F4BTMS220 High Frequency PCB Material

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F4BTMS220 High Frequency PCB Material

Introduction

The F4BTMS series represents a significant technological upgrade over the original F4BTM series, incorporating breakthroughs in material composition and production processes. This enhanced formulation integrates a high proportion of ceramic content and ultra-thin, ultra-fine fiberglass cloth reinforcement, delivering superior performance across a wider range of dielectric constants. Designed as a high-reliability solution for aerospace and defense applications, F4BTMS materials are capable of replacing comparable imported products with excellent consistency and stability.

Key Technological Innovations:

Optimized Reinforcement Strategy: The use of minimal ultra-thin fiberglass cloth reduces electromagnetic wave interference, significantly lowering dielectric loss and improving dimensional stability.

Advanced Composite Matrix: A homogeneous blend of specialized nanoceramics and PTFE resin ensures reduced anisotropy in X/Y/Z directions, enabling higher frequency operation, enhanced electrical strength, and improved thermal conductivity.

Excellent Thermal and Electrical Stability: The material exhibits a low coefficient of thermal expansion (CTE) and stable dielectric properties across temperature variations.

Material Configuration and Options:

F4BTMS laminates are supplied with RTF low-profile copper foil as standard, which reduces conductor loss while maintaining strong peel strength. The series supports both copper-based and aluminum-based substrate configurations to suit diverse design requirements. For example, F4BTMS220 PCB Substrate offers a balanced performance profile for general high-frequency designs, while F4BTMS294 material can be combined with embedded 50Ω resistor foil to create integrated resistor film substrates.

Processing Advantages:

Compatible with standard PTFE PCB manufacturing processes, F4BTMS materials leverage excellent mechanical and physical properties to support complex fabrication needs, including:

Multi-layer and high-layer-count constructions

Backplane and large-format board processing

High-density microvias and fine-line routing

This combination of electrical performance, processability, and reliability makes the F4BTMS series—including models such as F4BTMS220—an ideal choice for advanced RF, microwave, and high-speed digital applications where signal integrity, thermal management, and durability are critical.

Product Features

- Minimal dielectric constant tolerance and excellent batch-to-batch consistency.

- Extremely low dielectric loss.

- Stable dielectric constant and low loss within frequencies up to 40GHz, meeting the requirements of phase-sensitive applications.

- Excellent temperature coefficient of dielectric constant and dielectric loss, maintaining frequency and phase stability between -55°C and 150°C.

- Excellent resistance to radiation, retaining stable dielectric and physical properties even after exposure to irradiation.

- Low outgassing performance, meeting the vacuum outgassing requirements for aerospace applications.

- Minimal thermal expansion coefficients in the X/Y/Z directions, ensuring dimensional stability and reliable hole copper connections.

- Improved thermal conductivity, suitable for high-power applications.

- Excellent dimensional stability.

- Low water absorption.

Models & Data Sheet

Here are the technical parameters of the different product models:

Product Models: F4BTMS220 F4BTMS233 F4BTMS255 F4BTMS265 F4BTMS294 F4BTMS300 F4BTMS350 F4BTMS430 F4BTMS450 F4BTMS615 F4BTMS1000

Dielectric Constant (Typical): Test Conditions: 10 GHz Values: F4BTMS220: 2.2 F4BTMS233: 2.33 F4BTMS255: 2.55 F4BTMS265: 2.65 F4BTMS294: 2.94 F4BTMS300: 3.00 F4BTMS350: 3.50 F4BTMS430: 4.30 F4BTMS450: 4.50 F4BTMS615: 6.15 F4BTMS1000: 10.20

Dielectric Constant Tolerance: Values: F4BTMS220: +/-0.02; F4BTMS233: +/-0.03; F4BTMS255: +/-0.04; F4BTMS265: +/-0.04; F4BTMS294: +/-0.04; F4BTMS300: +/-0.04; F4BTMS350: +/-0.04; F4BTMS430: +/-0.05; F4BTMS450: +/-0.09; F4BTMS615: +/-0.09; F4BTMS1000: +/-0.12

Dielectric Constant (Design): Test Conditions: 10 GHz Values are the same as the "Dielectric Constant (Typical)" section.

