Rogers RT/duroid 5870 High Frequency PCB Material Introduction Greetings, everyone! Welcome back to our channel. In today's article, we will be discussing the construction of RT/duroid 5870 high-frequency laminates. Rogers RT/duroid 5870 laminates are advanced PTFE composites that incorporate glass microfibers for reinforcement. Rogers 5870 laminates offer exceptional performance in high-frequency applications, characterized by a low dielectric constant (Dk). The incorporation of randomly oriented microfibers within the PTFE composites ensures a remarkable level of Dk uniformity. With its low Dk loss, RT/duroid 5870 PCB materials are particularly well-suited for high-frequency and broadband applications where minimizing dispersion and losses is crucial. These laminates extend their effectiveness to frequencies in the Ku-band and beyond. Thank you for tuning in, and let's delve into the details of RT/duroid 5870 laminates. Data sheet During the manufacturing process, the dielectric constant (εProcess) of Rogers RT/duroid 5870 is 2.33 with a tolerance of ±0.02. This value is measured in the Z direction at frequencies of 1 MHz (IPC-TM-650 2.5.5.3) and 10 GHz (IPC-TM 2.5.5.5). The design dielectric constant of RT/duroid 5870 is 2.33, measured in the Z direction. The measurements are performed within the frequency range of 8 GHz to 40 GHz using the Differential Phase Length Method. The dissipation factor of RT/duroid 5870 is 0.0005 at C24/23/50 and 0.0012 at 10 GHz. This value is measured in the Z direction at frequencies of 1 MHz (IPC-TM-650 2.5.5.3) and 10 GHz (IPC-TM 2.5.5.5). Rogers RT/duroid 5870 high frequency circuit laminate has a thermal coefficient of the dielectric constant of -115 ppm/℃. This measurement is conducted over a temperature range of -50℃ to 150℃ (IPC-TM-650 2.5.5.5). The volume resistivity of RT/duroid 5870 is 2 x 10^7 Mohm cm. This value is measured in the Z direction at C/96/35/90 (ASTM D 257). RT/duroid 5870 circuit material has a surface resistivity of 2 x 10^7 Mohm at C/96/35/90 (ASTM D 257). The specific heat of RT/duroid 5870 is 0.96 joules/gram/kelvin (0.23 cal/g/°C). The specific heat is calculated. In the X direction, the tensile modulus of RT/duroid 5870 is 1300 MPa (189 kpsi) at 23℃ and 490 MPa (71 kpsi) at 100℃. In the Y direction, it is 1280 MPa (185 kpsi) at 23℃ and 430 MPa (63 kpsi) at 100℃. The measurements are conducted according to ASTM D 638. The ultimate stress of RT/duroid 5870 is 50 MPa (7.3 kpsi) in the X direction and 42 MPa (6.1 kpsi) in the Y direction, tested at 23℃. The ultimate strain of RT/duroid 5870 is 9.8% in the X direction and 8.7% in the Y direction, tested at 23℃. In the X direction, the compressive modulus of RT/duroid 5870 is 1210 MPa (176 kpsi), 1360 MPa (198 kpsi) in the Y direction, and 803 MPa (120 kpsi) in the Z direction at 23℃. The measurements are conducted according to ASTM D 695. The ultimate stress of the compressive modulus is 30 MPa (4.4 kpsi) in the X direction, 37 MPa (5.3 kpsi) in the Y direction, and 54 MPa (7.8 kpsi) in the Z direction, tested at 23℃. The ultimate strain of the compressive modulus is 4% in the X direction, 3.3% in the Y direction, and 8.7% in the Z direction, tested at 23℃. The moisture absorption of RT/duroid 5870 is 0.02% when tested with a thickness of 0.62" (1.6 mm) according to D48/50 (ASTM D 570). The thermal