2. Core Electrical & Thermal Features

• Controlled Dielectric Constant (Dk): 2.98±0.06 at 10GHz
• Low Dissipation Factor (Df): 0.0018 measured at 10GHz
• Three-axis CTE specification: X-axis 15 ppm/°C, Y-axis 16 ppm/°C, Z-axis 78 ppm/°C (-55°C ~ 288°C)
• Ultra-low TCDK: -78 ppm/°C within -55°C to 150°C operating range
• Moisture Absorption Rate: ≤0.05%
• UL 94-V0 flame retardant rating
• Fiberglass & nano-ceramic composite structure for balanced thermal and electrical stability
• Radiation-resistant and low vacuum outgassing material property
• Batch-consistent dielectric performance for repeatable RF signal integrity
• Standard ED copper foil matching for general non-PIM RF circuit layouts

 

3. Key Product Advantages

• Optimized nano-ceramic filling raises Dk value while retaining ultra-low dielectric loss for compact RF circuit design on F4BTM298 PCB
• Lower thermal expansion coefficient minimizes dimensional shift and soldering defects during mass production of 2-Layer F4BTM298 boards
• Improved heat resistance and insulation strength extend service life of radar and satellite communication modules built on F4BTM298 substrate
• Ultra-low moisture absorption avoids electrical parameter drift under variable humidity environments for F4BTM298 PCB assemblies
• UL 94-V0 flame retardant characteristic meets safety requirements for aerospace and base station RF equipment
• F4BTM298 adopts cost-effective ED copper foil, perfect for high-volume projects without strict PIM specifications
• Compatible with standard PTFE PCB fabrication processes, supporting fine trace and dense hole processing on all F4BTM298 2-Layer boards
• Mandatory 100% electrical testing before shipment guarantees full connectivity for every F4BTM298 PCB order

 

4.PCB Construction Details

Item	Specification
Base Material	Wangling F4BTM298, 10mil (0.254 mm) ceramic filled PTFE copper clad laminate
Layer Configuration	2-Layer Rigid PCB
Board Outline Size	109mm × 54.5mm, ±0.15mm tolerance, single piece standard F4BTM298 PCB dimension
Minimum Trace / Space	6 mils / 9 mils
Minimum Hole Size	0.4mm
Via Type	Through vias only, blind vias not included
Finished Board Thickness	0.3mm
Outer Copper Weight	1oz (1.4 mils) ED copper foil
Via Plating Thickness	20 μm copper plating
Surface Finish	Immersion Gold, standard surface treatment for F4BTM298 PCB
Top Silkscreen	White ink printing
Bottom Silkscreen	None
Top Solder Mask	Black solder mask coating
Bottom Solder Mask	No solder mask applied
Pre-Delivery Inspection	100% full electrical continuity test for all F4BTM298 circuit boards

 

5. PCB Stackup

2-Layer rigid F4BTM298 PCB layer sequence from top to bottom surface:

• Copper Layer 1: 35 μm ED copper foil
• F4BTM298 Dielectric Core: 0.254 mm (10mil)
• Copper Layer 2: 35 μm ED copper foil This 10mil thin core forms the complete 0.3mm finished thickness F4BTM298 RF PCB.

 

6. PCB Layout Statistics

• Total Mounted Components: 26
• Total Pads: 87
• Through Hole Pads: 49
• Top SMT Pads: 38
• Bottom SMT Pads: 0
• Conductive Through Vias: 31
• Independent Electrical Nets: 2 The rich pad and via layout fits multi-component RF modules on compact 0.3mm F4BTM298 2-Layer PCB.

 

7. Fabrication Artwork & Quality Standard

• Required Production File Format: Gerber RS-274-X
• Enforced Quality Compliance: IPC-Class-2, implemented for all F4BTM298 PCB batches
• Global Supply Support: Worldwide prototype & mass production for Wangling F4BTM298 PCB

 

8. Typical Application Scenarios

• Microwave, RF and airborne radar systems manufactured on F4BTM298 2-Layer PCB
• RF phase shifter circuit boards built with F4BTM298 ceramic filled laminate
• Power dividers, couplers and RF combiners using F4BTM298 substrate
• Antenna feed network hardware based on 0.3mm F4BTM298 Immersion Gold PCB
• Phase-sensitive antennas and phased array antenna RF boards
• Satellite communication transceiver modules with F4BTM298 dielectric core
• Cellular base station antenna circuit assemblies

 

9. Copper Clad Laminate Knowledge: F4BTM298

9.1 F4BTM Series Material Overview

Wangling F4BTM298 belongs to the fiberglass fabric & nano-ceramic filled PTFE copper clad laminate lineup, alongside its variant F4BTME298. F4BTM298 substrate is manufactured by mixing woven glass fiber, special nano-ceramic fillers and PTFE resin, then processed via precise high-pressure lamination. Upgraded from classic F4BM base material, F4BTM298 adds high-Dk low-loss nano-ceramics to lift dielectric constant, thermal resistance and thermal conductivity, while retaining inherent low dissipation factor of PTFE dielectric.

