2. Core Electrical & Thermal Features

• Fixed Dielectric Constant (Dk): 3.48 tested at 10 GHz / 23°C
• Low Dissipation Factor (Df): 0.0039 at 10GHz
• Superior TCDK: 52 ppm/°C for stable dielectric performance across temperature shifts
• High Thermal Conductivity: 0.7 W/MK for efficient heat dissipation on high-power WL-CT350 PCB
• Low Moisture Absorption Rate: 0.05%
• Copper-matched three-axis CTE: X-axis 11 ppm/°C, Y-axis 14 ppm/°C, Z-axis 34 ppm/°C
• Ultra-high Tg above 280°C to retain dimensional stability during multiple reflow cycles
• Dual copper foil options: standard ED copper foil or RTF copper foil for low-PIM antenna projects
• Radiation-resistant and low vacuum outgassing to meet aerospace material standards
• Compatible with aluminum base bonding for metal-backed high-power WL-CT350 circuits

 

3. Key Product Advantages

• FR4-like processing flow greatly lowers fabrication difficulty compared with PTFE laminates for all WL-CT350 PCB orders
• Hydrocarbon-ceramic composite delivers ultra-low loss and stable dielectric parameters for high-frequency signal transmission
• Copper-matched X/Y CTE reduces barrel cracking and delamination risks of plated through holes on 2-Layer WL-CT350 boards
• High Tg above 280°C maintains stable dimensions under long-term high-temperature working environments
• 0.7 W/MK thermal conductivity improves heat dissipation capacity for power amplifiers built on WL-CT350 substrate
• Minimal moisture absorption avoids electrical parameter drift under humid outdoor and vehicle operating conditions
• RTF copper foil variant cuts conductor loss and delivers outstanding PIM performance for communication antenna WL-CT350 PCB
• Mature mass production system offers cost competitiveness for large-volume base station and automotive radar projects
• Mandatory 100% electrical continuity test before shipment guarantees complete circuit connectivity for every WL-CT350 board

 

4.PCB Construction Details

Item	Specification
Base Material	Wangling WL-CT350 organic polymer ceramic fiberglass CCL, 4mil (0.102 mm) core
Layer Configuration	2-Layer Rigid PCB
Board Outline Dimension	56.8mm × 78.09mm, ±0.15mm tolerance, single piece standard WL-CT350 PCB size
Minimum Trace / Space	6 mils / 7 mils
Minimum Hole Size	0.3mm
Via Design	Through vias only, blind vias excluded
Finished Board Thickness	0.2mm
Outer Copper Weight	1oz (1.4 mils) ED copper foil
Via Plating Thickness	20 μm copper plating
Surface Finish	Immersion Gold
Top Silkscreen	Black ink printing
Bottom Silkscreen	None
Top Solder Mask	No solder mask coating
Bottom Solder Mask	No solder mask coating
Pre-Delivery Inspection	100% full electrical test for all WL-CT350 circuit boards

 

5. PCB Stackup

2-Layer rigid WL-CT350 PCB layer order from top to bottom:

• Top Copper Layer: 35 μm
• WL-CT350 Dielectric Core: 0.102 mm (4mil)
• Bottom Copper Layer: 35 μm This ultra-thin 4mil core forms the complete 0.2mm finished WL-CT350 Immersion Gold RF PCB.

 

6. PCB Layout Statistics

• Total Assembled Components: 19
• Total Pad Count: 32
• Through Hole Pads: 18
• Top SMT Pads: 14
• Bottom SMT Pads: 0
• Conductive Through Vias: 11
• Independent Electrical Nets: 2 The compact layout matches small-size compact RF sensor modules on thin 0.2mm WL-CT350 2-Layer PCB.

 

7. Fabrication File & Quality Standards

• Required Artwork Format: Gerber RS-274-X
• Accepted Quality Standard: IPC-Class-2 for all WL-CT350 PCB batches
• Global Supply Support: Worldwide custom WL-CT350 PCB production & shipping

 

8. Typical Application Scenarios

• Macro base station antennas and satellite communication antennas fabricated on WL-CT350 2-Layer PCB
• 77GHz automotive radar, vehicle sensors and navigation RF circuit boards
• High-power RF power amplifier modules built with WL-CT350 substrate
• Satellite high-frequency signal receiving heads
• General RF signal devices and microwave filters
• WIMAX antennas and distributed indoor antenna assemblies
• Aerospace onboard equipment, airborne radar and phased array beamforming networks

 

9. Copper Clad Laminate Knowledge: WL-CT350

9.1 WL-CT Series Material Overview

Wangling WL-CT350 belongs to WL-CT series organic polymer ceramic fiberglass copper clad laminates, a thermosetting hydrocarbon resin high-frequency substrate filled with composite ceramics and woven glass fabric. Different from PTFE thermoplastic materials, WL-CT350 supports FR4-equivalent PCB processing techniques, bringing higher processing efficiency, better circuit stability and consistent fine-line precision, and can fully replace imported hydrocarbon high-frequency laminates.