conductivity of RT/duroid 5870 is 0.22 W/m/k in the Z direction at 80℃ (ASTM C 518). The coefficient of thermal expansion of RT/duroid 5870 is 22 ppm/℃ in the X direction, 28 ppm/℃ in the Y direction, and 173 ppm/℃ in the Z direction. The measurements areconducted from 0℃ to 100℃ (IPC-TM-650 2.4.41). The decomposition temperature (Td) of RT/duroid 5870 is 500℃. The Td value is determined using Thermogravimetric Analysis (TGA) and tested according to ASTM D 3850. The density of RT/duroid 5870 is 2.2 gm/cm3, measured in grams per cubic centimeter. The density measurement is performed according to ASTM D 792. The copper peel strength of RT/duroid 5870 is 27.2 Pounds per linear inch (4.8 N/mm). This measurement is taken on 1 oz (35mm) Electro-Deposited Copper (EDC) foil after a solder float process. The testing is conducted according to IPC-TM-650 2.4.8. RT/duroid 5870 laminate has a flammability rating of V-0. This rating indicates that the material has passed the UL 94 flammability test and is considered to be self-extinguishing. Rogers RT/duroid 5870 substrate is compatible with lead-free manufacturing processes. This means that the material can be used without issues in electronic assemblies that comply with lead-free regulations. RT/duroid 5870 Typical Value Property RT/duroid 5870 Direction Units Condition Test Method Dielectric Constant,εProcess 2.33 Z N/A C24/23/50 1 MHz IPC-TM-650 2.5.5.3 Dielectric Constant,εDesign 2.33 Z N/A 8GHz to 40 GHz Differential Phase Length Method Dissipation Factor,tanδ 0.0005 Z N/A C24/23/50 1 MHz IPC-TM-650 2.5.5.3 Thermal Coefficient of ε -115 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5 Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257 Surface Resistivity 2 x 107 Z Mohm C/96/35/90 ASTM D 257 Specific Heat 0.96(0.23) N/A j/g/k N/A Calculated Tensile Modulus Test at 23℃ Test at 100℃ N/A MPa(kpsi) A ASTM D 638 1300(189) 490(71) X 1280(185) 430(63) Y Ultimate Stress 50(7.3) 34(4.8) X 42(6.1) 34(4.8) Y Ultimate Strain 9.8 8.7 X % 9.8 8.6 Y Compressive Modulus 1210(176) 680(99） X MPa(kpsi) A ASTM D 695 1360(198) 860(125) Y 803(120) 520(76) Z Ultimate Stress 30(4.4) 23(3.4） X 37(5.3) 25(3.7) Y 54(7.8) 37(5.3) Z Ultimate Strain 4 4.3 X % 3.3 3.3 Y 8.7 8.5 Z Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570 Thermal Conductivity 0.22 Z W/m/k 80℃ ASTM C 518 Coefficient of Thermal Expansion 22 X ppm/℃ 0-100℃ IPC-TM-650 2.4.41 Td 500 N/A ℃ TGA N/A ASTM D 3850 Density 2.2 N/A gm/cm3 N/A ASTM D 792 Copper Peel 27.2(4.8) N/A Pli(N/mm) 1oz(35mm)EDC foil IPC-TM-650 2.4.8 Flammability V-0 N/A N/A N/A UL 94 Lead-free Process Compatible Yes N/A N/A N/A N/A A Substrate and Applications Displayed on the screen is a RT/duroid 5870 PCB substrate . In our daily lives, we come across a wide range of applications where this particular RT/duroid 5870 copper clad laminate is employed. These applications span various industries, including commercial airline broadband antennas, microstrip and stripline circuits, millimeter wave technologies, radar systems, and point-to-point digital radio antennas. The versatility of this PCB makes it an integral component in these diverse and important applications.
2.33±0.02 spec.
C24/23/50
10 GHz IPC-TM 2.5.5.5
0.0012
C24/23/50
10 GHz IPC-TM 2.5.5.5
(cal/g/c)
28
173
Y
Z
after solder float
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