F4BTMS233 High Frequency PCB Material

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F4BTMS233 High Frequency PCB Material

Introduction

F4BTMS233 laminate represents a key model within the upgraded F4BTMS series, engineered with significant advancements in material formulation and manufacturing technology. It integrates a high proportion of specialty ceramics and ultra-thin, ultra‑fine fiberglass cloth reinforcement, resulting in an extended range of dielectric constants and superior electrical performance. Designed as a high‑reliability, domestically produced alternative to similar imported materials, F4BTMS233 meets stringent requirements for aerospace, satellite, and mission‑critical RF systems.

Through the optimized combination of nanoceramic fillers and PTFE resin, along with minimal woven glass content, F4BTMS233 effectively minimizes fiber‑induced signal dispersion, reduces dielectric loss, and improves dimensional stability. The material exhibits significantly reduced anisotropy across the X/Y/Z axes, enabling stable operation at higher frequencies, enhanced electrical strength, and improved thermal conductivity. Coupled with a low coefficient of thermal expansion (CTE) and excellent dielectric‑temperature stability, F4BTMS233 ensures consistent performance under varying environmental conditions.

F4BTMS233 high frequency laminates are supplied standard with RTF (reverse‑treated foil) low‑profile copper foil, which lowers conductor loss while maintaining strong peel strength. The substrate is compatible with both copper‑clad and aluminum‑clad configurations, offering design flexibility for heat‑sensitive or weight‑optimized applications. Models such as F4BTMS294 further expand functionality through compatibility with embedded 50‑Ω resistor foils, enabling integrated passive circuitry.

Compatible with conventional PTFE‑based PCB fabrication processes, F4BTMS233 PCB raw material supports complex multilayer constructions, high‑layer‑count designs, and large‑format backplanes. Its excellent mechanical and physical properties facilitate high‑density micro‑via drilling, fine‑line patterning, and reliable assembly—making it an ideal substrate for advanced phased arrays, millimeter‑wave modules, high‑speed digital backplanes, and compact RF front‑ends.

With its balanced performance in electrical, thermal, and mechanical domains, F4BTMS233 copper clad laminate stands as a versatile, high‑performance laminate for 5G infrastructure, defense electronics, aerospace communications, and other next‑generation applications where signal integrity, reliability, and manufacturability are paramount.

Product Features

- Minimal dielectric constant tolerance and excellent batch-to-batch consistency.

- Extremely low dielectric loss.

- Stable dielectric constant and low loss within frequencies up to 40GHz, meeting the requirements of phase-sensitive applications.

- Excellent temperature coefficient of dielectric constant and dielectric loss, maintaining frequency and phase stability between -55°C and 150°C.

- Excellent resistance to radiation, retaining stable dielectric and physical properties even after exposure to irradiation.

- Low outgassing performance, meeting the vacuum outgassing requirements for aerospace applications.

- Minimal thermal expansion coefficients in the X/Y/Z directions, ensuring dimensional stability and reliable hole copper connections.

- Improved thermal conductivity, suitable for high-power applications.

- Excellent dimensional stability.

- Low water absorption.

Models & Data Sheet

Here are the technical parameters of the different product models:

Product Models: F4BTMS220 F4BTMS233 F4BTMS255 F4BTMS265 F4BTMS294 F4BTMS300 F4BTMS350 F4BTMS430 F4BTMS450 F4BTMS615 F4BTMS1000

Dielectric Constant (Typical): Test Conditions: 10 GHz Values: F4BTMS220: 2.2 F4BTMS233: 2.33 F4BTMS255: 2.55 F4BTMS265: 2.65 F4BTMS294: 2.94 F4BTMS300: 3.00 F4BTMS350: 3.50 F4BTMS430: 4.30 F4BTMS450: 4.50 F4BTMS615: 6.15 F4BTMS1000: 10.20

Dielectric Constant Tolerance: Values: F4BTMS220: +/-0.02; F4BTMS233: +/-0.03; F4BTMS255: +/-0.04; F4BTMS265: +/-0.04; F4BTMS294: +/-0.04; F4BTMS300: +/-0.04; F4BTMS350: +/-0.04; F4BTMS430: +/-0.05; F4BTMS450: +/-0.09; F4BTMS615: +/-0.09; F4BTMS1000: +/-0.12

Dielectric Constant (Design): Test Conditions: 10 GHz Values are the same as the "Dielectric Constant (Typical)" section.

