Rogers RT/duroid 5880 High Frequency Laminates Introduction Greetings everyone, Today, we would like to introduce you to the reliable RT/duroid 5880 laminates. Rogers RT/duroid 5880 high-frequency circuit materials are specifically designed for precise stripline and microstrip circuit applications. Rogers RT/duroid 5880 consist of PTFE composites reinforced with glass microfibers, offering exceptional performance in high-frequency scenarios. One of the notable features of RT/duroid 5880 laminates is their low dielectric constant (Dk) and low dielectric loss, which makes them highly suitable for high-frequency and broadband applications. Their low Dk ensures minimal signal loss and excellent signal integrity. The presence of randomly oriented microfibers within the laminate contributes to exceptional dielectric constant uniformity. This means that the dielectric constant remains consistent from panel to panel and remains stable over a wide frequency range. Such uniformity is crucial for maintaining consistent electrical performance across the entire PCB. Additionally, the low dissipation factor of Rogers 5880 laminates extends their usability to frequencies in the Ku-band and beyond. This property allows these laminates to effectively handle high-frequency signals without significant energy loss or degradation. Data sheet Rogers RT/duroid 5880 Data Sheet Summary: Dielectric Constant: Process: 2.20 (2.20±0.02 spec.) at 1 MHz, C24/23/50 test method Design: 2.2 at 8 GHz to 40 GHz, determined using the Differential Phase Length Method Dissipation Factor (tanδ): Process: 0.0004 at 1 MHz, C24/23/50 test method Process: 0.0009 at 10 GHz, IPC-TM 2.5.5.5 test method Thermal Coefficient of ε: -125 ppm/°C in the temperature range of -50°C to 150°C, IPC-TM-650 2.5.5.5 test method Volume Resistivity: 2 x 10^7 Mohm cm, measured using ASTM D 257 Surface Resistivity: 3 x 10^7 Mohm, measured using ASTM D 257 Specific Heat: 0.96 j/g/°C (0.23 cal/g/°C), calculated value Tensile Modulus: Test at 23°C: 1070 MPa (156 kpsi) in the X direction, 860 MPa (125 kpsi) in the Y direction Test at 100°C: 450 MPa (65 kpsi) in the X direction, 380 MPa (55 kpsi) in the Y direction Ultimate Stress: Test at 23°C: 29 MPa (4.2 kpsi) in the X direction, 27 MPa (3.9 kpsi) in the Y direction Test at 100°C: 20 MPa (2.9 kpsi) in the X direction, 18 MPa (2.6 kpsi) in the Y direction Ultimate Strain: Test at 23°C: 6% in the X direction, 4.9% in the Y direction Test at 100°C: 7.2% in the X direction, 5.8% in the Y direction Compressive Modulus: Test at 23°C: 710 MPa (103 kpsi) in the X and Y directions, 940 MPa (136 kpsi) in the Z direction Test at 100°C: 500 MPa (73 kpsi) in the X and Y directions, 670 MPa (97 kpsi) in the Z direction Moisture Absorption: 0.02% for 0.62" (1.6mm) thickness, ASTM D 570 test method Thermal Conductivity: 0.2 W/m/°C at 80°C, ASTM C 518 test method Coefficient of Thermal Expansion: X direction: 31 ppm/°C in the range of 0-100°C Y direction: 48 ppm/°C in the range of 0-100°C Z direction: 237 ppm/°C in the range of 0-100°C Td (Thermal Decomposition Temperature): 500°C, determined using TGA (Thermogravimetric Analysis), ASTM D 3850 test method Density: 2.2 gm/cm3, measured using ASTM D 792 Copper Peel: 31.2 pli (5.5 N/mm) for 1oz (35mm) EDC foil after solder float, IPC-TM-650 2.4.8 test method Flammability: V-0 rating, UL 94 test method Lead-free Process Compatible: Yes RT/duroid 5880 Typical Value Property RT/duroid 5880 Direction Units Condition Test Method Dielectric Constant,εProcess 2.20 Z N/A C24/23/50 1 MHz IPC-TM-650 2.5.5.3 Dielectric Constant,εDesign 2.2 Z N/A 8GHz to 40 GHz Differential Phase Length Method Dissipation Factor,tanδ 0.0004 Z N/A C24/23/50 1 MHz IPC-TM-650 2.5.5.3 Thermal Coefficient of ε -125 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5 Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257 Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257 Specific Heat 0.96(0.23） N/A j/g/k N/A Calculated Tensile Modulus Test at 23℃ Test at 100℃ N/A MPa(kpsi) A ASTM D 638 1070(156) 450(65) X 860(125) 380(55) Y Ultimate Stress 29(4.2) 20(2.9) X 27(3.9） 18(2.6) Y Ultimate Strain 6 7.2 X % 4.9 5.8 Y Compressive Modulus 710(103) 500(73) X MPa(kpsi) A ASTM D 695 710(103) 500(73) Y 940(136) 670(97) Z Ultimate Stress 27(3.9) 22(3.2) X 29(5.3) 21(3.1) Y 52(7.5) 43(6.3) Z Ultimate Strain 8.5 8.4 X % 7.7 7.8 Y 12.5 17.6 Z Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570 Thermal Conductivity 0.2 Z W/m/k 80℃ ASTM C 518 Coefficient of Thermal Expansion 31 X ppm/℃ 0-100℃ IPC-TM-650 2.4.41 Td 500 N/A ℃ TGA N/A ASTM D 3850 Density 2.2 N/A gm/cm3 N/A ASTM D 792 Copper Peel 31.2(5.5) N/A Pli(N/mm) 1oz(35mm)EDC foil IPC-TM-650 2.4.8 Flammability V-0 N/A N/A N/A UL 94 Lead-free Process Compatible Yes N/A N/A N/A N/A Applications Rogers RT/duroid 5880 RF Circuit materials are widely used in various applications, including: Commercial Airline Broadband Antennas, Microstrip and Stripline Circuits, Millimeter Wave Applications, Military Radar Systems, Missile Guidance Systems, Point to Point Digital Radio Antennas etc. Conclusion Rogers RT/duroid 5880 Laminate is a low-loss, PTFE-based high-frequency material designed for precision microwave and millimeter-wave circuits. With consistent dielectric properties and stable performance into Ku-band and beyond, Rogers 5880 PCB material is ideal for aerospace, radar, and broadband antenna applications requiring reliable signal integrity.
2.20±0.02 spec.
C24/23/50
10 GHz IPC-TM 2.5.5.5
0.0009
C24/23/50
10 GHz IPC-TM 2.5.5.5
(cal/g/c)
48
237
Y
Z
after solder float
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