F4BTM298 High Frequency Laminates Introduction The F4BTM 298 laminate is manufactured through a scientific formulation of fiberglass cloth, nano-ceramic fillers, and polytetrafluoroethylene resin, followed by strict pressing processes. This material is based on the F4BM dielectric layer, enhanced with high-dielectric, low-loss nano-ceramics, resulting in a higher dielectric constant, improved heat resistance, a lower thermal expansion coefficient, higher insulation resistance, and better thermal conductivity—all while maintaining excellent low-loss characteristics. Both F4BTM and F4BTME series share the same dielectric layer but utilize different copper foils: the F4BTM 298 laminate is paired with ED copper foil, making it suitable for applications without Passive Intermodulation (PIM) requirements, while the F4BTME series employs reverse-treated (RTF) copper foil to deliver superior PIM performance, finer line control, and reduced conductor loss. Features & Benefits DK value of 2.98, achieved through nano-ceramic enhancement Excellent thermal performance, including improved heat resistance and thermal conductivity Low and stable loss characteristics maintained across high-frequency applications Available in various thicknesses and sizes, offering design flexibility and cost efficiency Suitable for commercial and large-scale production, providing high cost-effectiveness Radiation-resistant and low out-gassing properties for reliable performance in demanding environments Models & Data Sheet Here's a detailed narration of the technical parameters mentioned in the data sheet for F4BTM: Dielectric Constant (Typical): Test Conditions: Measured at 10GHz Unit: Dimensionless F4BTM298: 2.98 F4BTM300: 3.0 F4BTM320: 3.2 F4BTM350: 3.5 The dielectric constant represents the material's ability to store electrical energy when subjected to an electric field. Dielectric Constant Tolerance: F4BTM298: ±0.06 F4BTM300: ±0.06 F4BTM320: ±0.06 F4BTM350: ±0.07 This parameter indicates the acceptable range of variation in the dielectric constant for the specified models. Loss Tangent (Typical): Test Conditions: Measured at 10GHz and 20GHz F4BTM298: 0.0018 F4BTM300: 0.0018 F4BTM320: 0.0020 F4BTM350: 0.0025 The loss tangent refers to the amount of energy dissipated as heat when an electrical signal passes through the material. Dielectric Constant Temperature Coefficient: Test Conditions: Temperature range of -55 oC to 150oC Unit: Parts per million per degree Celsius (PPM/℃) F4BTM298: -78 F4BTM300: -75 F4BTM320: -75 F4BTM350: -60 This parameter indicates the change in dielectric constant with respect to temperature. Peel Strength: Test Conditions: Measured with 1 oz F4BTM and 1 oz F4BTME Unit: Newtons per millimeter (N/mm) F4BTM298: >1.6 F4BTM300: >1.6 F4BTM320: >1.6 F4BTM350: >1.6 Peel strength measures the bonding strength between layers of the material. Volume Resistivity: Test Conditions: Standard conditions Unit: Megaohm centimeters (MΩ.cm) F4BTM298: ≥1×10^7 F4BTM300: ≥1×10^7 F4BTM320: ≥1×10^7 F4BTM350: ≥1×10^7 Volume resistivity indicates the material's resistance to the flow of electrical current through its volume. Surface Resistivity: Test Conditions: Standard conditions Unit: Megaohms (MΩ) F4BTM298: ≥1×10^6 F4BTM300: ≥1×10^6 F4BTM320: ≥1×10^6 F4BTM350: ≥1×10^6 Surface resistivity represents the material's resistance to the flow of electrical current across its surface. Electrical Strength (Z direction): Test Conditions: 5KW, 500V/s Unit: Kilovolts per millimeter (KV/mm) F4BTM298: >26 F4BTM300: >30 F4BTM320: >32 F4BTM350: >32 Electrical strength measures the ability of the material to withstand high voltage without electrical breakdown. Breakdown Voltage (XY direction): Test Conditions: 5KW, 500V/s Unit: Kilovolts (KV) F4BTM298: >34 F4BTM300: >35 F4BTM320: >40 F4BTM350: >40 Breakdown voltage represents the voltage at which the material experiences electrical breakdown in the XY direction. Coefficient of Thermal Expansion: Test Conditions: Temperature range of -55 oC to 288oC Unit: Parts per million per degree Celsius (ppm/oC) XY direction: F4BTM298: 15,16 F4BTM300: 15,16 F4BTM320: 13,15 F4BTM350: 10,12 Z direction: F4BTM298: 78 F4BTM300: 72 F4BTM320: 58 F4BTM350: 51 The coefficient of thermal