2. Core Features of WL-CT330 Laminate

1. Dielectric Constant (DK): 3.30±0.06 at 10GHz
2. Dissipation Factor (Df): 0.0026 at 10GHz
3. Glass Transition Temperature (Tg): >280℃
4. Thermal Conductivity: 0.59 W/m·K
5. Thermal Resistance: T260 >60 mins, T288 >20 mins (typical for the series)
6. Peel Strength (Min.): 0.85 N/mm (≈9.7 lbs/inch) for 1OZ ED Copper
7. Coefficient of Thermal Expansion (CTE): X=15 ppm/℃, Y=13 ppm/℃, Z=39 ppm/℃
8. Moisture Absorption: 0.05% (max.)
9. Flammability Rating: UL 94-V0
10. Volume/Surface Resistivity: 5×10⁹ Mohm·cm/Mohm
11. Stable Temperature Coefficient of DK (TcDk)

3. Key Advantages of WL-CT330 High Frequency PCB

1. Superior Processability: Processed similarly to FR4 materials, simpler and easier to fabricate compared to PTFE substrates, reducing production complexity and costs
2. Excellent Thermal Reliability: High Tg (>280℃) and strong thermal resistance, maintaining dimensional stability and hole copper quality at high temperatures
3. Cost-Effective: Serves as a cost-efficient alternative to traditional high-frequency materials, suitable for high-volume commercial production
4. Lead-Free Compatibility: Supports lead-free assembly (260℃), complying with international environmental standards
5. Stable Electrical Performance: Low dielectric loss, consistent DK tolerance, and stable temperature characteristics, ensuring reliable signal transmission in high-speed RF designs

4. Detailed PCB Construction Parameters

Construction Item	Specification
Base material	WL-CT330 + High Tg FR-4 (S1000-2M)
Layer count	4-layer
Board dimensions	165mm x 96.5mm = 1PCS, +/- 0.15mm
Minimum Trace/Space	5/6 mils
Minimum Hole Size	0.25mm
Blind vias	No
Finished board thickness	2.7mm
Finished Cu weight (inner/outer layers)	1 oz (1.4 mils)
Via plating thickness	20 μm
Surface finish	Immersion Gold
Top Silkscreen	Black
Bottom Silkscreen	No
Top Solder Mask	Green
Bottom Solder Mask	Green
Pre-shipment Electrical Test	100% Electrical test used

5. PCB Stackup Configuration

4-layer rigid PCB, with the following layer structure (from top to bottom):

1. Copper_layer_1 - 35 μm
2. WL-CT - 1.524 mm (60mil)
3. Copper_layer_2 - 35 μm
4. Prepreg - 1080 RC63% +7628 (43%) - 0.254mm (10mil)
5. Copper_layer_3 - 35 μm
6. S1000-2M - 0.8 mm (31.5mil)
7. Copper_layer_4 - 35 μm

6. PCB Technical Statistics

1. Components: 45 | Total Pads: 225 | Thru Hole Pads: 126
2. Top SMT Pads: 59 | Bottom SMT Pads: 40 | Vias: 63 | Nets: 9

7. Artwork Format Supplied

Gerber RS-274-X, the industry-standard format for PCB fabrication, ensuring seamless compatibility with most manufacturing equipment and processes.

8. Accepted Quality Standard

Complies with IPC-Class-2 standards, guaranteeing consistent quality, reliability, and performance for commercial, industrial, and high-tech applications.

9. Global Availability

Available worldwide, supported by reliable supply chains to meet global customers’ production needs and ensure timely delivery.

10. Typical Application Scenarios

1. 5G/6G base stations and phased array antennas
2. Automotive radar (ADAS, V2X) systems
3. Satellite communication and navigation equipment
4. Aerospace/defense radar (early warning, airborne)
5. RF power amplifiers and transceivers
6. High-speed backplanes and server/networking gear

11. WL-CT Series CCL Introduction

The WL-CT series laminate is a line of organic polymer ceramic-filled, woven fiberglass, copper-clad plates (CCL), which belongs to a thermosetting resin system. The dielectric layer is composed of hydrocarbon resin, ceramics, and fiberglass cloth, delivering low-loss performance that meets high-frequency design requirements. Its PCB processability can refer to FR4 material processing, which is simpler and easier compared to PTFE material processing. The WL-CT series is capable of replacing similar foreign products, offering a cost-effective high-frequency material solution.

