TFA294 High Frequency PCB Material Introduction The dielectric layer of the TFA 294 substrate is composed of PTFE resin and ceramics. TFA 294 substrate utilizes a Polytetrafluoroethylene (PTFE) ceramic composite as its dielectric material. Unlike traditional processes that involve impregnating glass fiber cloth with resin to produce prepregs, TFA 294 laminate adopts an advanced new process for prepreg fabrication, followed by pressing via a specialized lamination technology. TFA 294 high frequency circuit materials delivers outstanding electrical, thermal, and mechanical performance, boasting superior dielectric constant among materials of the same class. The dielectric constant of the TFA series includes four options: 2.94, 3.0, 6.15, and 10.2 for selection, with corresponding part numbers TFA294, TFA300, TFA615, and TFA1020 respectively. As an aerospace-grade high-frequency, high-reliability material, TFA 294 is capable of replacing equivalent foreign products. TFA 294 substrate is free of glass fiber cloth. It incorporates a high volume of uniformly dispersed special nano-ceramics blended with resin, which eliminates the fiberglass effect during electromagnetic wave propagation. TFA 294 high frequency laminate offers excellent frequency stability and minimal dielectric loss compared to peer materials. Additionally, it features minimized X/Y/Z anisotropy, a low thermal expansion coefficient matching that of copper foil, and stable dielectric temperature characteristics. The TFA series laminates come standard with RTF low roughness copper foil, which reduces conductor loss while ensuring excellent peel strength. They can also be paired with rolled copper foil, and the TFA series is compatible with copper-based or aluminum-based materials. TFA294 and TFA300 can be paired with buried 50Ω resistance copper foil to form a resistance film laminate. TFA294 copper clad laminates can be processed using standard PTFE board processing technology, exhibiting excellent mechanical and physical properties suitable for multi-layer, high-layer, and backplane processing. They also demonstrate excellent processability in dense hole and fine line processing. Features 1.Small dielectric constant tolerance, excellent batch-to-batch consistency. 2.Lowest dielectric loss at the same level. 3.Operating frequency up to 77 GHz, suitable for millimeter-wave and automotive radar applications. 4.Maintains excellent frequency stability and phase stability between -55°C and 150°C. 5.Excellent radiation resistance; even after irradiation treatment, it retains stable dielectric and physical properties. 6.Low outgassing performance; meets the vacuum outgassing requirements for aerospace applications according to standard methods for testing material volatilization under vacuum conditions. 7.Outstanding thermal expansion coefficient equivalent to copper foil; ensures the reliability of plated-through holes and dimensional thermal stability. 8.Low water absorption; ensures material stability in humid environments. Typical Applications Aerospace and aviation equipment, space and cabin equipment, aircraft Microwave, antennas, phase-sensitive antennas Warning radar, airborne radar, and various radar systems Phased array antennas, beamforming networks Satellite communication, navigation Power amplifiers Data Sheet Product Technical Parameter Typical Value Properties Test conditions Unit TFA294 TFA300 TFA615 TFA1020 Dielectric constant 10GHz / 2.94 3.00 6.15 10.20 Dielectric constant 10GHz / 2.94 3.00 6.4 10.7 Dielectric / / ±0.04 ±0.04 ±0.12 ±0.20 Loss factor 10GHz / 0.001 0.001 0.0015 0.0015 20GHz / 0.001 0.001 0.0017 0.0017 40GHz / 0.0012 0.0012 / / Dielectric constant -55 º~150ºC PPM/℃ -5 -8 -215 -340 Peel strength 1 OZ RTF N/mm >1.6 >1.6 >1.6 >1.6 Volumetric Normal MΩ.cm ≥5×107 ≥5×107 ≥5×107 ≥5×107 Surface resistance Normal MΩ ≥5×107 ≥5×107 ≥5×107 ≥5×107 Electrical strength 5KW，500V/s KV/mm >35 >32 >30 >30 Breakdown voltage 5KW，500V/s KV >40 >40 >30 >25 Thermal expansion -55 º~288ºC ppm/ºC 18, 18 18, 18 16, 16 16, 16 Thermal expansion -55 º~288ºC ppm/ºC 32 30 29 30 Thermal stress 260℃, 10s，3 - Not stratified Not stratified Not stratified Not stratified Water absorption 20±2℃, 24h % 0.03 0.04 0.06 0.015 Density Normal g/cm3 2.14 2.15 2.5 3.0 Long-term High and low ℃ -55～+260 -55～+260 -55～+260 -55～+260 Thermal Z-direction W/(M.K) 0.59 0.60 0.80 0.88 Flame retardancy / UL-94 V-0 V-0 V-0 V-0 TD Starting value ℃ 498 498 503 505 Material / / PTFE，ceramics
Conclusion The TFA series PTFE-ceramic composite substrate delivers a definitive answer to the most critical design challenges faced by RF engineers. By strategically eliminating glass reinforcement—a long-standing source of signal inconsistency—through its pioneering nano-ceramic composition, this substrate achieves a new benchmark in high-frequency performance.TFA 294 high frequency laminate offers a powerful synergy of unprecedented signal integrity, exceptional batch-to-batch consistency, and proven environmental robustness, all within a domestically manufactured platform. When the success of a design hinges on reliability at 77 GHz or stability from -55°C to 150°C,TFA 294 laminate provides the material foundation that not only meets but exceeds the rigorous demands of modern and future high-frequency electronics..jpg)
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constant tolerance
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temperature coefficient
copper foil
resistivity
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coefficient (Z-direction)
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temperature
use temperature
temperature box
conductivity
composition
（a very small amount of glass fiber cloth is added
when the dielectric thickness exceeds 1.5 mm）
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