2. Core Electrical, Mechanical & Thermal Features

• Fixed Dielectric Constant (Dk): 2.55 ±0.04 tested at 10 GHz per IPC-650 2.5.5.3
• Low Dissipation Factor (Df): 0.0018 at 10 GHz per IPC-650 2.5.5.5.1
• Superior PIM performance below -160 dBc for antenna and communication TLX-8 PCB assemblies
• Standard three-axis CTE (25–260 °C): X-axis 21 ppm/°C, Y-axis 23 ppm/°C, Z-axis 215 ppm/°C
• High thermal decomposition temperature: 535 °C (2% weight loss), 553 °C (5% weight loss)
• Ultra-low moisture absorption rate of only 0.02% (IPC-650 2.6.2.1)
• Dielectric breakdown strength exceeding 45 Kv
• UL 94-V0 flame retardant safety rating
• Stable surface & volume resistivity under high temperature and humid aging conditions
• Excellent dimensional stability after baking and thermal cycling stress
• Radiation-resistant and low outgassing property certified for aerospace space applications
• Anti-creep mechanical performance to resist high vibration during space launch

 

3. Key Competitive Advantages of TLX-8 PCB

• Class-leading PIM performance lower than -160 dBc eliminates signal distortion for communication antennas built on TLX-8 PCB
• Balanced mechanical and thermal robustness enables long-term service under extreme high-temperature, vibration and marine environments
• Low, tightly controlled Dk 2.55 ensures consistent signal integrity across all mass-produced TLX-8 circuit boards
• Excellent dimensional stability minimizes dimensional offset during PCB fabrication and thermal cycling
• Minimal 0.02% moisture absorption prevents electrical parameter drift under humid working environments
• Ultra-low Df cuts microwave signal attenuation for high-performance radar and transmission modules
• UL 94-V0 flame retardant grade meets strict safety standards for aerospace, marine and vehicle RF equipment
• Perfectly optimized for low-layer-count microwave layouts, matching couplers, splitters, amplifiers and antenna hardware
• Pure Gold surface finish provides stable solderability, corrosion resistance and long-term reliability for TLX-8 SMT assembly
• Mandatory 100% full electrical testing before shipment guarantees complete circuit connectivity for all TLX-8 PCB orders

 

4.PCB Construction Details

Item	Specification
Base Material	Taconic TLX-8 fiberglass reinforced PTFE copper clad laminate, 30mil (0.762 mm) core
Layer Configuration	2-Layer Rigid PCB
Board Outline Dimension	76.4mm × 98.6mm, ±0.15mm tolerance, single-piece standard TLX-8 PCB size
Minimum Trace & Clearance	5 mil trace width / 7 mil spacing
Minimum Mechanical Hole Diameter	0.3mm
Via Structure	Through vias only, blind vias not implemented
Finished Overall Board Thickness	0.85mm
Outer Copper Foil Weight	1oz (1.4 mils)
Via Copper Plating Thickness	20 μm
Surface Treatment	Pure Gold
Top Silkscreen Marking	White ink printing
Bottom Silkscreen Marking	Unprinted
Top Solder Mask Coating	No solder mask
Bottom Solder Mask Coating	No solder mask
Pre-Delivery Quality Inspection	100% complete electrical continuity test for all TLX-8 boards

 

5. PCB Internal Stackup

Layer sequence of this 2-Layer rigid Taconic TLX-8 PCB from top to bottom surface:

• Top Copper Layer: 35 μm
• TLX-8 Dielectric Core: 0.762 mm (30mil)
• Bottom Copper Layer: 35 μm This 30mil thick dielectric core forms the full 0.85mm finished thickness TLX-8 Pure Gold RF PCB.

 

6. PCB Layout Component Statistics

• Total Mountable Electronic Components: 30
• Total Pad Quantity: 41
• Through Hole Pads: 25
• Top Side SMT Pads: 16
• Bottom Side SMT Pads: 0
• Conductive Through Vias: 27
• Independent Electrical Nets: 2 The dense pad and via layout supports multi-component passive RF modules on compact 0.85mm TLX-8 2-Layer PCB.

