Rogers CLTE-MW High Frequency Laminates Introduction In the world of advanced electronics, where performance and reliability are non-negotiable, material selection is foundational. CLTE-MW copper clad laminate stand out as a premier choice, delivering proven excellence in dimensional stability and ultra-low planar Coefficient of Thermal Expansion (CTE). This unique combination provides consistent, predictable performance for critical components like embedded resistors, achieving among the lowest variance available in PTFE-based laminates. With a legacy of success alongside Resistor Foil technology, CLTE-MW is the trusted substrate for next-generation communications and radar systems. CLTE-MW PCB substrate is engineered to solve the complex challenges of high-frequency, high-reliability designs. Its tried and tested performance makes it a top selection for ground-based and airborne systems where failure is not an option. Core Features & Benefits: Exceptional Dimensional & Thermal Stability: With remarkably low thermal expansion (10 ppm/°C in X, 12 ppm/°C in Y, and 34 ppm/°C in Z-axis), CLTE-MW ensures minimal movement during thermal cycling. This translates directly to high plated through-hole reliability and reduced stress on interconnections. Ultra-Low Loss at High Frequencies: Featuring a Loss Tangent of just .0012 at 10 GHz, CLTE-MW enables reduced circuit losses without sacrificing its renowned dimensional stability, maximizing signal integrity in sensitive RF and microwave circuits. Stable Dielectric Constant (Dk) Over Temperature: The material’s consistent electrical properties across temperature variations lead to reduced stress attachment to ceramic active devices, such as GaAs chips or ICs, enhancing assembly yield and long-term performance. Versatile Cladding & Backing Options: Available with a full range of cladding types—including electrodeposited, reverse treated, and rolled copper foil—CLTE-MW also supports heavy metal backing (aluminum, brass, copper). This versatility supports reliable designs with embedded resistor networks and effective thermal management. Consistent Thin Laminate Availability: Offered as a reliable and consistent thin laminate down to .0003”, it supports the development of complex, high-density multi-layer boards for miniaturized, advanced packages. Typical Properties Properties Typical Value Units Test Conditions Test Method Electrical Properties Dielectric Constant (process) 2.94 to 3.02 ± 0.04 - 23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5 Dielectric Constant (design) 303 to 3.10 - C-24/23/50 8-40 GHz Microstrip Differential Phase Length Dissapation Factor 0.0015 - 23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5 Thermal Coefficient of Dielectric Constant -35 ppm/˚C 0 to 100˚C 10 GHz IPC TM-650 2.5.5.5 Volume Resistivity 1.3 x 10⁷ MΩ-cm C96/35/90 - IPC TM-650 2.5.17.1 Surface Resistivity 2.5 x 10⁶ MΩ C96/35/90 - IPC TM-650 2.5.17.1 Electrical Strength (dielectric strength) 630 V/mil - - IPC TM-650 2.5.6.2 Dielectric Breakdon 44 kV D-48/50 - IPC TM-650 2.5.6 Comparative Tracking Index 600V/ PLC 0 class/volts - C-40/23/50 UL-746A, ASTM D6054 Thermal Properties Decomposition Temperature (Td) 500 ˚C 2hrs @ 105˚C 5% Weight Loss IPC TM-650 2.3.40 Coefficient of Thermal Expansion - x 8 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41 Coefficient of Thermal Expansion - y 8 ppm/˚C - IPC TM-650 2.4.41 Coefficient of Thermal Expansion - z 30 ppm/˚C - IPC TM-650 2.4.24 Thermal Conductivity 0.42 W/(m.K) - Z Direction ASTM D5470 Time to Delamination >60 minutes as-received 288˚C IPC TM-650 2.4.24.1 Mechanical Properties Copper Peel Strength 1.1 (6.0) N/mm (lbs/in) 10s @288˚C 35 μm foil IPC TM-650 2.4.8 Flexural Strength (MD, CMD) 113, 99 (16.4, 14.4) MPa (ksi) 25˚C +/- 3˚C - ASTM D790 Tensile Strength (MD, CMD) 83, 80 (12.0, 11.6) MPa (ksi ) 23˚C @ 50% RH - ASTM D3039/D3039-14 Flex Modulus (MD, CMD) 6468, 6360 (938.1, 922.4) MPa (ksi) 25˚C +/- 3˚C - IPC TM-650 2.4.4 Dimensional Stability (MD, CMD) 0.22, 0.22 mil/inch after etch + bake - IPC-TM-650 2.4.39a Physical Properties Flammability V-0 - - - UL 94 Moisture Absorption 0.03 % E1/105+D48/50 - IPC TM-650 2.6.2.1 Density 2.1 g/cm³ C24/23/50 - ASTM D792 Specifc Heat Capacity 0.93 J/g˚K 2 hours at 105˚C - ASTM E2716 NASA Outgassing Total Mass Lost 0.03 % TML/CVCM ASTM E595 Collected Volatiles <0.01 % A Piece of CLTE-MW Laminate Typical Applications for CLTE-MW Laminates The robust property set of CLTE-MW makes it indispensable across a spectrum of cutting-edge technologies: Advanced Driver Assistance Systems (ADAS): Where sensor reliability and signal accuracy are critical for safety. Phased Array & Patch Antennas: Demanding stable phase response and precise element alignment over temperature extremes. Power Amplifiers: Requiring materials that manage heat efficiently while maintaining electrical stability. Aerospace & Defense Radar/Communications: For systems that must perform reliably in volatile environmental conditions. Conclusion Rogers CLTE-MW high frequency materials represent more than just a material; they are a reliability solution. By offering unmatched dimensional stability, low loss, and thermal management versatility, they empower engineers to push the boundaries of high-frequency design. For applications where consistency, precision, and durability are paramount—from embedded resistor networks to mission-critical radar systems—CLTE-MW provides the proven foundation for success.
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