Rogers RT/duroid 6202 PCB Raw Materials Introduction In the realm of advanced RF and microwave design, success hinges on a circuit material that delivers unwavering electrical performance alongside robust mechanical integrity. Rogers RT/duroid 6202 high-frequency laminate meets this critical need, engineered to provide an optimal combination of low loss, a stable dielectric constant, and exceptional dimensional stability. This property set is indispensable for developing complex microwave structures—such as precision phased arrays and dense multilayer boards—that demand both electrical predictability and long-term mechanical reliability. Rogers RT/duroid 6202 PCB substrate distinguishes itself through characteristics specifically tailored for precision manufacturing and stable performance in challenging environments. Core Features and Design Benefits: Superior Dimensional Stability: The incorporation of a controlled woven glass reinforcement delivers outstanding dimensional stability (0.05 to 0.07 mils/inch). This minimizes etch shrinkage, enabling designers to achieve tight positional tolerances for fine-line circuits, often eliminating the need for double-etch processes and improving manufacturing yield. Stable Electrical Properties: With its low-loss characteristics, the material ensures excellent high-frequency performance. Its extremely low thermal coefficient of dielectric constant guarantees that electrical parameters remain consistent across temperature fluctuations, a critical requirement for airborne and ground-based systems exposed to varying operational environments. Matched In-Plane CTE to Copper: RT/duroid 6202 laminate features an in-plane coefficient of thermal expansion (CTE) closely matched to copper. This compatibility significantly reduces thermo-mechanical stress during thermal cycling, enhancing plated through-hole reliability and the long-term durability of complex multilayer constructions. Design and Processing Flexibility: Available in dielectric thicknesses from 0.005” to 0.060” (0.127 to 1.524 mm) and compatible with ½ oz. to 2 oz. electrodeposited or rolled copper foils, it offers designers significant flexibility. This supports advanced architectures like high-reliability complex multilayer circuits and high-performance power backplanes. Typical Properties A Piece of RT/duroid 6202 Laminate Ideal for Mission-Critical Applications The proven performance of RT/duroid 6202 makes it a preferred material for a wide range of high-reliability applications: Phased Array Antennas and Beamforming Networks: Its stable electrical and mechanical properties are vital for maintaining precise phase alignment between antenna elements. Ground-Based and Airborne Radar Systems: Performs reliably under conditions of vibration and thermal stress, ensuring consistent signal integrity. Global Positioning System (GPS) Antennas: Low loss factor contributes to enhanced signal sensitivity and accuracy. Commercial Airline Collision Avoidance Systems: Offers the dependable performance required for safety-critical avionics. High-Reliability Multilayer Circuits and Power Backplanes: Excellent dimensional stability and CTE matching support robust, high-density interconnects and stable power distribution networks. Summary Rogers RT/duroid 6202 is more than a laminate; it is a foundation for precision and reliability in high-frequency design. For engineers developing next-generation communication, radar, and aerospace systems where performance cannot be compromised, RT/duroid 6202 RF PCB materials provide the essential stability, predictability, and confidence needed to bring advanced concepts to life.
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