 

7. Fabrication Artwork & Quality Compliance Standards

• Required Production Gerber Format: Gerber RS-274-X
• Enforced Industry Quality Standard: IPC-Class-2 for all TLX-8 PCB batches
• Global Supply Coverage: Worldwide custom TLX-8 PCB manufacturing and shipping support

 

8. Typical Industrial Application Scenarios

• Military and civil radar systems fabricated on TLX-8 2-Layer 0.85mm Pure Gold PCB
• 4G/5G mobile communication base station antenna assemblies using Taconic TLX-8 substrate
• Precision microwave test equipment internal circuit boards
• Long-distance microwave signal transmission hardware
• RF passive components: couplers, power splitters, combiners, power amplifiers and various antennas
• Aerospace flight altimeter substrates, space launch vibration-resistant circuit modules
• Marine warship extreme-environment antenna PCBs
• Engine high-temperature RF control boards and space low-outgassing communication hardware

 

9. Copper Clad Laminate Knowledge: Taconic TLX-8

9.1 Full Material Profile of Taconic TLX-8

Taconic TLX-8 is a fiberglass-reinforced PTFE copper clad laminate widely recognized as a high-volume mainstream antenna substrate, delivering reliable performance across diversified RF and microwave applications. Its high versatility comes from a broad available Dk range of 2.45–2.65, multiple standard dielectric thickness options and customizable copper cladding types, making it the top pick for low-layer-count microwave PCB designs.

The built-in fiberglass matrix provides robust mechanical reinforcement to withstand extreme harsh working environments, including five core severe application scenarios: anti-creep performance for bolted circuit boards under intense space launch vibration; stable operation under high engine temperature; radiation resistance and low outgassing compliant with NASA space material standards; outstanding tolerance to marine extreme climate for naval antennas; and wide-temperature stability for flight altimeter substrates.

The adjustable dielectric constant range of Taconic TLX-8 laminate enables manufacturers to produce diversified RF passive devices such as couplers, splitters, combiners, power amplifiers and all types of communication antennas, covering the full spectrum of microwave circuit design demands.

 

9.2 Comprehensive Core Material Benefits

• Premium PIM performance lower than -160 dBc to eliminate passive intermodulation interference for antenna hardware
• Integrated excellent mechanical rigidity and thermal stability for long-term harsh-environment operation
• Low, highly consistent Dk value to guarantee repeatable RF signal performance batch to batch
• Superior dimensional stability to reduce production rejects during mass TLX-8 PCB fabrication
• Ultra-low moisture absorption to lock steady electrical performance under fluctuating humidity
• Tightly controlled Dk tolerance without obvious parameter deviation
• Industry-low dissipation factor to minimize high-frequency power loss
• UL 94-V0 flame retardant certification for safety-critical aerospace and military electronics
• Optimized material formula exclusively for low-layer-count microwave circuit layouts

 

9.3 Main Application Range for TLX-8 CCL

• All types of communication antennas
• Microwave mixers, power splitters, filters and signal combiners
• Full series of RF passive components
• Radar system signal processing circuit boards
• Mobile communication base station RF modules
• Laboratory precision microwave test equipment
• Aerospace, marine and vehicle extreme-environment RF hardware

 

