2. Rogers RT/duroid 6002 PCB Features

1. Dielectric Constant (Dk): 2.94 +/- 0.04, ensuring stable signal transmission in complex microwave structures
2. Thermal Coefficient of Dk: 12 ppm/℃, providing excellent electrical stability across temperature ranges
3. Dissipation Factor (Df): 0.0012 at 10GHz, enabling ultra-low loss and superior high-frequency performance
4. Decomposition Temperature (Td): 500℃ (TGA), ensuring high-temperature stability
5. Thermal Conductivity: 0.6 W/m·K, facilitating efficient heat dissipation
6. Z-axis Coefficient of Thermal Expansion (CTE): 24 ppm/℃, ensuring excellent PTH reliability
7. Moisture Absorption: 0.02%, minimizing environmental impact on performance
8. Flammability Rating: UL 94-V0, complying with safety standards
9. Excellent Dimensional Stability: 0.2 to 0.5 mils/inch, supporting tight positional tolerances
10. In-plane CTE Matched to Copper, reducing stress on solder joints and enhancing surface mount reliability

3. Rogers RT/duroid 6002 PCB Benefits

1. Ultra-Low Loss: Delivers excellent high-frequency performance, ideal for microwave and RF applications
2. Tight Thickness Control: Ensures consistent performance and compatibility with precision designs
3. Temperature Stability: In-plane CTE matched to copper, making it ideal for temperature-sensitive applications
4. Low Out-Gassing: Suitable for space and aerospace applications requiring high reliability
5. Superior Dimensional Stability: Eliminates the need for double etching to achieve tight positional tolerances
6. Excellent Mechanical & Electrical Properties: Enables reliable multi-layer board constructions
7. High PTH Reliability: Low Z-axis CTE ensures plated through-holes withstand over 5000 temperature cycles (-55℃ to 125℃) without failure
8. Versatile Cladding Options: Compatible with various copper types and thicknesses, as well as aluminum, brass, or resistive foils

4. PCB Construction Details

Construction Item	Specification
Base Material	RT/duroid 6002
Layer Count	2 Layers
Board Dimensions	156mm x 87.9mm = 1PCS
Minimum Trace/Space	6/7 mils
Minimum Hole Size	0.3mm
Blind Vias	No
Finished Board Thickness	0.8mm
Finished Cu Weight (Outer Layers)	1 oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	Immersion Silver
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	No
Bottom Solder Mask	No
Pre-Shipment Electrical Test	100% Electrical Test Used

5. PCB Stackup

2-layer rigid PCB, with the following layer structure (from top to bottom):

1. Copper_layer_1 - 35 μm
2. Rogers RT/duroid 6002 Substrate - 30mil (0.762mm)
3. Copper_layer_2 - 35 μm

6. PCB Statistics

1. Components: 94
2. Total Pads: 241
3. Thru Hole Pads: 196
4. Top SMT Pads: 45
5. Bottom SMT Pads: 0
6. Vias: 126
7. Nets: 2

7. Artwork Format

Gerber RS-274-X, the industry-standard format for PCB fabrication, ensuring compatibility with most manufacturing equipment and processes.

8. Quality Standard

Complies with IPC-Class-2 standards, guaranteeing consistent quality, reliability, and performance for commercial, industrial, and high-tech applications.

9. Global Availability

Available worldwide, supported by reliable supply chains to meet global customers’ production needs and ensure timely delivery.

10. Typical Applications

1. Phased Array Antennas
2. Ground Based and Airborne Radar Systems
3. Global Positioning System (GPS) Antennas
4. Power Backplanes
5. Commercial Airline Collision Avoidance Systems
6. Beam Forming Networks
7. Aerospace Microwave Circuits for Hostile Environments

11. Rogers RT/duroid 6002 CCL Introduction

Rogers RT/duroid® 6002 is a high-frequency ceramic-filled PTFE laminate, the first low-loss, low-dielectric-constant material to offer superior electrical and mechanical properties essential for designing complex, mechanically reliable, and electrically stable microwave structures. It maintains an extremely low thermal coefficient of dielectric constant from -55℃ to +150℃, providing the electrical stability required for filters, oscillators, and delay lines in demanding applications.

