Rogers Diclad 527 PCB Raw Materials Introduction Hello! Welcome back to our channel. Today, we have an exciting topic to discuss that is sure to pique the interest of all electronics enthusiasts out there. We are diving into the world of DiClad 527 laminates. Rogers DiClad 527 laminates are composite materials based on woven fiberglass reinforcement and PTFE. They are specifically designed for use as substrates in printed circuit boards. Rogers DiClad 527 high frequency circuit materials offer a greater proportion of fiberglass reinforcement compared to PTFE content. This precise controlled ratio results in an expanded range of dielectric constants (Dk) and enhanced dimensional stability and registration. Next, let's take a look at the table of data sheet to understand the specific performance characteristics of the material. Data Sheet DiClad 527 substrate boasts a same dielectric constant range from 2.40 to 2.60 at 23˚C and 50% relative humidity, tested at 10GHz and 1MHz. This characteristic ensures efficient signal propagation. The dissipation factor, a measure of energy loss, is exceptionally low at 0.0017 at a frequency of 10 GHz and 0.0010 at a frequency of 1 MHz, guaranteeing minimal signal distortion. Furthermore, the thermal coefficient of dielectric constant is -153 ppm/˚C in the temperature range of -10 to 140˚C at 10 GHz, following IPC TM-650 2.5.5.5 test method. The volume resistivity is 1.2 x 10^9 MΩ-cm, measured using C96/35/90 test method; and the surface resistivity is 4.5 x 10^7 MΩ, determined with C96/35/90 test method, exhibiting excellent electrical insulation properties. It also boasts a dielectric breakdown strength exceeding 45 kV, rendering it highly reliable. The arc resistance value of over 180 further enhances its robustness. Rogers DiClad 527 demonstrates remarkable thermal performance. The coefficient of thermal expansion is 14 ppm/˚C (x), 21 ppm/˚C (y), and 173 ppm/˚C (z) in the temperature range of 50˚C to 150˚C, as per IPC TM-650 2.4.41 and IPC TM-650 2.4.24 test methods, respectively. The material exhibits a thermal conductivity of 0.26 W/(m.K), following ASTM E1461 test method. When it comes to mechanical strength, DiClad 527 excels. With a copper peel strength of 14 Lbs/in, it provides a strong bond even at high temperatures (tested at 288˚C for 10 seconds using 35 μm foil). Its Young's modulus, a measure of stiffness, ranges from 517 to 706 kpsi, ensuring structural integrity. Tensile strength values of 19.0 kpsi (MD) and 15.0 kpsi (CMD) highlight its resistance to deformation under tension. Additionally, the compressive modulus of 359 kpsi and flex modulus of 537 kpsi attest to its ability to withstand compressive and flexural loads, respectively. In terms of safety and reliability, DiClad 527 meets rigorous standards. It achieves a flammability rating of V-0, indicating excellent flame resistance. With moisture absorption of just 0.03%, it remains dimensionally stable even in humid environments. The material's density of 231 g/cm³ ensures compact designs without compromising performance. Notably, DiClad 527 has undergone NASA outgassing testing, a critical consideration for space applications. During this evaluation, the material exhibited a minimal total mass loss of 0.02% at 125°C and ≤ 10^-6 torr vacuum pressure. The collected volatiles were measured at 0%, and water vapor recovery reached an impressive 0.01%. Typical Value Properties DiClad 527 Units Test Conditions Test Method Electrical Properties Dielectric Constant 2.40-2.60 - 23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5 Dielectric Constant 2.40-2.60 - 23˚C @ 50% RH 1 MHz IPC TM-650 2.5.5.3 Dissapation Factor 0.0017 23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5 Dissapation Factor 0.0010 - 23˚C @ 50% RH 1 MHz IPC TM-650 2.5.5.3 Thermal Coefficient of Dielectric -153 ppm/˚C -10 to 140˚C 10 GHz IPC TM-650 2.5.5.5 Volume Resistivity 1.2 x 10^9 MΩ-cm C96/35/90 - IPC TM-650 2.5.17.1 Surface Resistivity 4.5 x 10^7 MΩ C96/35/90 - IPC TM-650 2.5.17.1 Dielectric Breakdown >45 kV D48/50 - ASTM D-149 Arc Resistance >180 - - ASTM D-495 Thermal Properties Coefficient of Thermal Expansion - x 14 ppm/˚C - 50˚C to 150˚C IPC TM-650 2.4.41 Coefficient of Thermal Expansion - y 21 ppm/˚C - 50˚C to 150˚C IPC TM-650 2.4.41 Coefficient of Thermal Expansion - z 173 ppm/˚C - 50˚C to 150˚C IPC TM-650 2.4.24 Thermal Conductivity 0.26 W/(m.K) ASTM E1461 Mechanical Properties Copper Peel Strength 14 Lbs/in 10s @288˚C 35 μm foil IPC TM-650 2.4.8 Young’s Modulus 517, 706 kpsi 23˚C @ 50% RH - ASTM D-638 Tensile Strength (MD, CMD) 19.0, 15.0 kpsi 23˚C @ 50% RH - ASTM D-882 Compressive Modulus 359 kpsi 23˚C @ 50% RH - ASTM D-695 Flex Modulus 537 kpsi 23˚C @ 50% RH - ASTM D-3039 Physical Properties Flammability V-0 - - C48/23/50 & UL 94 Moisture Absorption 0.03 % E1/105+D24/23 IPC TM-650 2.6.2.2 Density 231 g/cm³ C24/23/50 Method A ASTM D792 NASA Total Mass Lost 0.02 % 125°C, ≤ 10-6 torr NASA SP-R-0022A Collected Volatiles 0.00 % Water Vapor Recovered 0.01 % DiClad 527 Laminate and Typical Applications Displayed on the screen is a DiClad 527 laminate. Rogers DiClad 527 copper clad laminates find typical applications in a range of industries and technologies. Some specific applications where they excel include digital radio antennas，radar feed networks, commercial phased array networks, low loss base station, guidance systems, filters, couplers and LNAs etc. Final (metallization) Rogers DiClad 527 PCB materials can be seamlessly integrated into conventional electroless copper and direct deposit metallization processes. Prior to metal deposition, it is advisable to bake the cores for 30-90 minutes at temperatures ranging from 110°C to 125°C (230°F - 260°F), unless the hole walls have been prepared for plating using plasma, which also acts as a vacuum bake. To enhance the structural integrity of the hole walls during outer-layer processing, it is recommended to apply a flash plate build-up of copper measuring 0.0001" to 0.0003" (2.5µm - 7.6µm). Well, that’s conclusion of today’s episode. Thank you for reading. See you next time.
Constant
C168/70
Outgassing
.jpg)
Home