Loss Tangent (Typical): Test Conditions: 10 GHz 20 GHz 40 GHz

Values: F4BTMS220: 10 GHz: 0.0009 20 GHz: 0.0010 40 GHz: 0.0013

F4BTMS233: 10 GHz: 0.0010 20 GHz: 0.0011 40 GHz: 0.0015

F4BTMS255: 10 GHz: 0.0012 20 GHz: 0.0013 40 GHz: 0.0016

F4BTMS265: 10 GHz: 0.0012 20 GHz: 0.0014 40 GHz: 0.0018

F4BTMS294: 10 GHz: 0.0012 20 GHz: 0.0014 40 GHz: 0.0018

F4BTMS300: 10 GHz: 0.0013 20 GHz: 0.0015 40 GHz: 0.0019

F4BTMS350: 10 GHz: 0.0016 20 GHz: 0.0019 40 GHz: 0.0024

F4BTMS450: 10 GHz: 0.0015 20 GHz: 0.0019 40 GHz: 0.0024

F4BTMS615: 10 GHz: 0.0020 20 GHz: 0.0023 40 GHz: /

F4BTMS1000: 10 GHz: 0.0020 20 GHz: 0.0023 40 GHz: /

Product Technical Parameters			Product Models & Data Sheet
Product Features	Test Conditions	Unit	F4BTMS220	F4BTMS233	F4BTMS255	F4BTMS265	F4BTMS294	F4BTMS300	F4BTMS350	F4BTMS430	F4BTMS450	F4BTMS615	F4BTMS1000
Dielectric Constant (Typical)	10GHz	/	2.2	2.33	2.55	2.65	2.94	3.00	3.50	4.30	4.50	6.15	10.20
Dielectric Constant Tolerance	/	/	±0.02	±0.03	±0.04	±0.04	±0.04	±0.04	±0.05	±0.09	±0.09	±0.12	±0.2
Dielectric Constant (Design)	10GHz	/	2.2	2.33	2.55	2.65	2.94	3.0	3.50	4.3	4.5	6.15	10.2
Loss Tangent (Typical)	10GHz	/	0.0009	0.0010	0.0012	0.0012	0.0012	0.0013	0.0016	0.0015	0.0015	0.0020	0.0020
	20GHz	/	0.0010	0.0011	0.0013	0.0014	0.0014	0.0015	0.0019	0.0019	0.0019	0.0023	0.0023
	40GHz	/	0.0013	0.0015	0.0016	0.0018	0.0018	0.0019	0.0024	0.0024	0.0024	/	/
Dielectric Constant Temperature Coefficient	-55 º~150ºC	PPM/℃	-130	-122	-92	-88	-20	-20	-39	-60	-58	-96	-320
Peel Strength	1 OZ RTF copper	N/mm	>2.4	>2.4	>1.8	>1.8	>1.2	>1.2	>1.2	>1.2	>1.2	>1.2	>1.2
Volume Resistivity	Standard Condition	MΩ.cm	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8

Surface Resistivity

Standard Condition

MΩ

≥1×10^8

Electrical Strength (Z direction)

5KW, 500V/s

KV/mm

>26

>30

>32

>34

>40

>42

>44

>45

>48

>23

Breakdown Voltage (XY direction)

5KW, 500V/s

>35

>38

>40

>42

>48

>52

>55

>52

>54

>55

>42

Coefficientof Thermal Expansion (X, Y direction)

-55 º~288ºC

ppm/ºC

40, 50

35, 40

15, 20

10, 12

10, 11

10, 12

13, 12

12, 12

10, 12

16, 18

Coefficientof Thermal Expansion (Z direction)

-55 º~288ºC

ppm/ºC

290

220

Thermal Stress

260℃, 10s, 3 times

No delamination

Water Absorption

20±2℃, 24 hours

0.02

0.025

0.02

0.025

0.03

0.08

0.1

0.03

Density

Room Temperature

g/cm3

2.18

2.22

2.26

2.25

2.28

2.3

2.51

2.53

2.75

3.2

Long-Term Operating Temperature

High-Low Temperature Chamber

℃

-55～+260

Thermal Conductivity

Z direction

W/(M.K)

0.26

0.28

0.31

0.36

0.58

0.6

0.63

0.64

0.67

0.81

Flammability

UL-94

V-0

Material Composition

PTFE, Ultra-thin and ultra-fine (quartz) fiberglass.

PTFE, Ultra-thin and ultra-fine fiberglass, ceramics.

A F4BTMS Laminate and Typical Applications:

Presented on the screen is an F4BTMS220 substrate . F4BTMS220 high-frequency laminates are extensively employed in various domains, including:

Aerospace and aviation equipment, space installations, and cabin setups. Microwave and RF applications. Radar systems, particularly in military applications. Feed networks for signal distribution. Phase-sensitive antennas and phased array antennas. Satellite communications, and much more.

Final

(F4BTMS series aluminum-based/copper-based boards) This series of laminates can provide aluminum-based or copper-based materials, where one side of the dielectric layer is covered with copper foil, and the other side is covered with an aluminum-based or copper-based layer. This configuration serves as shielding or heat dissipation.

The model numbers are F4BTMS***-AL or F4BTMS***-CU. For example, F4BTMS220-AL represents F4BTMS220 with aluminum-based substrate. F4BTMS294-CU represents F4BTMS294 with copper-based substrate.