Rogers RO4725JXR High Frequency PCB Material Introduction Hello and welcome back to our channel. Today, we're going to talk about an exciting new development in the world of antenna design: RO4725JXR antenna grade laminate. In the world of antenna design, finding the right material for the job can be a daunting task. Thankfully, Rogers RO4725JXR antenna grade laminates provide a reliable and efficient alternative to conventional PTFE-based laminates that have been used in antenna design for many years. With its exceptional mechanical and electrical properties, antenna designers can achieve substantial gain values while minimizing signal loss. Rogers RO4725JXR materials are compatible with conventional epoxy and high temperature lead-free solder processing, do not require special treatment for plated through hole preparation and lamination can be achieved using the RO4400 bondply series at 175°C. Here are more details on the data sheet. RO4725JXR Typical Properties Rogers RO4725JXR high frequency circuit material has a process dielectric constant of 2.55 ± 0.05 in the Z direction at 10 GHz and 23°C, as measured by the IPC-TM-650, 2.5.5.5 test method. Its design dielectric constant is 2.64 in the Z direction at 1.7 GHz to 5 GHz, as measured by the differential phase length method. It has a dissipation factor of 0.0026 in the Z direction at 10 GHz and 23°C, as measured by the IPC-TM-650, 2.5.5.5 test method. At 2.5 GHz, its dissipation factor is 0.0022. It also has a thermal coefficient of dielectric constant of +34 ppm/°C in the Z direction between -50°C to 150°C, as measured by the IPC-TM-650, 2.5.5.5 test method. Rogers RO4725JXR has a volume resistivity of 2.16 X 10^8 M??cm and a surface resistivity of 4.8 X 10^7 M? at 0.030", both measured under COND A using the IPC-TM-650, 2.5.17.1 test method. Rogers RO4725JXR laminate has a very low PIM value of -166 dBc at 50 ohm on 0.060" thick material, with a power level of 43 dBm at 1900MHz. Its electrical strength is 630 V/mil at 0.030", as measured by the IPC-TM-650, 2.5.6.2 test method. Its flexural strength is 121 MPa in the MD direction and 92 MPa in the CMD direction, as measured by the ASTM D790 test method at room temperature. RO4725JXR has a dimensional stability of less than 0.4 mm/m in the X and Y directions after etch, with an E2/150°C condition, as measured by the IPC-TM-650, 2.4.39A test method. Its coefficient of thermal expansion is 13.9 ppm/°C in the X direction, 19.0 ppm/°C in the Y direction, and 25.6 ppm/°C in the Z direction between -55°C to 288°C, as measured by the IPC-TM-650, 2.1.24 test method. The thermal conductivity of RO4725JXR is 0.38 W/mK° at 50°C, as measured by the ASTM D5470 test method. Its moisture absorption is 0.24% at 48 hours 50oC, as measured by the IPC-TM-650 2.6.2.1 and ASTM D570 test methods. Rogers RO4725JXR material has a Tg value greater than 280°C, as measured by the IPC-TM-650 2.4.24 test method, and a Td value of 439°C, as measured by the ASTM D3850 test method. Its density is 1.27 gm/cm3, as measured by the ASTM D792 test method. RO4725JXR has a copper peel strength of 8.5 pli for 1 oz LoPro ED copper, as measured by the IPC-TM-650 2.4.8 test method. It is also lead-free process compatible. Property Typical Value Direction Units Condition Test Method Dielectric Constant, εr Process 2.55 ± 0.05 Z 10 GHz/23°C IPC-TM-650, 2.5.5.5 Dielectric Constant, εr Design 2.64 Z 1.7 GHz - 5 Differential Phase Length Method Dissipation Factor 0.0026 Z 10 GHz/23°C IPC-TM-650, 2.5.5.5 0.0022 2.5GHz Thermal Coefficient of εr +34 Z ppm/°C -50°C to 150°C IPC-TM-650, 2.5.5.5 Volume Resistivity (0.030") 2.16 X 10^8 MΩ•cm COND A IPC-TM-650, 2.5.17.1 Surface Resistivity (0.030") 4.8 X 10^7 MΩ COND A IPC-TM-650, 2.5.17.1 PIM -166 dBc 50 ohm 43dBm Electrical Strength (0.030”) 630 Z V/mil IPC-TM-650, 2.5.6.2 Flexural Strength MD 121 (17.5) MPa RT ASTM D790 CMD 92 (13.3) Dimensional Stability <0.4 X,Y mm/m after etch IPC-TM-650, 2.4.39A Coefficient of Thermal 13.9 X ppm/°C -55 TO 288°C IPC-TM-650, 2.1.24 19.0 Y 25.6 Z Thermal Conductivity 0.38 Z W/mK° 50°C ASTM D5470 Moisture Absorption 0.24% % 48/50 IPC-TM-650 2.6.2.1 ASTM D570 Tg >280 °C IPC-TM-650 2.4.24 Td 439 °C ASTM D3850 Density 1.27 gm/cm3 ASTM D792 Copper Peel Strength 8.5 pli 1 oz LoPro EDC IPC-TM-650 2.4.8 Lead-Free Process Compatible YES A Piece of RO4725JXR Laminate Now on the screen is a Rogers RO4725JXR PCB material. The typical application is cellular base station antennas. Conclusion When non-PTFE materials such as RO4725JXR are used for PCB antennas, their PIM performance consistently reaches levels even better than -164dBc. This special thermosetting resin and unique fillers material can achieve low PIM levels without sacrificing electrical and mechanical performance. Whether it is a base station antenna or other passive components (such as couplers and filters), PIM must be kept at the lowest level to ensure the highest quality of voice, data, and video communications in the system. Therefore, no matter how carefully the circuit is designed, the choice of PCB material largely determines the final achievable PIM.
GHz
0.060”
1900MHz
(kpsi)
+E2/150°C
Expansion
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