Loss Tangent (Typical): Test Conditions: 10 GHz 20 GHz 40 GHz

Values: F4BTMS220: 10 GHz: 0.0009 20 GHz: 0.0010 40 GHz: 0.0013

F4BTMS233: 10 GHz: 0.0010 20 GHz: 0.0011 40 GHz: 0.0015

F4BTMS255: 10 GHz: 0.0012 20 GHz: 0.0013 40 GHz: 0.0016

F4BTMS265: 10 GHz: 0.0012 20 GHz: 0.0014 40 GHz: 0.0018

F4BTMS294: 10 GHz: 0.0012 20 GHz: 0.0014 40 GHz: 0.0018

F4BTMS300: 10 GHz: 0.0013 20 GHz: 0.0015 40 GHz: 0.0019

F4BTMS350: 10 GHz: 0.0016 20 GHz: 0.0019 40 GHz: 0.0024

F4BTMS450: 10 GHz: 0.0015 20 GHz: 0.0019 40 GHz: 0.0024

F4BTMS615: 10 GHz: 0.0020 20 GHz: 0.0023 40 GHz: /

F4BTMS1000: 10 GHz: 0.0020 20 GHz: 0.0023 40 GHz: /

Product Technical Parameters			Product Models & Data Sheet
Product Features	Test Conditions	Unit	F4BTMS220	F4BTMS233	F4BTMS255	F4BTMS265	F4BTMS294	F4BTMS300	F4BTMS350	F4BTMS430	F4BTMS450	F4BTMS615	F4BTMS1000
Dielectric Constant (Typical)	10GHz	/	2.2	2.33	2.55	2.65	2.94	3.00	3.50	4.30	4.50	6.15	10.20
Dielectric Constant Tolerance	/	/	±0.02	±0.03	±0.04	±0.04	±0.04	±0.04	±0.05	±0.09	±0.09	±0.12	±0.2
Dielectric Constant (Design)	10GHz	/	2.2	2.33	2.55	2.65	2.94	3.0	3.50	4.3	4.5	6.15	10.2
Loss Tangent (Typical)	10GHz	/	0.0009	0.0010	0.0012	0.0012	0.0012	0.0013	0.0016	0.0015	0.0015	0.0020	0.0020
	20GHz	/	0.0010	0.0011	0.0013	0.0014	0.0014	0.0015	0.0019	0.0019	0.0019	0.0023	0.0023
	40GHz	/	0.0013	0.0015	0.0016	0.0018	0.0018	0.0019	0.0024	0.0024	0.0024	/	/
Dielectric Constant Temperature Coefficient	-55 º~150ºC	PPM/℃	-130	-122	-92	-88	-20	-20	-39	-60	-58	-96	-320
Peel Strength	1 OZ RTF copper	N/mm	>2.4	>2.4	>1.8	>1.8	>1.2	>1.2	>1.2	>1.2	>1.2	>1.2	>1.2
Volume Resistivity	Standard Condition	MΩ.cm	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8

Surface Resistivity

Standard Condition

MΩ

≥1×10^8

Electrical Strength (Z direction)

5KW, 500V/s

KV/mm

>26

>30

>32

>34

>40

>42

>44

>45

>48

>23

Breakdown Voltage (XY direction)

5KW, 500V/s

>35

>38

>40

>42

>48

>52

>55

>52

>54

>55

>42

Coefficientof Thermal Expansion (X, Y direction)

-55 º~288ºC

ppm/ºC

40, 50

35, 40

15, 20

10, 12

10, 11

10, 12

13, 12

12, 12

10, 12

16, 18

Coefficientof Thermal Expansion (Z direction)

-55 º~288ºC

ppm/ºC

290

220

Thermal Stress

260℃, 10s, 3 times

No delamination

Water Absorption

20±2℃, 24 hours

0.02

0.025

0.02

0.025

0.03

0.08

0.1

0.03

Density

Room Temperature

g/cm3

2.18

2.22

2.26

2.25

2.28

2.3

2.51

2.53

2.75

3.2

Long-Term Operating Temperature

High-Low Temperature Chamber

℃

-55～+260

Thermal Conductivity

Z direction

W/(M.K)

0.26

0.28

0.31

0.36

0.58

0.6

0.63

0.64

0.67

0.81

Flammability

UL-94

V-0

Material Composition

PTFE, Ultra-thin and ultra-fine (quartz) fiberglass.

PTFE, Ultra-thin and ultra-fine fiberglass, ceramics.

A F4BTMS233 Laminate and Typical Applications:

Presented on the screen is an F4BTMS233 substrate . F4BTMS233 high-frequency laminates are extensively employed in various domains, including:

Aerospace and aviation equipment, space installations, and cabin setups. Microwave and RF applications. Radar systems, particularly in military applications. Feed networks for signal distribution. Phase-sensitive antennas and phased array antennas. Satellite communications, and much more.

Final

(F4BTMS series aluminum-based/copper-based boards) This series of laminates can provide aluminum-based or copper-based materials, where one side of the dielectric layer is covered with copper foil, and the other side is covered with an aluminum-based or copper-based layer. This configuration serves as shielding or heat dissipation.