F4BTM298 and F4BTME298 share identical 10mil dielectric core, the only difference lies in copper foil matching: F4BTM298 is equipped with standard ED electrodeposited copper foil, targeting general RF projects without strict Passive Intermodulation (PIM) requirements. By contrast, F4BTME298 uses RTF reverse-treated copper foil to deliver superior PIM performance, finer trace control and lower conductor loss for high-precision antenna hardware.

The full F4BTM series supports customizable Dk ranging from 2.98 to 3.5, with abundant thickness options and flexible dimensions to cut overall project cost. All variants feature radiation resistance and low outgassing, suitable for aerospace and long-term outdoor RF equipment. Mass-volume mature production makes F4BTM298 a cost-effective alternative to imported high-frequency laminates.

 

 

9.2 Core CCL Performance Features

• Tunable Dk range from 2.98 to 3.5 to match diverse RF circuit design demands
• Nano-ceramic reinforced formula enhances overall thermal and electrical performance of F4BTM298
• F4BTME variant delivers outstanding PIM performance for high-end antenna projects
• Multiple standardized dielectric thickness selections for flexible stackup design
• Customizable board dimensions to optimize manufacturing cost of F4BTM298 PCB
• Mature mass production process ensures stable pricing and short lead time
• Radiation resistant & low vacuum outgassing for space and airborne radar applications

9.3 Application Range for F4BTM298 Laminate

• Microwave, RF and multi-type radar system circuit boards
• RF phase shifter modules fabricated on F4BTM298 substrate
• Power dividers, couplers and RF signal combiners
• Antenna feed network PCBs for satellite and base station hardware
• Phase-sensitive antennas and phased array antenna assemblies
• Satellite communication positioning and signal transmission equipment
• Cellular base station antenna RF circuit boards

 

10.F4BTM/F4BTME Series Full Specification Table

Item	Specification Details
Optional Copper Foil & Thickness	1. F4BTM (ED Copper Foil): 0.5OZ (0.018mm), 1OZ (0.035mm), 1.5OZ (0.05mm), 2OZ (0.07mm)2. F4BTME (Reverse RTF Copper Foil): 0.5OZ (0.018mm), 1OZ (0.035mm)
Available Panel Dimensions	Conventional sizes: 460×610mm, 600×500mm, 914×1220mmNote: 914×1220mm size is unavailable for substrate thickness ≥ 4.0mm
Standard Thickness & Tolerance (0.254~1.524mm)	0.254mm (Min): ±0.02mm｜0.508mm: ±0.04mm｜0.762mm/0.8mm/1.0mm/1.016mm: ±0.05mm｜1.27mm/1.524mm: ±0.06mm
Standard Thickness & Tolerance (2.0~12.0mm)	2.0mm: ±0.075mm｜3.0mm: ±0.09mm｜4.0mm/5.0mm: ±0.1mm｜6.0mm: ±0.12mm｜8.0mm: ±0.15mm｜10.0mm: ±0.18mm｜12.0mm: ±0.2mm
Thickness Instruction	All standard thicknesses can be produced as total copper-clad thickness or dielectric core thickness. Please specify the thickness type when placing orders. Non-standard thicknesses are customizable upon request.
Metal Base Model	F4BTM(E)-2-A***－CU (Copper Base), F4BTM(E)-2-A***－AL (Aluminum Base)
Base Metal Parameter	1. Copper Base (Red Brass/Brass): Specific Gravity: 8.9, Thermal Conductivity: 3802. Aluminum Base: Specific Gravity: 2.7, Thermal Conductivity: 180
Metal Base Available Thickness	0.48mm, 0.98mm, 1.48mm, 1.98mm, 2.98mm, 3.98mm (Custom thickness available)
Metal Base Thickness Tolerance	+0.02mm / -0.05mm
Metal Base Available Dimensions	460×610mm, 460×305mm (Custom sizes available)
Product Feature	One side of the dielectric layer is covered with copper foil, and the other side is bonded with aluminum/copper base for shielding and heat dissipation.
Model Example	1. F4BTM298－AL: F4BTM298 substrate with aluminum base2. F4BTME298－CU: F4BTME298 substrate with copper base

 

11.Summary

F4BTM298 2-Layer High Frequency PCB delivers balanced low-loss electrical performance and reliable thermal stability for microwave, radar and satellite communication RF devices. Constructed on 10mil Wangling F4BTM298 nano-ceramic glass fiber PTFE core with Dk 2.98 and low Df 0.0018, this 0.3mm thin circuit board adopts Immersion Gold surface finish and meets IPC-Class-2 standards for worldwide delivery. Featuring low CTE, UL 94-V0 flame retardant grade and cost-effective ED copper foil configuration,  F4BTM298 RF circuit board is an ideal base board for phased array antennas, phase shifters, power dividers, base station antennas and satellite communication feed network projects without strict PIM standards.

 

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