2. Features of  Taconic RF-30A PCB

1. Dielectric Constant (Dk): 3.0 at 10GHz, ensuring stable signal transmission across broadband frequencies
2. Dissipation Factor (Df): 0.003 at 10GHz, minimizing signal loss in high-frequency applications
3. Thermal Resistance: T260 > 90 minutes, T288 > 30 minutes, supporting lead-free assembly and high-temperature operation
4. Peel Strength (Minimum): 9 lbs/inch for standard ED Copper, enabling reliable rework and repeated reflow processes
5. Coefficient of Thermal Expansion (CTE): X-axis 9-11 ppm/℃, Y-axis 11-13 ppm/℃ (matched to copper), Z-axis 38 ppm/℃ for improved PTH reliability
6. Glass Transition Temperature (Tg): > 180℃, maintaining dimensional stability at elevated temperatures
7. Ultra-Low Moisture Absorption: 0.08%, reducing phase shift in varying humidity environments
8. Flammability Rating: UL 94-V0, ensuring compliance with safety standards
9. Excellent CAF Resistance and Chemical Resistance, enhancing long-term reliability
10. High Thermal Conductivity, facilitating efficient heat dissipation in high-power RF components

3. Benefits of  Taconic RF-30A PCB

1. Superior PIM Performance: Exhibits excellent PIM values (typically lower than -160 dBc), meeting strict requirements for multi-frequency communication systems
2. Enhanced PTH Quality: Low Z-axis CTE improves plated through-hole reliability and simplifies fabrication, even for complex designs
3. Stable Mechanical & Electrical Properties: Low CTE, high rigidity, and dimensional stability reduce environmental and mechanical impacts on RF components
4. Broadband Compatibility: Stable electrical performance across a wide frequency range, ideal for high-speed RF and microwave applications
5. High-Temperature Stability: Maintains performance in harsh high-temperature environments, suitable for automotive and aerospace applications
6. Low Moisture Sensitivity: Ultra-low moisture absorption minimizes phase shift and ensures consistent performance in varying humidity conditions
7. Cost-Effective: Excellent price-performance ratio, optimized for high-volume commercial production, reducing overall manufacturing costs
8. Easy Fabrication: Compatible with standard PCB manufacturing processes, supporting efficient mass production

4. PCB Construction Details

Construction Item	Specification
Base Material	RF-30A
Layer Count	2 Layers
Board Dimensions	85.6mm x 99.8mm = 1PCS
Minimum Trace/Space	4/6 mils
Minimum Hole Size	0.25mm
Blind Vias	No
Finished Board Thickness	0.6mm
Finished Cu Weight (Outer Layers)	1 oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	Electroless Nickel Immersion Gold (ENIG)
Top Silkscreen	White
Bottom Silkscreen	No
Top Solder Mask	Green
Bottom Solder Mask	No
Pre-Shipment Electrical Test	100% Electrical Test Used

5. PCB Stackup

2-layer rigid PCB with the following layer structure (from top to bottom):

1. Copper_layer_1 - 35 μm
2. RF-30A - 20mil (0.508mm)
3. Copper_layer_2 - 35 μm

6. PCB Statistics

1. Components: 54
2. Total Pads: 43
3. Thru Hole Pads: 19
4. Top SMT Pads: 24
5. Bottom SMT Pads: 0
6. Vias: 36
7. Nets: 2

7. Supplied Artwork Format

Gerber RS-274-X, the industry-standard format for PCB fabrication, ensuring compatibility with most manufacturing equipment and processes.

8. Accepted Quality Standard

Complies with IPC-Class-2 standards, guaranteeing consistent quality, reliability, and performance for commercial, industrial, and high-tech applications.

9. Global Availability

Available worldwide, supported by reliable supply chains to meet global customers’ high-volume production needs and ensure timely delivery.

10. Typical Applications

1. RF/Microwave Communication Devices
2. 5G/6G Base Stations & Antennas
3. Radar Systems
4. Satellite Communication Equipment
5. RF Modules & Transceivers
6. Aerospace & Defense Electronics
7. High-Frequency Test Instruments
8. Automotive RF Components (V2X, Radar)

11.  Taconic RF-30A CCL (Copper Clad Laminate) Introduction

 Taconic RF-30A is an organic-ceramic copper clad laminate (CCL) from  Taconic’s RF substrate product line, featuring woven glass reinforcement. Developed with  Taconic’s expertise in ceramic filler and PTFE coating technology, it is optimized for low-cost, high-volume commercial microwave and RF applications, offering an excellent balance of performance and affordability.