10.TLX-8 Datasheet

Properties	Conditions	Typical Value	Unit	Test Method
Electrical Properties
Dielectric Constant	@ 10 GHz	2.55 ± 0.04	—	IPC-650 2.5.5.3
Dissipation Factor	@ 10 GHz	0.0018	—	IPC-650 2.5.5.5.1
Outgassing	% TML, 4 H 257 °F @ ≤ 5×10⁻⁵ Torr	0.03	%	ASTM E 595
Outgassing	% CVCM	0.00	%	ASTM E 595
Outgassing	% WVR	0.01	%	ASTM E 595
Surface Resistivity	Elevated Temp.	6.605×10⁸	Mohm	IPC-650 2.5.17.1 Sec. 5.2.1
Surface Resistivity	Humidity Cond.	3.550×10⁶	Mohm	IPC-650 2.5.17.1 Sec. 5.2.1
Volume Resistivity	Elevated Temp.	1.110×10¹⁰	Mohm/cm	IPC-650 2.5.17.1 Sec. 5.2.1
Volume Resistivity	Humidity Cond.	1.046×10¹⁰	Mohm/cm	IPC-650 2.5.17.1 Sec. 5.2.1
Dielectric Breakdown	—	> 45	Kv	IPC-650 2.5.6
Thermal Properties
Thermal Conductivity	—	0.19	W/m·K	ASTM F433 / ASTM 1530-06
CTE (25–260 °C)	X-axis	21	ppm/°C	IPC-650 2.4.41 / ASTM D 3386
CTE (25–260 °C)	Y-axis	23	ppm/°C	IPC-650 2.4.41 / ASTM D 3386
CTE (25–260 °C)	Z-axis	215	ppm/°C	IPC-650 2.4.41 / ASTM D 3386
Td (Decomposition Temperature)	2% Weight Loss	535	°C	IPC-650 2.4.24.6 (TGA)
Td (Decomposition Temperature)	5% Weight Loss	553	°C	IPC-650 2.4.24.6 (TGA)
Dimensional Stability
Dimensional Stability	MD, After Bake	0.06	mm/M (mils/in)	IPC-650 2.4.39 Sec. 5.4
Dimensional Stability	CD, After Bake	0.08	mm/M (mils/in)	IPC-650 2.4.39 Sec. 5.4
Dimensional Stability	MD, Thermal Stress	0.09	mm/M (mils/in)	IPC-650 2.4.39 Sec. 5.5
Dimensional Stability	CD, Thermal Stress	0.10	mm/M (mils/in)	IPC-650 2.4.39 Sec. 5.5
Mechanical Properties
Peel Strength	1 oz. ED, Thermal Stress	2.63 (15)	N/mm (lbs/in)	IPC-650 2.4.8 Sec. 5.2.2
Peel Strength	1 oz. RTF, Thermal Stress	2.98 (17)	N/mm² (kpsi)	IPC-650 2.4.8 Sec. 5.2.2
Peel Strength	½ oz. ED, Elevated Temp.	2.45 (14)	N/mm² (kpsi)	IPC-650 2.4.8.3
Peel Strength	½ oz. ED, Thermal Stress	1.93 (11)	N/mm² (kpsi)	IPC-650 2.4.8 Sec. 5.2.2
Peel Strength	1 oz. rolled, Thermal Stress	2.28 (13)	N/mm² (kpsi)	IPC-650 2.4.8 Sec. 5.2.2
Young’s Modulus	MD	6,757 (980)	N/mm² (psi)	ASTM D 902
Young’s Modulus	CD	8,274 (1,200)	N/mm² (psi)	ASTM D 902
Young’s Modulus	MD	11,238 (1,630)	N/mm² (psi)	ASTM D 3039
Chemical & Physical Properties
Moisture Absorption	—	0.02	%	IPC-650 2.6.2.1
Flammability Rating	—	V-0	—	UL-94

 

11.Summary

Taconic TLX-8 2-Layer High Frequency PCB combines outstanding PIM performance, robust mechanical reinforcement and ultra-stable dielectric properties for radar, mobile communication and aerospace microwave devices. Built on 30mil Taconic TLX-8 fiberglass PTFE core with Dk 2.55 and low Df 0.0018, TLX-8 rigid circuit board adopts Pure Gold surface finish and complies with IPC-Class-2 standards for global delivery. Featuring anti-vibration, radiation-resistant, low outgassing and UL 94-V0 flame retardant characteristics, 30mil TLX-8 PCB is the cost-effective high-volume substrate solution for antennas, splitters, couplers, radar systems and space/marine extreme-environment RF low-layer-count circuit projects.

 

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