11.1 CCL Core Properties

1. Ceramic-filled PTFE composition, delivering low dielectric constant (2.94 +/- 0.04) and ultra-low loss (Df = 0.0012 at 10GHz)
2. Extremely low thermal coefficient of Dk (12 ppm/℃) from -55℃ to +150℃, ensuring electrical stability across temperature ranges
3. Low Z-axis CTE (24 ppm/℃) and in-plane CTE matched to copper, enhancing PTH reliability and dimensional stability
4. Excellent dimensional stability (0.2 to 0.5 mils/inch), eliminating the need for double etching
5. Low tensile modulus (X,Y), reducing stress on solder joints and improving surface mount reliability
6. Moisture absorption of 0.02% and low out-gassing, suitable for space and harsh environment applications
7. UL 94-V0 flammability rating, complying with safety standards

11.2 CCL Key Advantages

1. Ultra-Low Loss: Enables excellent high-frequency performance, critical for microwave and RF applications
2. Superior PTH Reliability: Withstands over 5000 temperature cycles (-55℃ to 125℃) without via failure
3. Versatile Cladding: Available with ½ oz. to 2 oz./ft² electrodeposited/rolled copper, reverse treated copper, as well as aluminum, brass, or resistive foils
4. Broad Dielectric Thickness Range: 0.005” to 0.125” (0.13 to 3.18mm), adapting to diverse design needs
5. Mechanical Reliability: Excellent mechanical and electrical properties, supporting complex multi-layer board constructions
6. Temperature Resilience: Stable performance in extreme temperature ranges, ideal for aerospace and defense applications

11.3 CCL Application Suitability

1. Ideal for flat and non-planar structures, including antennas and complex multi-layer circuits with inter-layer connections
2. Suitable for aerospace microwave circuits in hostile environments, thanks to low out-gassing and temperature stability
3. Perfect for applications requiring tight positional tolerances, such as filters, oscillators, and delay lines
4. Well-suited for radar systems, GPS antennas, and beam forming networks due to low loss and dimensional stability

12. DataSheet

Property	Typical Value	Direction	Units	Conditions	Test Method
Dielectric Constant (εr, Process)	2.94 ± 0.04	Z	–	10 GHz / 23°C	IPC-TM-650 2.5.5.5
Dielectric Constant (εr, Design)	2.94	–	–	8 GHz – 40 GHz	Differential Phase Length Method
Dissipation Factor (Tan δ)	0.0012	Z	–	10 GHz / 23°C	IPC-TM-650 2.5.5.5
Thermal Coefficient of εr	+12	Z	ppm/°C	10 GHz, 0–100°C	IPC-TM-650 2.5.5.5
Volume Resistivity	10⁶	Z	MΩ·cm	A	ASTM D257
Surface Resistivity	10⁷	Z	MΩ	A	ASTM D257
Tensile Modulus	828 (120)	X,Y	MPa (kpsi)	23°C	ASTM D638
Ultimate Stress	6.9 (1.0)	X,Y	MPa (kpsi)	–	–
Ultimate Strain	7.3	X,Y	%	–	–
Compressive Modulus	2482 (360)	Z	MPa (kpsi)	–	ASTM D638
Moisture Absorption	0.02	–	%	D48/50	IPC-TM-650 2.6.2.1, ASTM D570
Thermal Conductivity	0.60	–	W/m/K	80°C	ASTM C518
CTE (-55 to 288°C)	16	X	ppm/°C	23°C / 50% RH	IPC-TM-650 2.4.41
	16	Y	ppm/°C
	24	Z	ppm/°C
Decomposition Temperature (Td)	500	–	°C	TGA	ASTM D3850
Density	2.1	–	g/cm³	–	ASTM D792
Specific Heat	0.93 (0.22)	–	J/g/K (BTU/lb/°F)	–	Calculated
Copper Peel Strength	8.9 (1.6)	–	lbs/in (N/mm)	–	IPC-TM-650 2.4.8
Flammability	V-0	–	–	–	UL 94
Lead-Free Process Compatible	YES	–	–	–	–

13. Summary

Rogers 2-Layer RT/duroid 6002 High Frequency PCB is a high-reliability, low-loss solution tailored for complex microwave, RF, and aerospace applications. This 0.8mm thick 2-layer PCB leverages Rogers’ RT/duroid 6002 CCL, delivering stable electrical performance, excellent dimensional stability, and superior PTH reliability. With Immersion Silver surface finish, compliance with IPC-Class-2 standards, and compatibility with various cladding options, it is optimized for demanding applications such as phased array antennas, radar systems, and space equipment. Widely available worldwide, it provides consistent performance and value for high-tech industries requiring ultra-low loss and temperature-stable PCB solutions.