The composite blend of hydrocarbon resin and special ceramics endows WL-CT350 with ultra-low dielectric loss, excellent heat resistance and stable temperature-dependent dielectric performance. The whole WL-CT product line features low TCDK, low overall CTE and ultra-high Tg exceeding 280°C. Multiple fixed Dk grades are available: 3.00, 3.30, 3.38, 3.48, 4.10, 6.15, among which WL-CT350 corresponds to Dk 3.48 specification.

Customers can select ED copper foil for cost-sensitive projects or RTF reverse-treated copper foil for low-PIM antenna designs; RTF foil comes with adhesive backing adding 0.018mm thickness and superior copper bonding strength. The laminate can also be bonded with aluminum base plates to produce aluminum-backed high-power RF boards.

WL-CT series substrates fit multi-layer, high-layer-count and backplane PCB production, and deliver outstanding processability when manufacturing dense hole arrays and ultra-fine traces via standard FR4 fabrication workflows. All variants feature radiation resistance and low vacuum outgassing, meeting aerospace vacuum volatile material test requirements.

 

 

9.2 Core CCL Performance Advantages

• Tight Dk tolerance and ultra-low dissipation factor for stable high-frequency signal transmission
• Thermosetting hydrocarbon-ceramic system offers easier PCB processing and stronger heat resistance vs PTFE
• Minimal dielectric constant fluctuation across wide temperature ranges
• X/Y CTE matched to copper foil, low Z-axis expansion to protect PTH reliability under thermal cycling
• Tg higher than 280°C to maintain stable board dimension under repeated high-temperature soldering
• Higher thermal conductivity than conventional thermoplastic RF substrates, ideal for high-power amplifier hardware
• Mature mass production realizes stable pricing and fast lead time for volume WL-CT350 PCB orders
• Excellent radiation resistance and low outgassing for space and aerospace electronic equipment

 

9.3 Main Application Fields for WL-CT350 CCL

• Aerospace, aircraft cabin and spaceborne communication hardware
• Microwave passive components, all types of communication antennas and phase-sensitive antenna arrays
• Multi-type radar platforms including early warning radar and airborne radar circuit boards
• Phased array antennas and RF beamforming network modules
• Satellite communication and positioning navigation electronic assemblies
• High-power RF amplifier circuit boards

 

10.Datasheet

Product Characteristics	Test Condition	Unit	WL-CT350
Typical Dielectric Constant	10GHz	/	3.48
Design Dielectric Constant	10GHz	/	3.66
Dielectric Constant Tolerance	/	/	±0.05
Typical Dissipation Factor	2GHz	/	0.0030
Typical Dissipation Factor	10GHz	/	0.0039
Typical Dissipation Factor	20GHz	/	0.0048
Temperature Coefficient of Dielectric Constant	-55℃ ~ 150℃	PPM/℃	52
Peel Strength	1 OZ ED copper foil	N/mm	0.85
Peel Strength	1 OZ RTF copper foil	N/mm	0.72
Volume Resistivity	Ambient Condition	MΩ·cm	1×10⁹
Surface Resistance	Ambient Condition	MΩ	4×10⁹
Dielectric Strength (Z-axis)	5KW, 500V/s	KV/mm	31
Breakdown Voltage (XY-plane)	5KW, 500V/s	KV	30
CTE (X, Y-axis)	-55℃ ~ 288℃	ppm/℃	11, 14
CTE (Z-axis)	-55℃ ~ 288℃	ppm/℃	34
Thermal Stress	288℃, 10s, 3 cycles	/	No delamination
Water Absorption	23.5±2℃, 24h	%	0.05
Density	Ambient Temperature	g/cm³	1.90
Continuous Operating Temperature	Temperature & Humidity Chamber	℃	-55～+260
Thermal Conductivity	Z-axis	W/(M·K)	0.70
PIM Value	Matched with RTF copper foil	dBc	≤-157
Flame Retardancy	UL-94	Rating	V-0
TG	Standard	℃	>280
TD (Decomposition Temperature)	Initial Value	℃	386
Halogen Content	/	/	Halogen-containing
Material Composition	/	/	Hydrocarbon resin + ceramic + fiberglass cloth

 

11.Summary

Wangling 2-Layer WL-CT350 High Frequency PCB adopts FR4-processable thermosetting hydrocarbon ceramic dielectric to deliver balanced low-loss, high heat dissipation and stable dimensional performance for automotive radar, base station antennas and satellite RF equipment. Built on ultra-thin 4mil Wangling WL-CT350 core with Dk 3.48 and thermal conductivity of 0.7 W/MK, this 0.2mm slim circuit board uses Immersion Gold surface finish and complies with IPC-Class-2 standards for global supply. With copper-matched low CTE, high Tg above 280°C and simple fabrication process compared with PTFE materials, this WL-CT350 PCB is a cost-effective substrate solution for mass-produced vehicle radar, communication antennas and high-power RF filter & power amplifier projects.

 

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