Rogers CLTE-XT High Frequency Laminates Introduction Good morning and greetings, everyone. Welcome back to our channel. We’re delighted to share valuable insights with you in the field of RF laminate technology. Today, we’ll be discussing a type of special RF laminates that utilizing extended technology for higher performance: Rogers CLTE-XT laminate. Rogers CLTE-XT laminates consist of a combination of micro-dispersed ceramic filler, PTFE, and woven fiberglass reinforcement, aiming to enhance loss tangent while ensuring excellent dimensional stability. Rogers CLTE series materials offer the lowest insertion loss and the highest level of dimensional stability within its category. Building upon the reliability of CLTE laminates, CLTE-XT materials maintain its properties across an even broader temperature range. Now let’s explore the various properties of CLTE-XT and their corresponding test methods. Electrical Properties CLTE-XT laminate exhibits a dielectric constant ranging from 2.79 to 2.94 at different thicknesses, such as 5.1mil, 9.4mil, 20mil, and 30mil. These measurements were conducted at 10 GHz and 23°C with 50% relative humidity using the IPC TM-650 2.5.5.5 test method. It demonstrates a low dissipation factor of 0.0010 at 10 GHz and 23°C with 50% relative humidity, as determined by the IPC TM-650 2.5.5.5 test method. The design value for the dielectric constant is 2.93, as determined through the Microstrip Differential Phase Length test method at 10 GHz and C-24/23/50 conditions. CLTE-XT exhibits a thermal coefficient of dielectric constant of -8 ppm/°C, as measured from -50°C to 150°C at 10 GHz using the IPC TM-650 2.5.5.5 test method. The volume resistivity is measured to be 4.25x10^8 Mohm-cm using the C-96/35/90 test method. The surface resistivity is demonstrated at 2.49x10^8 Mohm as determined by the C-96/35/90 test method. CLTE-XT exhibits an electrical strength of 1000 V/mil, as tested using the IPC TM-650 2.5.6.2 method. The dielectric breakdown voltage is measured to be 58 kV in both X and Y directions using the D-48/50 test method. Thermal Properties: Rogers CLTE-XT PCB raw materials have a decomposition temperature of 539°C, with a 5% weight loss observed over a 2-hour period at 105°C, according to the IPC TM-650 2.3.40 test method. It displays a coefficient of thermal expansion of 12.7 ppm/°C in x-axis, 13.7 ppm/°C in y-axis, and 40.8 ppm/°C in z-axis over a temperature range of -55°C to 288°C, as measured by the IPC TM-650 2.4.41 test method. The thermal conductivity is determined to be 0.56 W/(m·K) in the z direction according to ASTM D5470. CLTE-XT demonstrates excellent resistance to delamination, with a minimum time of more than 60 minutes observed at 288°C under as-received conditions, as per the IPC TM-650 2.4.24.1 test method. Mechanical Properties: CLTE-XT exhibits a copper peel strength of 1.7 N/mm when subjected to thermal stress at 288°C for 10 seconds using 35 μm foil, as determined by the IPC TM-650 2.4.8 test method. The flexural strength is measured to be 40.7 MPa in the machine direction (MD) and 40.0 MPa in the cross-machine direction (CMD) at 25°C ± 3°C, following the ASTM D790 test method. It exhibits a tensile strength of 29.0 MPa in the MD and 25.5 MPa in the CMD at 23°C with 50% relative humidity, as per the ASTM D638 test method. The flex modulus of CLTE-XT is measured to be 3247 MPa in the MD and 3261 MPa in the CMD at 25°C ± 3°C, following the ASTM D790 test method. It displays excellent dimensional stability with a minimal change of -0.37 mm/m (MD) and -0.67 mm/m (CMD) after 4 hours at 105°C, as determined by the IPC-TM-650 2.4.39a test method. Physical Properties: CLTE-XT has achieved a V-0 rating according to the UL 94 standard, indicating excellent flame retardancy. It exhibits low moisture