F4BTME298 High Frequency PCB Material Introduction The F4BTME 298 high frequency PCB material is manufactured through the precise formulation of fiberglass cloth, nano-ceramic fillers, and polytetrafluoroethylene resin, followed by stringent pressing processes. It utilizes the F4BM-based dielectric layer, enhanced with high-dielectric, low-loss nano-ceramic materials, achieving a higher dielectric constant, improved heat resistance, a lower coefficient of thermal expansion, higher insulation resistance, and enhanced thermal conductivity—all while maintaining excellent low-loss performance. The F4BTME 298 high frequency laminate employs reverse-treated (RTF) copper foil, distinguishing it from the ED copper foil used in the standard F4BTM series. This configuration provides outstanding Passive Intermodulation (PIM) performance, more precise circuit line control, and reduced conductor loss, making the F4BTME 298 laminate an ideal choice for high-reliability, low-PIM applications in advanced RF and communications systems. Features & Benefits - Low DK value is 2.98 - Addition of ceramics enhances the performance - F4BTME298 exhibits excellent PIM performance - Comes in various thicknesses and sizes, offers cost savings - Commercialization, large-scale production, and high cost-effectiveness - Radiation-resistant and low out-gassing properties Models & Data Sheet Let's go through the data sheet items one by one: Product Technical Parameters and Product Models & Data Sheet: These sections provide an overview of the product's technical parameters and refer to specific models and corresponding data sheets. Dielectric Constant (Typical): This parameter represents the dielectric constant of the material at a frequency of 10GHz. The values for different models are as follows: F4BTME298: 2.98 F4BTME300: 3.0 F4BTME320: 3.2 F4BTME350: 3.5 Dielectric Constant Tolerance: This parameter indicates the tolerance range for the dielectric constant. The values for different models are as follows: F4BTME298: ±0.06 F4BTME300: ±0.06 F4BTME320: ±0.06 F4BTME350: ±0.07 Loss Tangent (Typical): Loss tangent refers to the dissipation of energy in the material and is measured at different frequencies. The values for different frequencies and models are provided: At 10GHz: F4BTME298: 0.0018 F4BTME300: 0.0018 F4BTME320: 0.0020 F4BTME350: 0.0025 At 20GHz: F4BTME298: 0.0023 F4BTME300: 0.0023 F4BTME320: 0.0026 F4BTME350: 0.0035 Dielectric Constant Temperature Coefficient: This parameter indicates how the dielectric constant changes with temperature within a specified range. The temperature range is from -55oC to 150oC. The values for different models are as follows: F4BTME298: -78 ppm/oC F4BTME300: -75 ppm/oC F4BTME320: -75 ppm/oC F4BTME350: -60 ppm/oC Peel Strength: Peel strength refers to the strength of adhesion between layers of the material. The values provided are for two different variants: 1 OZ F4BTM: Greater than 1.6 N/mm 1 OZ F4BTME: Greater than 1.4 N/mm Volume Resistivity: Volume resistivity indicates the resistance to the flow of electrical current through the material. The values are given for the standard condition and are greater than or equal to 1×10^7 MΩ.cm. Surface Resistivity: Surface resistivity represents the resistance to the flow of electrical current across the surface of the material. The values are given for the standard condition and are greater than or equal to 1×10^6 MΩ. Electrical Strength (Z direction): Electrical strength measures the ability of the material to withstand electrical stress. The values provided are for a test condition of 5KW and 500V/s and are greater than 26 KV/mm for all models. Breakdown Voltage (XY direction): Breakdown voltage refers to the voltage at which the material experiences electrical breakdown in the XY direction. The values provided are for a test condition of 5KW and 500V/s and are greater than 34 KV for all models. Coefficient of Thermal Expansion: This parameter indicates how the material expands or contracts with changes in temperature. The values are given for both the XY direction and the Z direction over a temperature range of -55oC