11.1 Key Properties of WL-CT Series CCL

1. Composed of hydrocarbon resin, composite ceramics, and fiberglass reinforcement, featuring low loss and high-temperature resistance
2. Stable temperature characteristics of dielectric constant and loss, with a low thermal expansion coefficient
3. High TG value (>280℃), maintaining dimensional stability and hole copper reliability at high temperatures
4. Available dielectric constants: 3.00, 3.30, 3.38, 3.48, 4.10, and 6.15, catering to diverse design needs
5. Compatible with ED copper foil or reverse RTF copper foil; RTF copper foil offers excellent PIM indicators, reduced conductor and insertion losses, and good adhesion with adhesive backing (increasing thickness by 0.018mm/0.7mil)

11.2 Processability & Versatility

1. Processed using FR4 board process technology, supporting multiple pressing operations, suitable for multi-layer, high multi-layer, and backboard processing
2. Excellent machinability in processing dense holes and fine lines, adapting to complex PCB designs
3. Can be paired with aluminum substrates to form aluminum-based high-frequency materials, expanding application scope

11.3 Core Features & Benefits

1. Low Loss & Stable DK: Low dielectric constant tolerance and ultra-low dissipation factor, ensuring reliable signal transmission in high-frequency applications
2. Superior Processability: Hydrocarbon ceramic thermosetting resin system, easier to process than PTFE, reducing production costs
3. Excellent Thermal Performance: High Tg (>280℃) and good thermal conductivity, suitable for high-power and high-temperature applications
4. Copper-Matched CTE: X/Y direction CTE equivalent to copper foil, small Z direction CTE, ensuring dimensional thermal stability and hole copper reliability
5. Cost-Effective & High-Volume: Commercial-grade product, suitable for mass production, offering cost savings compared to imported alternatives
6. Enhanced Reliability: Excellent irradiation resistance and low outgassing performance, meeting aerospace vacuum outgassing requirements and maintaining stable properties in harsh environments

12.DataSheet

Product Characteristics	Test Conditions	Unit	TF600
Dielectric Constant	10 GHz	/	6.0 ± 0.12
Dielectric Constant Tolerance	/	/	±2%
Dissipation Factor	10 GHz	/	0.0010
Temperature Coefficient of Dielectric Constant	-55 ºC ~ 150 ºC	ppm/℃	-210
Peel Strength (1 oz, normal condition)	-	N/mm	>0.6
Peel Strength (1 oz, after cyclic humidity & heat)	-	N/mm	>0.4
Volume Resistivity	Normal condition, 500 V	MΩ·cm	>1×10⁹
Surface Resistance	Normal condition, 500 V	MΩ	>1×10⁷
Coefficient of Thermal Expansion (X, Y, Z)	-55 ºC ~ 150 ºC	ppm/℃	60, 60, 80
Water Absorption	20±2℃, 24 h	%	≤0.05
Long-Term Operating Temperature	Thermal shock chamber	℃	-80 ~ 200
Material Composition	-	-	Polytetrafluoroethylene (PTFE), ceramic, with ED copper foil

13. Summary

1. WL-CT330 4-Layer High Frequency PCB is a cost-effective, high-performance solution tailored for high-speed RF, microwave, and high-tech applications.
2. Combining WL-CT330 high-frequency laminate and High Tg FR-4 (S1000-2M), this 2.7mm thick 4-layer PCB delivers stable dielectric performance, ultra-low loss, and excellent thermal reliability.
3. It features immersion gold surface finish, complies with IPC-Class-2 standards, and offers FR4-like processability, supporting lead-free assembly and high-volume production.
4. Widely applicable to 5G/6G, automotive radar, satellite communication, and aerospace/defense fields, providing reliable long-term performance and value for global customers.