11.1 Core Properties of  Taconic RF-30A CCL

1. Organic-ceramic composite material with woven glass reinforcement, ensuring structural rigidity and stability
2. Low dielectric loss (Df = 0.003 at 10GHz) and stable dielectric constant (Dk = 3.0 at 10GHz), ideal for high-frequency signal transmission
3. Copper-matched CTE (X: 9-11 ppm/℃, Y: 11-13 ppm/℃) and low Z-axis CTE (38 ppm/℃), improving dimensional stability and PTH reliability
4. High Tg (> 180℃) and excellent thermal resistance (T260 > 90 min), supporting lead-free assembly and high-temperature operation
5. Ultra-low moisture absorption (0.08%) and UL 94-V0 flammability rating, enhancing environmental and safety performance

11.2 Key Advantages of  Taconic RF-30A CCL

1. Excellent PIM Performance: Achieves PIM values lower than -160 dBc (measured at 800/1800 MHz, 20W per channel) and exceeds -153 dBc in standard telecom test conditions
2. Superior Peel Strength: Reliable peel strength for 1/2 oz and 1 oz RT copper, supporting rework and repeated reflow processes
3. Easy Fabrication: Compatible with standard PCB manufacturing processes, simplifying production and reducing costs
4. Stable Performance: Minimal phase shift across temperature/humidity variations, and stable PIM performance less affected by design or processing factors
5. Cost-Effective: Optimized for high-volume production, providing a cost-saving alternative to premium RF substrates without compromising performance

11.3 PIMD Performance Highlights

1. Passive Intermodulation Distortion (PIMD) is minimized, making it suitable for multi-frequency communication systems
2. Low-profile copper foil compatibility enhances PIMD levels and reduces insertion loss across broadband frequencies
3. Stable PIM performance is less affected by circuit design, soldering, or processing factors, ensuring consistent reliability

12.Taconic RF-30A DataSheet

Properties	Conditions	Typical Value	Unit	Test Method
Dielectric Constant	@ 1.9 GHz	2.97 ± 0.05	–	IPC-TM 650 2.5.5.5.1 mod
Dissipation Factor	@ 1.9 GHz	0.0013	–	IPC-TM 650 2.5.5.5.1 mod
	@ 10 GHz	0.0020	–	IPC-TM 650 2.5.5.5.1 mod
Volume Resistivity	–	3.0 × 10⁹	MΩ·cm	IPC-650 2.5.17.1
Surface Resistivity	–	2.0 × 10⁸	MΩ	IPC-650 2.5.17.1
Thermal Conductivity	–	0.42	W/(m·K)	IPC-650 2.4.50
CTE (50–150°C)	X	8	ppm/°C	IPC-650 2.4.41
	Y	11	ppm/°C
	Z	60	ppm/°C
Specific Heat	–	0.95	J/gK	IPC-650 2.4.50
Density	Specific Gravity	2.16	g/cm³	IPC-TM-650 2.3.5
Flexural Strength	MD	126.5 (18,000)	N/mm² (psi)	IPC-650 2.4.18.3
	CD	119.5 (17,000)	N/mm² (psi)	IPC-650 2.4.19
Tensile Strength	MD	133.6 (19,000)	N/mm² (psi)	IPC-TM-650 2.4.18.3
	CD	105.5 (15,000)	N/mm² (psi)	IPC-650 2.4.19
Dimensional Stability (After Etch)	MD	0.049 / 0.025	% (30 mil) / % (60 mil)	IPC-650 2.4.39
	CD	0.041 / 0.026	% (30 mil) / % (60 mil)
Dimensional Stability (After Stress)	MD	0.049 / 0.019	% (30 mil) / % (60 mil)	IPC-650 2.4.39
	CD	0.031 / 0.011	% (30 mil) / % (60 mil)
Flammability Rating	–	V-0	–	Internal Test

13. Summary

 Taconic RF-30A 0.6mm thick High Frequency PCB is a cost-effective, high-reliability solution tailored for commercial RF, microwave, and wireless communication applications. This 2-layer PCB leverages  Taconic’s RF-30A CCL, delivering low dielectric loss, excellent PIM performance, and stable mechanical/electrical properties. With ENIG surface finish, compliance with IPC-Class-2 standards, and compatibility with lead-free assembly, it is optimized for high-volume production. Widely applicable to 5G/6G base stations, radar systems, satellite communication, aerospace, and automotive RF components, it provides consistent performance and value for global customers.