absorption with a value of 0.02% as determined by the E1/105+D24/23 test method. The density is measured to be 2.17 g/cm3 using the C-24/23/50 test method outlined in ASTM D792. It has a specific heat capacity of 0.61 J/g·K after being subjected to 2 hours at 105°C, according to ASTM E2716. NATA Outgassing: CLTE-XT has a minimal total mass lost of 0.02% as determined by the ASTM E595 test method. No specific data is provided for Collected Volatile Condensible Material. Properties CLTE-XT Laminate Units Test Conditions Test Method Electrical Properties Dielectric Constant 2.94 - 23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5 Dissipation Factor 0.0010 - 23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5 Dielectric Constant (design) 2.93 - C-24/23/50 10 GHz Microstrip Differential Phase Length Thermal Coefficient of Dielectric Constant -8 ppm/˚C -50°C to 150°C 10 GHz IPC TM-650 2.5.5.5 Volume Resistivity 4.25x10⁸ Mohm-cm C-96/35/90 - IPC TM-650 2.5.17.1 Surface Resistivity 2.49x10⁸ Mohm C-96/35/90 - IPC TM-650 2.5.17.1 Electrical Strength (dielectric strength) 1000 V/mil - - IPC TM-650 2.5.6.2 Dielectric Breakdown 58 kV D-48/50 X/Y direc- tion IPC TM-650 2.5.6 PIM (For antenna only) - dBc - 50 ohm 43dBm 1900 MHz Thermal Properties Decomposition Temperature (Td) 539 ˚C 2hrs @ 105˚C 5% Weight Loss IPC TM-650 2.3.40 Coefficient of Thermal Expansion - x 12.7 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41 Coefficient of Thermal Expansion - y 13.7 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41 Coefficient of Thermal Expansion - z 40.8 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41 Thermal Conductivity 0.56 W/(m.K) - z direction ASTM D5470 Time to Delamination >60 minutes as-received 288˚C IPC TM-650 2.4.24.1 Mechanical Properties Copper Peel Strength after Thermal Stress 1.7 N/mm (lbs/ in) 10s @288˚C 35 μm foil IPC TM-650 2.4.8 Flexural Strength (MD, CMD) 40.7, 40.0 MPa (ksi ) 25˚C±3˚C - ASTM D790 Tensile Strength (MD, CMD) 29.0, 25.5 MPa (ksi ) 23C/50RH - ASTM D638 Flex Modulus (MD. CMD) 3247, 3261 MPa (ksi ) 25C±3C - ASTM D790 Dimensional Stability (MD, CMD) -0.37, -0.67 mm/m 4 hr at 105˚C - IPC-TM-650 2.4.39a Physical Properties Flammability V-0 - - C48/23/50 & C168/70 UL 94 Moisture Absorption 0.02 % E1/105+D24/23 - IPC TM-650 2.6.2.1 Density 2.17 g/cm³ C-24/23/50 - ASTM D792 Specifc Heat Capacity 0.61 J/g˚K 2 hours at 105˚C - ASTM E2716 NASA Outgassing 0.02 / 0.00 % TML/CVCM ASTM E595 CLTE-XT Laminate and Typical Applications Now displayed on the screen is a CLTE-XT Laminate . We can find its widespread applications across various cutting-edge technologies, including advanced driver assistance systems (ADAS), patch antennas, phased array antennas，and power amplifiers etc. Final Rogers CLTE-XT copper clad laminates are composite materials consisting of woven glass reinforcement filled with PTFE. These laminates exhibit exceptional thermal reliability and electrical performance. They are designed to be compatible with manufacturing processes for double-sided and multilayer PCBs using PTFE materials. The processing tools such as developers, strippers, and copper etchants commonly used in the fabrication of epoxy glass PCBs can also be utilized for CLTE-XT layers. However, when dealing with thin cores, it may be necessary to use leader boards for conveyorized processing or frames and supportive racks for vertical-type processing. Furthermore, the ceramic filled material requires more stringent rinse and bake processing, which may vary depending on the subsequent steps in the process sequence. That concludes today's episode. Thank you for reading, and we'll see you next time.
0.060"
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(5.9, 5.8)
(4.2, 3.7)
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