz) fiberglass.

PTFE, Ultra-thin and ultra-fine fiberglass, ceramics.

A F4BTMS294 Laminate and Typical Applications:

Shown on the screen is the F4BTMS 294 high-frequency substrate. Its laminates are widely used in aerospace equipment, space installations, microwave/RF systems, military radar, feed networks, phased array antennas, satellite communications, and other fields.

Final

(F4BTMS series aluminum-based/copper-based boards) This series of laminates can provide aluminum-based or copper-based materials, where one side of the dielectric layer is covered with copper foil, and the other side is covered with an aluminum-based or copper-based layer. This configuration serves as shielding or heat dissipation.

The model numbers are F4BTMS***-AL or F4BTMS***-CU. For example, F4BTMS220-AL represents F4BTMS220 with aluminum-based substrate. F4BTMS294-CU represents F4BTMS294 with copper-based substrate.