expansion indicates the material's dimensional change with respect to temperature. Thermal Stress: Test Conditions: 260℃, 10s, 3 times Result: No delamination This parameter assesses the material's ability to withstand thermal stress without experiencing delamination or separation. Water Absorption: Test Conditions: 20±2℃, 24 hours Unit: Percentage (%) F4BTM298: ≤0.05 F4BTM300: ≤0.05 F4BTM320: ≤0.05 F4BTM350: ≤0.05 Water absorption represents the amount of water the material can absorb under specified conditions. Density: Test Conditions: Room temperature Unit: Grams per cubic centimeter (g/cm3) F4BTM298: 2.25 F4BTM300: 2.25 F4BTM320: 2.20 F4BTM350: 2.20 Density indicates the mass of the material per unit volume. Long-Term Operating Temperature: Test Conditions: High-Low Temperature Chamber Unit: Celsius (℃) Temperature Range: -55 to +260 This parameter specifies the temperature range within which the material can operate over an extended period of time. Thermal Conductivity (Z direction): Test Conditions: Measured in watts per meter-kelvin (W/(M.K)) F4BTM298: 0.42 F4BTM300: 0.42 F4BTM320: 0.50 F4BTM350: 0.54 Thermal conductivity measures the material's ability to conduct heat in the Z direction. PIM (Only applicable to F4BTME): Unit: Decibels relative to carrier (dBc) F4BTME: ≤-160 PIM, or Passive Intermodulation, refers to the generation of unwanted signals caused by nonlinearities in the material when exposed to high-frequency signals. Flammability: Unit: UL-94 rating F4BTM298: V-0 F4BTM300: V-0 F4BTM320: V-0 F4BTM350: V-0 Flammability rating indicates the material's resistance to ignition and flame spread according to the UL-94 standard. Material Composition: This section provides information about the components used in the F4BTM material, including PTFE (Polytetrafluoroethylene), Fiberglass Cloth, nano-ceramics, and the specific pairing of F4BTM with either ED copper foil or reverse-treated (RTF) copper foil for F4BTME. Product Technical Parameters Product Models & Data Sheet Product Features Test Conditions Unit F4BTM298 F4BTM300 F4BTM320 F4BTM350 Dielectric Constant (Typical) 10GHz / 2.98 3.0 3.2 3.5 Dielectric Constant Tolerance / / ±0.06 ±0.06 ±0.06 ±0.07 Loss Tangent (Typical) 10GHz / 0.0018 0.0018 0.0020 0.0025 20GHz / 0.0023 0.0023 0.0026 0.0035 Dielectric Constant Temperature Coefficient -55 º~150ºC PPM/℃ -78 -75 -75 -60 Peel Strength 1 OZ F4BTM N/mm >1.6 >1.6 >1.6 >1.6 1 OZ F4BTME N/mm >1.4 >1.4 >1.4 >1.4 Volume Resistivity Standard Condition MΩ.cm ≥1×10^7 ≥1×10^7 ≥1×10^7 ≥1×10^7 Surface Resistivity Standard Condition MΩ ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 Electrical Strength (Z direction) 5KW，500V/s KV/mm >26 >30 >32 >32 Breakdown Voltage (XY direction) 5KW，500V/s KV >34 >35 >40 >40 Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 15，16 15，16 13，15 10，12 Z direction -55 º~288ºC ppm/ºC 78 72 58 51 Thermal Stress 260℃, 10s，3 times No delamination No delamination No delamination No delamination Water Absorption 20±2℃, 24 hours % ≤0.05 ≤0.05 ≤0.05 ≤0.05 Density Room Temperature g/cm3 2.25 2.25 2.20 2.20 Long-Term Operating Temperature High-Low Temperature Chamber ℃ -55～+260 -55～+260 -55～+260 -55～+260 Thermal Conductivity Z direction W/(M.K) 0.42 0.42 0.50 0.54 PIM Only applicable to F4BTME dBc ≤-160 ≤-160 ≤-160 ≤-160 Flammability / UL-94 V-0 V-0 V-0 V-0 Material Composition / / PTFE, Fiberglass Cloth, nano-ceramics F4BTM298 Laminate and Applications The screen displays a F4BTM298 substrate. F4BTM298 high frequency circuit material is utilized in various applications, including Antenna, Mobile Internet, Sensor Network, Radar, Millimeter Wave Radar, Aerospace, Satellite Navigation, Beidou, Missile-borne, Power Amplifier, and Radio Frequency. Final （F4BTM series aluminum-based/copper-based substrates） F4BTM series of laminates can provide aluminum-based or copper-based materials, where one side of the dielectric layer is covered with copper foil, and the other side of the dielectric layer is covered with either aluminum-based or copper-based material. This arrangement serves the purpose of shielding or heat dissipation.
F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil. .jpg)
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