to 288oC. Thermal Stress: Thermal stress represents the ability of the material to withstand temperature-induced stress. The values indicate that there is no delamination when exposed to a temperature of 260oC for 10 seconds, repeated three times. Water Absorption: Water absorption indicates the extent to which the material absorbs water under specific conditions. The values provided are less than or equal to 0.05% when measured at 20±2oC for 24 hours. Density: Density refers to the mass per unit volume of the material at room temperature. The values provided are 2.25 g/cm3 for F4BTME298 and F4BTME300, and 2.20 g/cm3 for F4BTME320 and F4BTME350. Long-Term Operating Temperature: This parameter specifies the temperature range within which the material can operate effectively over an extended period. The range mentioned is from -55oC to +260oC. Thermal Conductivity (Z direction): Thermal conductivity measures the material's ability to conduct heat in the Z direction. The values provided are 0.42 W/(M.K) for F4BTME298 and F4BTME300, and 0.50 W/(M.K) for F4BTME320 and 0.54 W/(M.K) for F4BTME350. PIM (Passive Intermodulation): PIM refers to the generation of unwanted signals caused by nonlinearities in the material. The values provided are applicable only to F4BTME and are less than or equal to -160 dBc. Flammability: Flammability indicates the material's resistance to burning. The material composition meets the UL-94 V-0 standard. Material Composition: This section provides information about the components that make up the material. The composition includes PTFE (Polytetrafluoroethylene), Fiberglass Cloth, and nano-ceramics. F4BTM is paired with ED (Electro-Deposited) copper foil, while F4BTME is paired with reverse-treated (RTF) copper foil. Product Technical Parameters Product Models & Data Sheet Product Features Test Conditions Unit F4BTME298 F4BTME300 F4BTME320 F4BTME350 Dielectric Constant (Typical) 10GHz / 2.98 3.0 3.2 3.5 Dielectric Constant Tolerance / / ±0.06 ±0.06 ±0.06 ±0.07 Loss Tangent (Typical) 10GHz / 0.0018 0.0018 0.0020 0.0025 20GHz / 0.0023 0.0023 0.0026 0.0035 Dielectric Constant Temperature Coefficient -55 º~150ºC PPM/℃ -78 -75 -75 -60 Peel Strength 1 OZ F4BTM N/mm >1.6 >1.6 >1.6 >1.6 1 OZ F4BTME N/mm >1.4 >1.4 >1.4 >1.4 Volume Resistivity Standard Condition MΩ.cm ≥1×10^7 ≥1×10^7 ≥1×10^7 ≥1×10^7 Surface Resistivity Standard Condition MΩ ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 Electrical Strength (Z direction) 5KW，500V/s KV/mm >26 >30 >32 >32 Breakdown Voltage (XY direction) 5KW，500V/s KV >34 >35 >40 >40 Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 15，16 15，16 13，15 10，12 Z direction -55 º~288ºC ppm/ºC 78 72 58 51 Thermal Stress 260℃, 10s，3 times No delamination No delamination No delamination No delamination Water Absorption 20±2℃, 24 hours % ≤0.05 ≤0.05 ≤0.05 ≤0.05 Density Room Temperature g/cm3 2.25 2.25 2.20 2.20 Long-Term Operating Temperature High-Low Temperature Chamber ℃ -55～+260 -55～+260 -55～+260 -55～+260 Thermal Conductivity Z direction W/(M.K) 0.42 0.42 0.50 0.54 PIM Only applicable to F4BTME dBc ≤-160 ≤-160 ≤-160 ≤-160 Flammability / UL-94 V-0 V-0 V-0 V-0 Material Composition / / PTFE, Fiberglass Cloth, nano-ceramics F4BTME Laminate and Applications On the screen, you can see a F4BTME298 PCB substrate. F4BTME series laminates are employed in a wide range of applications, such as Antenna, Mobile Internet, Sensor Network, Radar, Millimeter Wave Radar, Aerospace, Satellite Navigation, Beidou, Missile-borne, Power Amplifier, and Radio Frequency. Final （F4BTME series aluminum-based/copper-based substrates） F4BTME series of laminates can provide aluminum-based or copper-based materials, where one side of the dielectric layer is covered with copper foil, and the other side of the dielectric layer is covered with either aluminum-based or copper-based material. This arrangement serves the purpose of shielding or heat dissipation. For examples, F4BTME350-CU represents F4BTME350 series with copper-based substrate..
F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil. .jpg)
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